公开(公告)号：KR1020120064038A

公开(公告)日：2012-06-18

申请号：KR1020110130164

申请日：2011-12-07

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 사까이미쯔히로 ,  가지와라히로노부 ,  도노까와가쯔히로

IPC: H01L21/027 ,  H01L21/302

CPC classification number: H01L21/302 ,  G03F7/32 ,  G03F7/70916 ,  H01L21/0274

Abstract: PURPOSE: A developer, a developing coating system including the same, and a developing process are provided to prevent the degradation of yield by suppressing the damage of a base layer due to a developing solution. CONSTITUTION: A transferring device sends back a substrate(S). A developing solution supplier supplies a developing solution(DL) to the substrate which is returned by the transferring device. A developing region is installed at the downstream side of a returning direction of the substrate. The substrate which is covered with the developing solution at the developing region is returned by the transferring device. A washing solution supplier supplies a washing solution to the substrate which exists in the developing region.

Abstract translation: 目的：提供一种显影剂，包含其的显影涂布体系和显影方法，以通过抑制由于显影液而导致的基底层的损伤来防止产率的降低。 构成：转印装置发回衬底（S）。 开发解决方案供应商向转移装置返回的基板提供显影液（DL）。 显影区域安装在基板返回方向的下游侧。 在显影区域被显影液覆盖的基板由转印装置返回。 洗涤液供应商将洗涤液供给存在于显影区域中的基材。

公开(公告)号：KR1020080068581A

公开(公告)日：2008-07-23

申请号：KR1020080005483

申请日：2008-01-18

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 사까이미쯔히로 ,  미야자끼가즈히또 ,  시오자끼겐지 ,  고메다히로시

IPC: H01L21/677

CPC classification number: H01L21/67706 ,  B65G39/02 ,  B65G49/063 ,  H01L21/67736 ,  H01L21/68714 ,  H01L21/68742

Abstract: A substrate conveying apparatus is provided to improve through-put of substrate processing by using a small substrate conveyer. A substrate conveyer receives a substrate from an arm supporting the substrate, and conveys the substrate to a processing device. The substrate conveyer includes roller conveyers(120) and an elevator(118). The roller conveyers convey a substrate in a horizontal direction, and are disposed in two stages. The elevator elevates the roller conveyers of the two stages. A vessel(110) receives the roller conveyers of the two stages and the elevator. Carry holes(111,115) are formed in a side surface of the vessel, and carries the substrate. Discharge hole(112,116) discharge the substrate. An inner temperature of the processing device is greater than that of the vessel. An exhaust hole(113) is formed in a lower side of the vessel, and exhausts atmosphere in the vessel.

Abstract translation: 提供基板输送装置，以通过使用小的基板输送器来改善基板处理的通过。 基板输送机从支撑基板的臂接收基板，并将基板输送到处理装置。 基板输送机包括辊式输送机（120）和电梯（118）。 辊式输送机在水平方向上输送基板，分两个阶段布置。 电梯提升了两级的辊式输送机。 容器（110）容纳两级的辊式输送机和电梯。 携带孔（111,115）形成在容器的侧面，并承载基板。 放电孔（112,116）放电衬底。 处理装置的内部温度大于容器的内部温度。 在容器的下侧形成排气孔（113），排出容器内的气氛。

公开(公告)号：KR1020070006598A

公开(公告)日：2007-01-11

申请号：KR1020060063665

申请日：2006-07-07

Applicant: 도쿄엘렉트론가부시키가이샤

Inventor： 사까이미쯔히로

IPC: H01L21/68 ,  H01L21/027 ,  H01L21/02

CPC classification number: G03F7/70733 ,  G03F7/115 ,  G03F7/168 ,  G03F7/70758 ,  H01L21/67098 ,  H01L21/67706

Abstract: A substrate processing apparatus is provided to strengthen adhesion of a resist in a photolithography and to reduce HMDS(Hexamethyldisilazane) consumption by improving processing amount of an adhesion process. A thermal process unit(26) prepares a flow transfer path(32) to a horizontal direction in parallel with a process line(A). A dehydration bake unit(DHP)(38), an adhesion unit(AD)(40), and a cooling unit(COL)(42) are installed along a transfer path from the upper side. The adhesion has an HMDS nozzle(98), an upper cover(100), and a lower cover(102). The HMDS nozzle is installed around an entrance of the adhesion unit. The upper cover is extended from a lower end of the HMDS nozzle to an exit of the adhesion unit to have a predetermined gap with respect to a substrate(G) on the transfer path. The lower cover is extended under the transfer path to face the HMDS nozzle and the upper cover.

Abstract translation: 提供了一种基板处理装置，用于增强光刻胶中的抗蚀剂的粘附性，并通过改善粘合过程的处理量来减少HMDS（六甲基二硅氮烷）消耗。 热处理单元（26）与处理线（A）平行地制备到水平方向的流动传送路径（32）。 脱水烘烤单元（DHP）（38），粘附单元（AD）（40）和冷却单元（COL）（42））沿着从上侧的传送路径安装。 粘合剂具有HMDS喷嘴（98），上盖（100）和下盖（102）。 HMDS喷嘴安装在粘附单元的入口周围。 上盖从HMDS喷嘴的下端延伸到粘合单元的出口，以相对于传送路径上的基底（G）具有预定的间隙。 下盖在传送路径下延伸以面对HMDS喷嘴和上盖。