Abstract:
An apparatus for treating a substrate is provided to effectively perform a cleaning process and to realize the cost reduction by preventing attachment of impurities to the substrate. An apparatus for treating a substrate includes a conveying means(111) and a cleaning nozzle(116). A substrate(G) to be processed is loaded on a convey passage(32). The conveying means conveys a substrate to be processed to a predetermined direction through the convey passage. The cleaning nozzle supplies cleaning solution to an upper surface of the substrate to be processed. The convey passage includes a horizontal portion conveying the substrate to be process in a horizontal state and an oblique portion forms an upward slope of a predetermined angle from the horizontal portion. The cleaning nozzle is disposed in an upward direction of the oblique portion.
Abstract:
본 발명의 과제는 유착 처리에 있어서 처리량 내지 택트의 향상, HMDS 소비량의 절감, 장치 구성의 간이화, 저비용화 및 파티클의 해소를 실현 내지 달성하는 것이다. 이 열적 처리부(26)는 프로세스 라인(A)과 평행한 수평 방향(X 방향)으로 평류 반송로(32)를 마련하고, 이 반송로(32)를 따라서 상류측으로부터 차례로 탈수 베이크 유닛(DHP)(38), 유착 유닛(AD)(40) 및 냉각 유닛(COL)(42)을 설치하고 있다. 유착 유닛(AD)(40)은 유닛 입구 부근에 설치되는 긴형의 HMDS 노즐(98)과, 이 노즐(98)의 하단부 부근의 위치로부터 유닛 출구 부근의 위치까지 반송로(32) 상의 기판(G)과 소정의 갭을 두고 연장되는 상부 커버(100)와, 이들 HMDS 노즐(98) 및 상부 커버(100)와 마주 보고 반송로(32)의 아래로 연장되는 하부 커버(102)를 갖고 있다. 기판 처리 장치, 평류 반송로, 유착 유닛, 탈수 베이크 유닛, HMDS 노즐
Abstract:
A substrate processing apparatus is provided to improve throughput and reduce foot print of a dehydration bake processing section by performing the dehydration bake processing in a shorter transfer path than the conventional hydration bake unit using a heat plate heater. A substrate processing apparatus, which performs a hydrophobic process to a processed substrate(G), comprises a transfer unit(80), a dehydration bake unit(38) and an adhesion processing unit(98). The dehydration bake unit dehydrates the surface of the substrate, and heats the substrate by irradiating infrared rays from a heating element(84). The adhesion processing unit hydrates the substrate as hydrophobic by exposing the processed surface of the processed substrate.
Abstract:
PURPOSE: A coating processing apparatus is provided to reduce the stay time of an object substrate and the tack time of a process operation. CONSTITUTION: A nozzle(31) includes an outlet extended in the width direction of an object substrate(G). The nozzle discharges a process solution from the outlet to the object substrate. A nozzle transfer unit(32) moves the nozzle upwardly or downwardly. A nozzle maintenance unit(35) is installed in the lower part of a substrate transfer path(4) and controls the outlet of the nozzle. A space formation unit(21,22,23A,23B,30) forms an empty space in the upper and the lower part of a process stage. [Reference numerals] (32) Nozzle transfer unit
Abstract:
A reduced-pressure drying apparatus is provided to inhibit the production of the transfer traces of a substrate contact portion at a coating layer on a substrate minimally. A chamber(106) of a reduced-pressure drying unit(46) is formed by a comparatively flat rectangular body. A space is formed at the inside of the chamber so that a substrate(G) is received. In the carry-in and out direction of the chamber, inlet(110) and outlet(112) with a slit shape are formed at a pair of opposite sidewalls of the chamber. The substrate passes through the inlet and outlet horizontally and narrowly. Gate members(114,116) are attached at the outer wall of the chamber and open and close the inlet and outlet. The upper portion or upper cover of the chamber is removable. Each gate member includes a cover for closing tightly the inlet and outlet with a slit shape.
Abstract:
PURPOSE: An apparatus and a method for forming a film are provided to reduce a footprint and the length of a process line at the same time and to improve productivity. CONSTITUTION: A coat process unit(6) horizontally transfers a substrate(G) and sprays a coating solution at the same time. The coating solution is discharged from a nozzle having a long outlet to the substrate. A first thermal unit(11) heats the substrate including a coating layer with a first heating temperature. A second thermal unit(12) heats the substrate with a second heating temperature. A drying buffer unit(7) sprays gas to the coating layer in order to evaporate a solvent formed on the coating film.
Abstract:
A substrate buffer device, a method of buffering a substrate, a substrate processing apparatus, and a computer readable storage medium are provided to prevent the dispersion of particles and to improve a throughput. A substrate buffer device includes a shelf portion(5), an elevator, a controller, a conveyor, and a detector(105). The shelf portion is moved to a conveying line. The shelf portion includes plural loading frames for loading a substrate to the conveying line. The elevator elevates the shelf portion to move one of the plural loading frames to the conveying line. The controller controls an elevation of the shelf portion by the elevator based on a detection signal of the detector. The conveyor conveys the substrate along a conveying direction when the plural loading frames are moved to the conveying line. The detector is provided at an upstream of the conveying direction to be spaced apart from the loading frames, and detects the substrate conveyed to the conveying line.
Abstract:
기판버퍼장치(36)는반송라인(A)에진출가능하고, 또한반송라인(A)을반송된기판(G)을적재가능한적재대(5a 내지 5f)를상하로복수단갖는선반부(5)와, 선반부(5)를승강시켜적재대(5a 내지 5f) 중어느하나를반송라인(A)에진출시키는승강기구(6)를구비하고, 각적재대(5a 내지 5f)는반송라인(A)에진출하였을때에, 기판(G)을반송방향을따라반송하는컨베이어기구(50a 내지 50f)를갖고반송라인(A)의일부로서기능하고, 반송라인(A)에진출하고있는적재대(5a)에반송라인(A)을반송되어온 기판(G)을적재하고, 승강기구(6)에의해선반부(5)가승강되어기판(G)을적재대(5a)와함께반송라인(A)으로부터퇴피시킨다.
Abstract:
PURPOSE: A processing stage apparatus and a coating processing apparatus using the same are provided to prevent the contamination of an object substrate due to the maintenance process of a nozzle. CONSTITUTION: A substrate receiving part(2) includes a first substrate transfer unit(5B) which horizontally moves a substrate(G), and a first reciprocation unit(10). A first reciprocation unit moves the first substrate transfer unit in a substrate transfer direction. A substrate process unit includes a stage(15), a second substrate transfer unit(16), and a second reciprocation unit(24,25). A second substrate transfer unit moves up and down on the loading surface of a stage. A second reciprocation unit elevates the second substrate transfer unit on the loading surface of the stage. A substrate discharging unit includes a third substrate transfer part(29) and a third reciprocation unit(30).