Abstract:
A substrate processing apparatus is provided to reduce costs required for the apparatus and improve productivity when processing plural processed substrates. A conveyance unit horizontally conveys a processed substrate(G) on a conveyance path as upwardly placing the processed substrate. A chamber unit(1,2,3) is installed on the conveyance path, and performs drying processing for the substrate carried by the conveyance unit. The chamber unit includes an air supply unit(81a,81b,81c) installed in a downstream side of a substrate conveyance direction, and an exhausting unit(82a,82b,82c) installed in an upstream side of the substrate conveyance direction or includes an air supply unit installed in an upstream side of the substrate conveyance direction, and an exhausting unit installed in a downstream side of the substrate conveyance direction. Drying gas is supplied by the air supply unit. The supplied drying gas is exhausted by the exhausting unit. Therefore, a drying gas flow contacted with an upper surface of the substrate conveyed into the chamber unit is formed.
Abstract:
본 발명의 과제는 직선적으로 연장되는 왕복로의 프로세스 라인을 따라서 복수의 처리 유닛을 프로세스 플로우의 순으로 배열하여 배치하는 인라인형 시스템에 있어서 전체 길이 사이즈의 단축화, 또는 택트 타임 단축화를 효율적으로 실현하는 것이다. 이 도포 현상 처리 시스템(10)에 있어서는, 카세트 스테이션(C/S)(14)과 왕로의 프로세스 라인(A)과 인터페이스 스테이션(I/F)(18)과 귀로의 프로세스 라인(B)으로 둘러싸여 X 방향으로 똑바로 연장되는 내부(courtyard)의 스페이스(NS)가 형성된다. 이 내부 스페이스(NS)에, 제3 군의 유닛으로서 2대의 감압 건조 유닛(66L, 66R)이 서로 마주 보고 소정의 위치에 각각 설치되는 동시에, 양 유닛(66L, 66R) 사이에 1대의 반송 장치(68)가 설치된다. 처리 시스템, 감압 건조 유닛, 반송 장치, 카세트 스테이션, 인터페이스 스테이션
Abstract:
PURPOSE: A processing system is provided to short a total length size by arranging a processing unit in a process flow order. CONSTITUTION: A processing system comprises a first process line, a second process line, a processing unit, and a first transfer system(22) of a third group. The first process line arranges the processing unit of the first group in a row through a transfer system unit. The second process line arranges the processing unit of the second group in a row through a transfer system unit. The second process line forms the first process line and an internal space. The processing unit of a third group is arranged in the internal space. The first transfer system carries the substrate from the processing unit into a substrate transfer unit.
Abstract:
A substrate buffer device, a method of buffering a substrate, a substrate processing apparatus, and a computer readable storage medium are provided to prevent the dispersion of particles and to improve a throughput. A substrate buffer device includes a shelf portion(5), an elevator, a controller, a conveyor, and a detector(105). The shelf portion is moved to a conveying line. The shelf portion includes plural loading frames for loading a substrate to the conveying line. The elevator elevates the shelf portion to move one of the plural loading frames to the conveying line. The controller controls an elevation of the shelf portion by the elevator based on a detection signal of the detector. The conveyor conveys the substrate along a conveying direction when the plural loading frames are moved to the conveying line. The detector is provided at an upstream of the conveying direction to be spaced apart from the loading frames, and detects the substrate conveyed to the conveying line.
Abstract:
The objective of the present invention is to conveniently and efficiently suppress the generation of frames at the peripheral part of the coating film (RM) formed at a substrate (G) in a drying process and to improve uniformity in the thickness of the film after drying. In a process for suppressing the generation of a frame, when solvent is drying at each part of the coating film (RM), which is in a liquid state, of the substrate (G) in an infrared radiation chamber in a drying process, the liquid flows from the central part to the peripheral part at the coating film (RM) due to the high drying speed of the solvent at the peripheral part where the surface in contact with the outer part is larger than the central part of the coating film, and also certain temperature difference between the central part and the peripheral part of the coating film (RM) is generated due to the local infrared radiation for the peripheral part of the coating film (RM). Therefore, the generation of a frame is prevented or suppressed, since surface tension between the central part and the peripheral part of the coating film (RM) is balanced.
Abstract:
기판버퍼장치(36)는반송라인(A)에진출가능하고, 또한반송라인(A)을반송된기판(G)을적재가능한적재대(5a 내지 5f)를상하로복수단갖는선반부(5)와, 선반부(5)를승강시켜적재대(5a 내지 5f) 중어느하나를반송라인(A)에진출시키는승강기구(6)를구비하고, 각적재대(5a 내지 5f)는반송라인(A)에진출하였을때에, 기판(G)을반송방향을따라반송하는컨베이어기구(50a 내지 50f)를갖고반송라인(A)의일부로서기능하고, 반송라인(A)에진출하고있는적재대(5a)에반송라인(A)을반송되어온 기판(G)을적재하고, 승강기구(6)에의해선반부(5)가승강되어기판(G)을적재대(5a)와함께반송라인(A)으로부터퇴피시킨다.
Abstract:
PURPOSE: A developer, a developing coating system including the same, and a developing process are provided to prevent the degradation of yield by suppressing the damage of a base layer due to a developing solution. CONSTITUTION: A transferring device sends back a substrate(S). A developing solution supplier supplies a developing solution(DL) to the substrate which is returned by the transferring device. A developing region is installed at the downstream side of a returning direction of the substrate. The substrate which is covered with the developing solution at the developing region is returned by the transferring device. A washing solution supplier supplies a washing solution to the substrate which exists in the developing region.
Abstract:
PURPOSE: A resist coating and developing processing system is provided to efficiently realize the shortening of tact time or total length size by arranging a plurality of treatment units in an order of a process flow. CONSTITUTION: An inline type resist coating and developing processing system(10) for performing a series of processing including resist coating and developing processes on an untreated substrate by connecting a plurality of processing units as a process flow, comprises a proceeding process line and a returning process line. The proceeding process line arranges at least a cleaning part(26), a resist coating part(28), and a first drying/heat treatment part(30) in a longitudinal direction of a system in a process order. The returning process line arranges at least a developing part(92) and a second drying/heat treatment part in a second direction opposite to the first direction.