Abstract:
The present invention relates to a negative photosensitive resin composition including an organosiloxane polymer and a hardened film prepared therefrom. The negative photosensitive resin composition includes: an rganosiloxane polymer; an allyl-based compound having at least one ethylenically unsaturated double bond, a vinyl-based compound, or a mixture thereof; and a photopolymerization initiator. The hardened film prepared using the negative photosensitive resin composition has improved physical properties like pattern developing properties, surface hardness, heat resistance, light transmittance, acid resistance, alkali resistance, and solvent resistance, thereby being able to be used as a protective film for electronic parts.
Abstract:
PURPOSE: A low-temperature curable resin composition is provided to have extremely short curing time, and to form a uniform and stable coating film, thereby preventing staining. CONSTITUTION: A low-temperature curable resin composition comprises an organic siloxane polymer which includes a siloxane unit having one or more functional group selected from an oxetane group, an epoxy group, a glycidyl group, a hydroxy group, an amine group, and a thiol group; an acrylate-based compound with one or more ethylenically unsaturated double bond; an oligomer which includes one or more epoxy groups; a silane-based coupling agent; an acid generator; and an organic solvent. The weight average molecular weight of the organic siloxane polymer is 1,000-100,000.
Abstract:
The present invention relates to an organic-inorganic hybrid siloxane-based polymer and a positive photosensitive resin composition including the same. The organic-inorganic hybrid siloxane-based polymer includes one or more of structural units (A) and one or more of structural units (B). Structural units (A) are derived from a silane-based compound selected from a group constituted by a silane compound represented by chemical formula (1), its hydrolyzate and a condensate of the hydrolyzate. Structural units (B) are derived from an organometallic compound represented by chemical formula (2). The weight-average molecular weight of the siloxane-based inorganic polymer compound is 500 to 200,000. A cured film produced by using a photosensitive resin composition including the siloxane-based inorganic polymer compound is highly heat-resistant and highly transparent and has excellent physical properties such as sensitivity, hardness, adhesion to a substrate, and the refractive index.
Abstract:
PURPOSE: A photosensitive resin composition is provided to form a uniform and stable coating film without stain in spin coating on a substrate, and to facilitate the pattern formation using a developer. CONSTITUTION: A photosensitive resin composition comprises (1) an organic siloxane polymer, (2) an acrylate compound having at least one ethylenic unsaturated double bond, (3) a photopolymerization initiator, (4) a silane coupling agent, (5) a surfactant, and (6) an organic solvent. The organic siloxane polymer includes a siloxane unit (a) having (meth)acrylate group as a polymerization unit; and at least one siloxane unit a siloxane unit selected from a siloxane unit (b) having at least one functional group selected from the group consisting of epoxy, oxetane, hydroxy and thiol, and a siloxane unit (c) (however, the siloxane unit is different from the siloxane units (a) and (b)) having at least one functional group selected from the group consisting of C_1-C_9 alkyl, C_3-C_14 cycloalkyl, C_6-C_14 aryl, C_7-C_14 alkylaryl and C_7-C_14 arylalkyl.
Abstract:
PURPOSE: A thermosetting resin composition including an organic siloxane polymer is provided to produce a film with excellent flatness, surface hardness, optical transmittance rate, adhesion with a substrate, and chemical resistance. CONSTITUTION: A thermosetting resin composition contains an organic siloxane polymer, a polymer or oligomer containing more than one epoxy group, an acid generator, and an organic solvent. The organic siloxane polymer contains 0.01-0.90 mol of siloxane unit with more than one functional group selected from an oxetane group or an epoxy group for the total polymerization unit, and has the weight-average molecular weight of 1,000-60,000. 1-60 parts by weight of polymer or oligomer containing more than one epoxy group is mixed with 100 parts by weight of organic siloxane polymer.