Abstract:
본 발명은 고내열성 네거티브형 감광성 수지 조성물 및 이로부터 제조된 경화막에 관한 것으로, (a) (a-1) (메트)아크릴레이트기를 갖는 실록산 단위를 포함하는 유기실록산 중합체; (a-2) 페닐기를 갖는 실록산 단위를 포함하는 유기실록산 중합체; 및 (b) 광중합 개시제를 포함하고, 에틸렌성 불포화 이중결합을 갖는 아크릴레이트계 화합물을 포함하지 않는 본 발명의 감광성 수지 조성물로부터 제조된 경화막은 고온 경화조건에서 우수한 내열성을 가져 크랙 발생이 억제됨으로써 평탄막 구현이 가능하고 황변 등으로 인한 광 투과율 저하를 나타내지 않으므로, 전자부품의 보호막 등으로서 유용하게 사용될 수 있다.
Abstract:
본 발명은 고내열성 네거티브형 감광성 수지 조성물 및 이로부터 제조된 경화막에 관한 것으로, (a) (a-1) (메트)아크릴레이트기를 갖는 실록산 단위를 포함하는 유기실록산 중합체; (a-2) 페닐기를 갖는 실록산 단위를 포함하는 유기실록산 중합체; 및 (b) 광중합 개시제를 포함하고, 에틸렌성 불포화 이중결합을 갖는 아크릴레이트계 화합물을 포함하지 않는 본 발명의 감광성 수지 조성물로부터 제조된 경화막은 고온 경화조건에서 우수한 내열성을 가져 크랙 발생이 억제됨으로써 평탄막 구현이 가능하고 황변 등으로 인한 광 투과율 저하를 나타내지 않으므로, 전자부품의 보호막 등으로서 유용하게 사용될 수 있다.
Abstract:
The present invention relates to a positive type photosensitive resin composition and a cured film manufactured thereby. The positive type photosensitive resin composition of the present invention comprises: copolymers (1) which are produced by making a compound represented by a chemical formula 1 with an alkali soluble copolymer including an organization unit (1-1) induced from an unsaturated monomer containing a carboxyl group, an organization unit (1-2) induced from an unsaturated monomer containing at least one epoxy group, an organization unit (1-3) induced from an unsaturated monomer containing a phenolic hydroxyl group and an organization unit (1-4) containing an unsaturated monomer different from the unsaturated monomer of (1-1) to (1-3); quinonediazide-based photoactive compounds (2); photoacid generators (3); and solvents (4). The positive type photosensitive resin composition of the present invention exhibits excellent sensitivity, high residual film rate after phenomenon and postcuring and provides high pattern formation, thereby being able to be usefully used in the manufacture of an insulation layer for a liquid crystal display.
Abstract:
PURPOSE: Photopolymerizable unsaturated resin is provided to provide a block-shielding spacer with excellent resolution and elastic restitution while having a low dielectric constant. CONSTITUTION: Photopolymerizable unsaturated resin is a product which is obtained by reacting an epoxy adduct, which is obtained by reacting epoxy resin indicated in chemical formula 1 with an unsaturated basic acid, with a polybasic acid anhydride. A photosensitive resin composition comprises the photopolymerizable unsaturated resin, a functional monomer which has one or more ethylenically unsaturated bonds, a polymerization initiator, a black organic pigment, and a solvent. The black organic pigment includes one or more selected from a group consisting of aniline black, lactam black, and perylene black.
Abstract:
The present invention relates to a positive photosensitive resin composition and a cured film manufactured therefrom. The positive photosensitive resin composition of the present invention comprises (1) a copolymer including (1-1) a constituent unit derived from carboxyl-containing unsaturated monomer, (1-2) a constituent unit derived from unsaturated monomer including at least one epoxy group, and (1-3) a constituent unit derived from divinyl monomer including acetal backbone; (2) a quinonediazide based photoactive compound; and (3) a photoacid generator. The positive photosensitive resin compound of the present invention has excellent sensitivity and a high retention rate after development and post-cure, and provides a high pattern formation, so as to be useful in manufacturing an insulator film for a liquid crystal display device.
Abstract:
The present invention relates to a negative-type photosensitive resin composition having high thermal resistance and high resolution containing an organic siloxane polymer and an acryl copolymer at the same time, and a hardened layer prepared therefrom. The negative-type photosensitive resin composition contains: (1) the organic siloxane polymer; (2) a random copolymer including (2-1) a structure unit induced from ethylene unsaturated carboxylic acid, ethylene unsaturated carboxylic acid anhydride, or a mixture thereof, and (2-2) a structure unit induced from an ethylene unsaturated compound with an aromatic ring; (3) an acrylate based compound with one or more ethylene unsaturated double bond; and (4) a photopolymerization initiator. The organic siloxane polymer includes: a siloxane unit (a) with a (meth)acrylate group as a polymerization unit; and a siloxane unit (b) with one or more functional groups selected from an epoxy group, an oxetane group, a hydroxy group, and a thiol group.
Abstract:
PURPOSE: A composition for a photo-sensitive resin, a low dielectric constant light shielding layer using the same, and a liquid crystal display device are provided to adjust the generation of stepped parts due to a thermal treating process. CONSTITUTION: A composition for a photo-sensitive resin includes a photopolymerizable unsaturated binder resin, an ethylenically unsaturated bond containing functional monomer, a polymerization initiator, a block organic mixed pigment, and a solvent. The photopolymerizable unsaturated binder resin is obtained by reacting an epoxy adduct and a polybasic acid anhydride. The epoxy adduct is obtained by adding unsaturated basic acid to an epoxy resin represented by chemical formula 1. A light shielding layer includes a film based on the composition.