Abstract:
The present invention relates to a negative-type photosensitive resin composition having high thermal resistance and high resolution containing an organic siloxane polymer and an acryl copolymer at the same time, and a hardened layer prepared therefrom. The negative-type photosensitive resin composition contains: (1) the organic siloxane polymer; (2) a random copolymer including (2-1) a structure unit induced from ethylene unsaturated carboxylic acid, ethylene unsaturated carboxylic acid anhydride, or a mixture thereof, and (2-2) a structure unit induced from an ethylene unsaturated compound with an aromatic ring; (3) an acrylate based compound with one or more ethylene unsaturated double bond; and (4) a photopolymerization initiator. The organic siloxane polymer includes: a siloxane unit (a) with a (meth)acrylate group as a polymerization unit; and a siloxane unit (b) with one or more functional groups selected from an epoxy group, an oxetane group, a hydroxy group, and a thiol group.
Abstract:
The present invention relates to a positive photosensitive resin composition and a hardened film prepared therefrom. The positive photosensitive resin composition includes: one or more compounds selected from a group consisting of an silane compound represented by chemical formula 1, its hydrolyzate, and condensate of the hydrolyzate; 1, 2-diazide compounds; and an amino-based silane coupling agent represented by chemical formula 2. The hardened film prepared using the photosensitive resin composition of the present invention has improved physical properties like adhesion on a silicon nitride (SiNx) substrate, pattern developing properties, heat resistance, and light transmittance, thereby being able to be used as a protective film for electronic parts.
Abstract:
The present invention relates to a negative photosensitive resin composition including an organosiloxane polymer and a hardened film prepared therefrom. The negative photosensitive resin composition includes: an rganosiloxane polymer; an allyl-based compound having at least one ethylenically unsaturated double bond, a vinyl-based compound, or a mixture thereof; and a photopolymerization initiator. The hardened film prepared using the negative photosensitive resin composition has improved physical properties like pattern developing properties, surface hardness, heat resistance, light transmittance, acid resistance, alkali resistance, and solvent resistance, thereby being able to be used as a protective film for electronic parts.
Abstract:
The present invention relates to an organic-inorganic hybrid siloxane-based polymer and a positive photosensitive resin composition including the same. The organic-inorganic hybrid siloxane-based polymer includes one or more of structural units (A) and one or more of structural units (B). Structural units (A) are derived from a silane-based compound selected from a group constituted by a silane compound represented by chemical formula (1), its hydrolyzate and a condensate of the hydrolyzate. Structural units (B) are derived from an organometallic compound represented by chemical formula (2). The weight-average molecular weight of the siloxane-based inorganic polymer compound is 500 to 200,000. A cured film produced by using a photosensitive resin composition including the siloxane-based inorganic polymer compound is highly heat-resistant and highly transparent and has excellent physical properties such as sensitivity, hardness, adhesion to a substrate, and the refractive index.