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公开(公告)号：KR1020150002199A
公开(公告)日：2015-01-07
申请号：KR1020130075745
申请日：2013-06-28
Applicant: 삼성전기주식회사
Inventor： 김선경
IPC: G06Q30/06
CPC classification number: G06Q30/0601 , G06F17/30377 , G06K17/0029
Abstract: 본 발명은 전자선반 레이블 시스템 및 그의 전자태그 업데이트 데이터 전송방법에 관한 것으로, 본 발명의 일 구현예에 따른 상기 전자선반 레이블 시스템은, 서버, 복수의 게이트웨이 및 복수의 전자태그를 포함하고, 상기 복수의 게이트웨이는, 상기 복수의 전자태그 중 적어도 하나의 전자태그를 포함하는 일군의 전자태그와 무선통신을 통해 연결되어 있으며, 상기 일군의 전자태그의 연결정보를 상기 서버로 전송하며, 상기 서버는 업데이트 정보를 제공받으면, 상기 업데이트 정보 및 상기 연결정보를 기초로 하여 업데이트 데이터를 생성하며, 상기 업데이트 정보 및 상기 연결정보를 기초로 상기 업데이트 데이터를 전송할 게이트웨이를 추출하고, 상기 추출된 게이트웨이로 상기 업데이트 데이터를 전송하고, 상기 복수의 전자태그는 상기 서버� �부터 상기 게이트웨이를 통해 상기 업데이트 데이터를 수신하여 기 저장된 상품정보 데이터를 변경한다.
Abstract translation: 本发明涉及一种电子货架标签系统及其电子标签更新数据传输方法。 根据本发明实施例的电子货架标签系统包括：服务器; 多个网关; 和多个电子标签。 网关通过无线通信连接到包括至少一个电子标签的电子标签组，并将电子标签组的连接信息发送到服务器。 服务器根据接收到更新信息的更新信息和连接信息生成更新数据，根据更新信息和连接信息提取网关发送更新数据，并将更新数据发送到所提取的网关。 电子标签通过网关从服务器接收更新数据来改变预存的产品信息数据。
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公开(公告)号：KR1020140027748A
公开(公告)日：2014-03-07
申请号：KR1020120093713
申请日：2012-08-27
Applicant: 삼성전기주식회사
Inventor： 김선경
IPC: G06K17/00
CPC classification number: G09F3/208 , G06K17/0022 , G09G2380/04 , H04L12/66
Abstract: The present invention relates to an electronic shelf label (ESL) system and a method for scanning a gateway of an ESL tag using the same. A method for scanning a gateway of an ESL tag according to the present invention lists up a number of gateways in order of signal intensity by scanning a number of gateway channels supported by an ESL system, and selects and accesses to a gateway with highest signal intensity among the listed up gateways, and stores data about the gateways listed up in order of signal intensity in a memory, and tries to access promptly to a gateway of the next highest signal intensity on the basis of the listed up data about the gateways stored in the memory in case there is a connection lost for the gateway of highest signal intensity under connection. By the present invention, a tag can access to a gateway rapidly by reducing the required time to search the total gateway channels, thus preventing the unnecessary consumption of the battery. [Reference numerals] (AA) Start; (BB) End; (S301) Tag is connected to gateway first; (S302) Scan multiple channels supported by ESL system; (S303) All channel search completed?; (S304) List up gateway in order of signal intensity; (S305) Select and connect gateway with highest signal intensity; (S306) Store data about multiple gateways listed up in order of signal intensity; (S307) Gateway disconnected?; (S308) Try to connect gateway with second highest signal intensity promptly on the basis of listed up data about stored multiple gateways
Abstract translation: 本发明涉及一种电子货架标签（ESL）系统以及使用该系统扫描ESL标签的网关的方法。 根据本发明的用于扫描ESL标签的网关的方法通过扫描由ESL系统支持的多个网关信道来列出信号强度的顺序的多个网关，并且选择并访问具有最高信号强度的网关 在列出的上行网关之间，根据存储器中的信号强度的顺序存储关于网关的数据，并根据列出的关于存储的网关的上行数据，迅速地访问下一个最高信号强度的网关 在连接中信号强度最高的网关存在连接丢失的情况下的存储器。 通过本发明，标签可以通过减少搜索总的网关信道所需的时间来快速地访问网关，从而防止电池的不必要的消耗。 （附图标记）（AA）开始; （BB）结束; （S301）标签首先连接到网关; （S302）扫描ESL系统支持的多个通道; （S303）所有频道搜索完成？ （S304）以信号强度顺序列出网关; （S305）选择并连接信号强度最高的网关; （S306）按照信号强度顺序存储关于多个网关的数据; （S307）网关断开？ （S308）根据列出的有关存储的多个网关的数据，尝试立即将网关与第二高信号强度连接
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公开(公告)号：KR100836657B1
公开(公告)日：2008-06-10
申请号：KR1020070018221
申请日：2007-02-23
Applicant: 삼성전기주식회사
IPC: H01L23/12
CPC classification number: H01L2224/04105 , H01L2224/12105 , H01L2224/19 , H01L2224/32145 , H01L2224/32245 , H01L2224/73267 , H01L2224/92244 , H01L2924/15153 , H01L25/073 , H01L23/3672 , H01L23/3735 , H01L23/481 , H01L24/10 , H01L24/26
Abstract: An electronic package and a manufacturing method thereof are provided to realize an SIP(system in package) by configuring a COC package and applying a build-up technology to the COC package to realize electrical connection. An other side plane of a first chip including an electric contact point at the one side plane is attached to a heat spreader(100). The other side plane of the second chip having the electric contact point at the one side plane is attached with the one side plane of the first chip, thus the second chip is stacked on the first chip(110). The first and the second chips are encapsulated by coating the heat spreader with an insulating member(120). A first via which is connected with the electric contact points is processed by punching the insulating member(130).
Abstract translation: 提供了一种电子封装及其制造方法，通过配置COC封装并将构建技术应用于COC封装以实现电连接来实现SIP（封装中的系统）。 在散热器（100）上安装有包括在一个侧面上的电接触点的第一芯片的另一侧面。 具有一个侧面上的电接触点的第二芯片的另一侧面与第一芯片的一个侧面相连，因此第二芯片堆叠在第一芯片110上。 通过用绝热构件（120）涂覆散热器来封装第一和第二芯片。 通过冲压绝缘构件（130）来处理与电接触点连接的第一通孔。
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公开(公告)号：KR1020140127600A
公开(公告)日：2014-11-04
申请号：KR1020130046144
申请日：2013-04-25
Applicant: 삼성전기주식회사
Inventor： 김선경
CPC classification number: G06F17/30005 , G06F17/30377
Abstract: 본 발명은 ESL 시스템에서의 업데이트 데이터 파싱 방법에 관한 것이다.
본 발명에 따른 ESL 시스템에서의 업데이트 데이터 파싱 방법은, 레거시 시스템으로부터 ESL 서버로 업데이트 데이터를 전송하는 단계; 업데이트 데이터를 ESL 서버에서 그대로 데이터베이스(DB)로 전달하는 단계; 데이터베이스(DB)에 의해 전달받은 업데이트 데이터를 파싱하여 각 항목에 매칭시켜 저장하는 단계; ESL 서버에서 데이터베이스(DB)에 ESL 태그로 전송하기 위한 업데이트 데이터를 요청하는 단계; 데이터베이스(DB)에 의해 전송용 데이터 형태로 업데이트 데이터를 파싱하여 ESL 서버로 전송하는 단계; 및 ESL 서버에 의해 데이터베이스(DB)로부터의 업데이트 데이터를 게이트웨이로 전송하는 단계를 포함한다.
이와 같은 본 발명에 의하면, 데이터베이스에의 저장 및 ESL 태그로의 전송용 업데이트 데이터의 파싱을 모두 데이터베이스에서 수행하도록 함으로써 업데이트 데이터 파싱에 소요되는 시간을 대폭 단축할 수 있다.Abstract translation: 本发明涉及用于解析电子货架标签（ESL）系统中更新数据的方法。 根据本发明的用于解析ESL系统中的更新数据的方法包括以下步骤：将遗留系统的更新数据发送到ESL服务器; 将来自ESL服务器的更新数据传送到数据库（DB）; 解析DB接收到的更新数据，将解析的数据与每个项目进行匹配，并存储; 由ESL服务器请求从DB更新要作为ESL标签发送的数据; 通过DB解析传输数据形式的更新数据，并将解析的数据发送到ESL服务器; 并且由ESL服务器将从DB接收到的更新数据发送到网关。 根据本发明，由于DB存储更新数据并解析作为ESL标签发送的更新数据，因此可以显着缩短解析更新数据所需的时间。
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公开(公告)号：KR101376935B1
公开(公告)日：2014-03-20
申请号：KR1020120122514
申请日：2012-10-31
Applicant: 삼성전기주식회사
Abstract: The present invention relates to a contactless electrical test device. The device includes: an electron supply unit which generates charged electrons on one surface of an examination target object in a vacuum space; an electron movement guide unit which is separated from the other surface of the examination target object and guides contactless movement of the charged electrons on the formerly-mentioned surface of the examination target object; a high voltage application unit which applies high voltage to the vacuum space and the electron movement guide unit for forming an electric field in order to move the electrons generated by the electron supply unit, make the electrons to be charged onto the formerly-mentioned surface of the examination target object, and move the electrons charged onto the formerly-mentioned surface of the examination target object through the latterly-mentioned surface of the examination target object to the electron movement guide unit; a current/voltage measurement unit which measures currents and voltages due to the flow of the electrons which are induced to move by the electron movement guide unit; and a control unit which determines whether to disconnect or short-circuit a plurality of patterns formed on the examination target object according to the electrical variation of the current and the voltage measured by the current/voltage measurement unit. By testing whether the examination target object is disconnected or short-circuited without contact, the present invention is able to prevent damage due to direct contact onto the examination target object and reduce the manufacturing costs of a probe and a jig, which are usually expensive. [Reference numerals] (113) Power unit; (130) Current/voltage measurement unit; (140) High voltage application unit; (150) Position adjustment unit; (160) Control unit
Abstract translation: 本发明涉及一种非接触式电气测试装置。 该装置包括：在真空空间中在检查对象物的一个表面上产生带电电子的电子供给单元; 电子移动引导单元，其与检查对象物体的另一个表面分离，并且引导被检测对象物体的前述表面上的带电电子的非接触运动; 向真空空间施加高电压的高电压施加单元和用于形成电场的电子移动引导单元，以便移动由电子供给单元产生的电子，使得电子被充电到前述表面 将检查对象物的前述表面上的电子通过检查对象物体的后述表面移动到电子移动引导部; 电流/电压测量单元，其测量由电子移动引导单元感应的电子的流动引起的电流和电压; 以及控制单元，其根据电流的电变化和由电流/电压测量单元测量的电压确定是否断开或短路形成在检查对象物体上的多个图案。 通过测试检查对象是否断开或短路而没有接触，本发明能够防止由于直接接触到检查对象物体而导致的损坏，并且降低了通常昂贵的探针和夹具的制造成本。 （附图标记）（113）动力单元; （130）电流/电压测量单元; （140）高压应用单元; （150）位置调整单元; （160）控制单元
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Patent Agency Ranking
公开(公告)号：KR100855626B1
公开(公告)日：2008-09-03
申请号：KR1020070053931
申请日：2007-06-01
Applicant: 삼성전기주식회사
IPC: H01L23/34
CPC classification number: H01L2224/04105 , H01L2224/12105 , H01L2224/19 , H01L2224/24145 , H01L2224/32145 , H01L2224/32245 , H01L2224/73267 , H01L2224/92244 , H01L2924/15153 , H01L2924/3512 , H01L23/3735 , H01L23/481 , H01L24/11 , H01L24/27 , H01L25/073
Abstract: A semiconductor package and a manufacturing method thereof are provided to reduce a total size thereof by stacking a plurality of semiconductor chips in a vertical direction. One surface of a first semiconductor chip(26) including a first connective terminal(27) is attached to one surface of a heat-radiating plate(20) including a through electrode(22) corresponding to the first connective terminal. The first semiconductor chip is encapsulated by coating an insulator(30) on one surface of the heat-radiating plate. A second connective terminal(29) is formed on one surface of a second semiconductor chip(28). The other surface of the second semiconductor chip is attached to the other surface of the heat-radiating plate. The second semiconductor chip is encapsulated by coating the insulator on the other surface of the heat-radiating plate. A first via(36) is formed by punching the insulator coated on the other surface of the heat-radiating plate. The first via is electrically connected to the first and second connective terminals.
Abstract translation: 提供半导体封装及其制造方法，以通过在垂直方向堆叠多个半导体芯片来减小其总尺寸。 包括第一连接端子（27）的第一半导体芯片（26）的一个表面附接到包括对应于第一连接端子的通孔（22）的散热板（20）的一个表面。 通过在散热板的一个表面上涂覆绝缘体（30）来封装第一半导体芯片。 第二连接端子（29）形成在第二半导体芯片（28）的一个表面上。 第二半导体芯片的另一个表面附接到散热板的另一个表面。 第二半导体芯片通过将绝缘体涂覆在散热板的另一个表面上来封装。 通过对涂覆在散热板的另一个表面上的绝缘体进行冲压来形成第一通孔（36）。 第一通孔电连接到第一和第二连接端子。
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公开(公告)号：KR100851072B1
公开(公告)日：2008-08-12
申请号：KR1020070020937
申请日：2007-03-02
Applicant: 삼성전기주식회사
CPC classification number: H01L24/19 , H01L23/5389 , H01L24/24 , H01L24/28 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/97 , H01L25/0657 , H01L2224/04105 , H01L2224/12105 , H01L2224/20 , H01L2224/211 , H01L2224/24227 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/73267 , H01L2224/82039 , H01L2224/83101 , H01L2224/92 , H01L2224/92244 , H01L2224/97 , H01L2225/0651 , H01L2225/06524 , H01L2225/06572 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01076 , H01L2924/01078 , H01L2924/078 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/351 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: An electronic package and a manufacturing method thereof are provided to perform a stable handling operation in a semiconductor chip mounting process by using a build-up layer instead of a solder bump. A PCB(Printed Circuit Board) including a first chip mounted on one side thereof is provided(100). An electrical contact is formed on one side of a second chip. The other side of the second chip including the electrical contact is attached to the other side of the PCB(110). An insulating material is coated on the other side of the PCB to encapsulate the second chip(120). A first via connected electrically to the electrical contact is processed by punching the insulating material(130). A build-up layer is laminated on the insulating material. A second via connected electrically to the first via is processed by punching the build-up layer(140).
Abstract translation: 提供电子封装及其制造方法，以通过使用积聚层代替焊料凸块来在半导体芯片安装工艺中执行稳定的处理操作。 提供了包括安装在其一侧上的第一芯片的PCB（印刷电路板）（100）。 在第二芯片的一侧形成电接触。 包括电触头的第二芯片的另一侧附接到PCB（110）的另一侧。 绝缘材料涂覆在PCB的另一侧以封装第二芯片（120）。 通过冲压绝缘材料（130）来处理与电接触件电连接的第一通孔。 堆积层层压在绝缘材料上。 通过冲压积层（140）来处理与第一通孔电连接的第二通孔。
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公开(公告)号：KR100691282B1
公开(公告)日：2007-03-12
申请号：KR1020050088225
申请日：2005-09-22
Applicant: 삼성전기주식회사
IPC: H01L21/66
Abstract: An LED set master for prober calibration is provided to prevent separation of a semiconductor chip or damage of an electrode pad by connecting a probe needle with a bonding pad or a probing pad instead of the electrode pad. Each of plural chips(32) includes a first and second electrode pads. The chips are arranged on a substrate(31). A plurality of first and second bonding pads(34a,34b) are formed on the substrate and are electrically connected with the first and second electrode pads of the chip. A first and second wires(35a,35b) are extended from the first and second bonding pads. The first and second probing pads are connected with ends of the first and second wires. The first and second wires are extended in an upper area of the substrate. The first and second probing pads are formed in parallel to each other on the upper area of the substrate.
Abstract translation: 提供用于探测器校准的LED组主模块，以通过将探针与焊盘或探测垫而不是电极焊盘连接来防止半导体芯片的分离或电极焊盘的损坏。 多个芯片（32）中的每一个包括第一和第二电极焊盘。 芯片排列在衬底（31）上。 多个第一和第二接合焊盘（34a，34b）形成在基板上并且与芯片的第一和第二电极焊盘电连接。 第一和第二导线（35a，35b）从第一和第二接合垫延伸。 第一和第二探测垫与第一和第二导线的端部连接。 第一和第二导线在衬底的上部区域中延伸。 第一和第二探测垫彼此平行地形成在基板的上部区域上。
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公开(公告)号：KR101319639B1
公开(公告)日：2013-10-17
申请号：KR1020110137429
申请日：2011-12-19
Applicant: 삼성전기주식회사
Abstract: 본 발명은 광조도와 광량 측정 모듈 및 이를 이용한 멀티 채널 측정기에 관한 것이다.
본 발명에 따른 광조도와 광량 측정 모듈은, 중앙에 개구부를 갖는 하우징; 상기 하우징 내에 설치되며, 상기 하우징의 전방에 배치된 표준 광원에서 조사되는 광의 파장을 일정하게 변화시키는 디퓨져; 상기 디퓨져의 하부에 설치되며, 상기 디퓨져를 경유한 고에너지의 광의 세기를 감소시키는 ND(Neutral Density) 필터; 상기 ND 필터의 하부에 설치되며, 특정 영역의 파장 영역대를 선택적으로 투과시키는 밴드패스필터; 및 상기 하우징의 저면에 설치되며, 상기 밴드패스필터를 통해 투과되는 광을 수광하는 센서;를 포함한다.-
公开(公告)号：KR1020130059103A
公开(公告)日：2013-06-05
申请号：KR1020110125240
申请日：2011-11-28
Applicant: 삼성전기주식회사
Abstract: PURPOSE: A manufacturing method of a round shape probe top is provided to form a probe top in a round shape through chemical etching. CONSTITUTION: A manufacturing method of a round shape probe top includes a step of preparing a water tub(110) which is filled with etching solution; a step of dipping a part of a first probe(10a) and a second probe(10b) in the etching solution(120); a step of performing an electrical connection to the first probe and the second probe; and a step of processing a first probe top and a second probe top into a round shape by raising or lowering the first probe or the second probe according to a first condition.
Abstract translation: 目的：提供圆形探针顶部的制造方法，以通过化学蚀刻形成圆形的探针顶部。 构成：圆形探针顶部的制造方法包括制备填充有蚀刻溶液的水桶（110）的步骤; 将第一探针（10a）和第二探针（10b）的一部分浸渍在蚀刻溶液（120）中的步骤; 执行与第一探针和第二探针的电连接的步骤; 以及通过根据第一条件升高或降低第一探针或第二探针来将第一探针顶部和第二探针顶部加工成圆形的步骤。
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