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公开(公告)号：KR101321183B1
公开(公告)日：2013-10-23
申请号：KR1020110125240
申请日：2011-11-28
Applicant: 삼성전기주식회사
Abstract: 본 발명의 실시예는 라운드형 프로브 탑의 제조방법에 관한 것으로서, 에칭 용액이 담긴 수조를 준비하는 단계; 에칭 용액에 제1 프로브와 제2 프로브의 일부를 침지시키는 단계; 제1 프로브와 제2 프로브에 전기적 연결을 수행하는 단계; 및 제1 프로브 또는 제2 프로브를 제1 조건에 따라 상승 또는 하강시켜 제1 프로브의 탑 및 제2 프로브의 탑을 라운드형으로 가공하는 단계;를 포함하는 것을 특징으로 한다.
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公开(公告)号：KR1020130070214A
公开(公告)日：2013-06-27
申请号：KR1020110137429
申请日：2011-12-19
Applicant: 삼성전기주식회사
Abstract: PURPOSE: An illumination and intensity measuring module and a multi-channel measuring device using the same are provided to accurately measure the illumination and the intensity of radiation as filters and a sensor are formed into one module by being embedded in the device. CONSTITUTION: An illumination and intensity measuring module(200) comprises a housing unit(210), a diffuser(220), an ND filter(230), a band-pass filter(240), and a sensor(250). The housing unit includes an opening(211) in the center. The diffuser is installed inside the housing unit and regularly changes the wavelengths of lights irradiated by a reference light source arranged in the front side of the housing unit. The ND filter is installed under the diffuser and reduces the intensity of the lights having high energy transmitted through the diffuser. The band-pass filter is installed under the ND filter and transmits selectively a wavelength band of a specific domain. The sensor is installed in the bottom surface of the housing unit and receives the light transmitted through the band-pass filter.
Abstract translation: 目的：提供照明和强度测量模块和使用该照明和强度测量模块的多通道测量装置，以便通过嵌入设备中将滤光片和传感器形成为一个模块来精确测量辐射的照度和强度。 构成：照明和强度测量模块（200）包括壳体单元（210），漫射器（220），ND滤光器（230），带通滤光器（240）和传感器（250）。 壳体单元包括在中心的开口（211）。 扩散器安装在壳体单元的内部并且规则地改变布置在壳体单元的前侧中的参考光源照射的光的波长。 ND过滤器安装在扩散器下方，并降低通过扩散器传播的高能量的光的强度。 带通滤波器安装在ND滤波器之下，并选择性地发送特定域的波段。 传感器安装在壳体单元的底面，并接收透过带通滤光片的光。
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公开(公告)号：KR1020080104748A
公开(公告)日：2008-12-03
申请号：KR1020070051965
申请日：2007-05-29
Applicant: 삼성전기주식회사
IPC: H01L23/28
CPC classification number: H01L2224/04105 , H01L2224/12105 , H01L2224/19 , H01L2224/32145 , H01L2224/73267 , H01L2224/92144 , H01L2924/18162 , H01L2924/351 , H01L2924/00 , H01L2924/00012
Abstract: According to the semiconductor package and manufacturing method thereof, the semiconductor chip is welded to the cooling fin with directly and it makes the thermal pathway short. The heat emission efficiency of the semiconductor package can be strengthened. The method for manufacturing a semiconductor package comprises as follows. A step is for contacting the one-side of the semiconductor chip(26) having the connection terminal(28) with the one-side of the cooling fin(20) having penetration hole(22). A step is for encapsulating the semiconductor chip by coating the insulating material(30) in the one-side of the cooling fin. A step is for being laminated the insulating layer(32) in the other side of the cooling fin. A step is for forming the first VIA(36) by punching the insulating layer and being electrically connected with the connection terminal.
Abstract translation: 根据半导体封装及其制造方法，将半导体芯片直接焊接在散热片上，使热路短路。 可以加强半导体封装的散热效率。 半导体封装的制造方法如下。 使具有连接端子（28）的半导体芯片（26）的一侧与具有贯通孔（22）的冷却翅片（20）的一侧接触的步骤。 通过将绝缘材料（30）涂覆在冷却翅片的一侧来封装半导体芯片的步骤。 步骤是将绝缘层（32）层压在冷却翅片的另一侧。 通过冲压绝缘层并与连接端子电连接来形成第一VIA（36）的步骤。
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公开(公告)号：KR1020080080782A
公开(公告)日：2008-09-05
申请号：KR1020070020943
申请日：2007-03-02
Applicant: 삼성전기주식회사
IPC: H01L23/48
CPC classification number: H01L2224/04105 , H01L2224/12105 , H01L2224/19 , H01L2224/32245 , H01L2224/32257 , H01L2224/73267 , H01L2224/9222 , H01L2924/15151 , H01L2924/15153 , H01L2924/00012
Abstract: An electronic component package and a method for manufacturing thereof are provided to simplify a process and to improve heat-radiating efficiency by molding an electronic element in a cavity of a heat-radiating plate. An electronic component is mounted on one surface of a first insulating layer(S110). An adhesive is coated on the electronic component(S120). A heat-radiating plate including a cavity is bonded with one surface of the first insulating layer to cover the electronic component(S130). A circuit pattern is formed on the other surface of the first insulating layer(S140). A plurality of air bents for penetrating the heat-radiating plate are formed in a bottom surface of the heat-radiating plate.
Abstract translation: 提供一种电子元件封装及其制造方法，以简化工艺并通过将电子元件模制在散热板的空腔中来提高散热效率。 电子部件安装在第一绝缘层的一个表面上（S110）。 将粘合剂涂覆在电子部件上（S120）。 包括空腔的散热板与第一绝缘层的一个表面接合以覆盖电子部件（S130）。 在第一绝缘层的另一个表面上形成电路图案（S140）。 在散热板的底面上形成有用于穿透散热板的多个空气弯针。
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公开(公告)号：KR2020000003220U
公开(公告)日：2000-02-15
申请号：KR2019980013301
申请日：1998-07-20
Applicant: 삼성전기주식회사
Inventor： 김선경
IPC: G06F1/16
Abstract: 본 고안은 퍼스널 컴퓨터(PC) 또는 노트북(NOTE BOOK)등과 같은 워드프로세서의 입력장치인 키보드에 관한 것으로 그 기술적인 구성은, 누름 작동하는 키탑(10)과 대향 설치되는 가이드부재(20)가 키프레임(30)에 설치되고, 그 하측에는, 내측으로 돌출된 접점편(42)의 하단에 제 1 접점부(43)가 형성되는 작동러버(44)가 배열 설치되는 러버시트(41)와, 상부면에는 키탑(10)의 누름작동시 전기적인 신호를 발생토록 상기 작동러버(44)의 제 1접점부(42)와 접촉되는 제 2접점부(51)가 배열 형성된 회로패턴(52)이 설치되는 하부케이스(50)을 갖는 스위칭부(40)가 설치됨을 특징으로 한다.
이에따라서, 전기적인 작동을 위한 별도의 상,하 멤브레인이 필요없게 됨으로써, 키보드 제조공정 및 부품수가 가일층 절감되어 생산성이 향상됨은 물론, 키보드의 접점작동을 위한 다층구조가 필요없게 되어 키보드 작동성이 향상되어 제품 신뢰성이 향상되는 한편, 스위칭부의 단순화로 자동화 작업이 용이한 것이다.-
Patent Agency Ranking6.发明公开
公开(公告)号：KR1020140028859A
公开(公告)日：2014-03-10
申请号：KR1020120096125
申请日：2012-08-31
Applicant: 삼성전기주식회사
IPC: G01J3/40
CPC classification number: G01J1/0492 , G01J1/029 , G01J2001/4247
Abstract: The present invention relates to a multi-channel luminous energy sensing unit, an apparatus for measuring light energy of an exposure device, and a method for measuring light energy for each channel. The luminous energy sensing unit which senses the amount of light radiated from a light source according to an embodiment of the present invention comprises: a board; and multiple light sensor modules which are arranged on the board and sense at least two channel lights with different bands among lights radiating from the light source. Also, provided are the apparatus for measuring light energy of an exposure device including the same and the method for measuring light energy for each channel. [Reference numerals] (AA) I line; (BB) H line; (CC) G line
Abstract translation: 本发明涉及一种多通道光能感测单元，一种用于测量曝光设备的光能的装置以及用于测量每个通道的光能的方法。 根据本发明实施例的感测从光源辐射的光量的光能感测单元包括：板; 以及多个光传感器模块，其布置在板上并感测从光源照射的光中具有不同带的至少两个通道灯。 此外，还提供了用于测量包括该曝光装置的曝光装置的光能的装置以及用于测量每个通道的光能的测量方法。 （附图标记）（AA）I线; （BB）H线; （CC）G线
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公开(公告)号：KR101332059B1
公开(公告)日：2013-11-22
申请号：KR1020110084631
申请日：2011-08-24
Applicant: 삼성전기주식회사
CPC classification number: G01J1/08 , G01J1/0266 , G01J2001/4247
Abstract: 본 발명은 교정 장치에 관한 것으로서, 보다 자세하게는 광 조도 및 광 분포 측정기 등 다양한 광측정기를 교정할 수 있는 광측정기 교정장치에 관한 것이다.
본 발명의 광측정기 교정 장치는 교정용 광을 발산하는 표준광원; 상기 표준광원에서 조사되는 광축과 평행한 방향으로 이동되고, 다양한 크기의 교정 대상 측정기를 고정하는 유니버셜지그; 상기 표준광원과 상기 유니버셜지그 사이의 공간을 밀폐하는 보호막; 상기 교정 대상 측정기에 인접하여 설치되며, 상기 표준광원에서 발산되는 교정용 광이 통과하는 개구부가 형성된 난반사차단막;을 포함하며, 상기 유니버셜지그에 고정된 교정 대상 측정기와 표준광원의 거리에 따른 광 에너지의 증가/감소 효과를 이용해 광측정기를 교정할 수 있다.-
公开(公告)号：KR1020130022448A
公开(公告)日：2013-03-07
申请号：KR1020110084631
申请日：2011-08-24
Applicant: 삼성전기주식회사
CPC classification number: G01J1/08 , G01J1/0266 , G01J2001/4247
Abstract: PURPOSE: A device for calibrating an optical measuring instrument is provided to perform the calibration of an optical measuring instrument with a plurality of sensors and remarkably enhance the accuracy of the calibration. CONSTITUTION: A device for calibrating an optical measuring instrument comprises a reference light source(130) and an universal jig(160). The reference light source emits lights for calibration. The universal jig fixes a plurality of target optical measuring instruments of various sizes and is movable to a direction parallel to an optical shaft of the reference light source. The universal jig includes a horizontal supporting unit and a vertical supporting unit. The horizontal supporting unit moves in a horizontal direction and supports a lateral side of the target optical measuring instrument. The vertical supporting unit moves in a vertical direction and supports the underside of the target optical measuring instrument.
Abstract translation: 目的：提供一种用于校准光学测量仪器的设备，以执行具有多个传感器的光学测量仪器的校准，并显着提高校准精度。 构成：用于校准光学测量仪器的装置包括参考光源（130）和通用夹具（160）。 参考光源发光用于校准。 通用夹具固定了多种尺寸的目标光学测量仪器，并且能够平行于参考光源的光轴方向移动。 通用夹具包括水平支撑单元和垂直支撑单元。 水平支撑单元沿水平方向移动并支撑目标光学测量仪器的侧面。 垂直支撑单元沿垂直方向移动并支撑目标光学测量仪器的下侧。
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公开(公告)号：KR100836645B1
公开(公告)日：2008-06-10
申请号：KR1020070022047
申请日：2007-03-06
Applicant: 삼성전기주식회사
IPC: H01L23/12
CPC classification number: H01L2224/04105 , H01L2224/12105 , H01L2224/16145 , H01L2224/19 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48471 , H01L2224/73265 , H01L2224/73267 , H01L2224/92244 , H01L2924/15311 , H01L2924/00014 , H01L2924/00
Abstract: An electronic package and a manufacturing method thereof are provided to form a micro pattern which can connect electric contact points of semiconductor chips by forming a build-up layer, thereby enhancing reliability of a CSP(chip scale package). A semiconductor chip having an electrical contact point is mounted(100). The semiconductor chip is encapsulated by coating an insulating member(110). A via which is connected with the electrical contact point is formed by punching the insulating member(120). A unit package including the semiconductor chip, the insulating member and via is stacked repeatedly by repeating the semiconductor mounting process and the via forming process during the predetermined number of times, so that the semiconductor chip can realize a stack structure(130). A bump which is connected with the via electrically is joined(150).
Abstract translation: 提供电子封装及其制造方法以形成通过形成积层来连接半导体芯片的电接触点的微图形，从而提高CSP（芯片尺寸封装）的可靠性。 安装具有电接触点的半导体芯片（100）。 通过涂覆绝缘构件（110）来封装半导体芯片。 通过冲压绝缘构件（120）形成与电接触点连接的通孔。 通过在预定次数内重复半导体安装处理和通孔形成处理，重复地堆叠包括半导体芯片，绝缘构件和通孔的单元封装，使得半导体芯片可以实现堆叠结构（130）。 与通孔电连接的凸块接合（150）。
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公开(公告)号：KR100836642B1
公开(公告)日：2008-06-10
申请号：KR1020070022364
申请日：2007-03-07
Applicant: 삼성전기주식회사
CPC classification number: H01L2924/0002 , H01L2924/00
Abstract: An electronic package and a manufacturing method thereof are provided to configure a COC(Chip On Chip) package by stacking the multiple chips on a heat spreader, and to maximize heat radiation capability by applying a build-up technology, thereby realizing an SIP(System in package). An other side plane of a first chip having an electrical contact point at one side plane is attached on a heat spreader(100). A second chip having the electrical contact point at the one side plane is stacked on the first chip, and the electrical contact points of the first and second chips are connected(110). The first and second chips are encapsulated by coating the heat spreader with an insulation member(120). A first via which is connected with the electrical contact points is processed by punching the insulation member(130).
Abstract translation: 提供了一种电子封装及其制造方法，通过将散热器上的多个芯片堆叠起来构成COC（Chip On Chip）芯片，并且通过应用建立技术来最大限度地发挥热辐射能力，从而实现SIP（系统 包装）。 在散热器（100）上安装有在一个侧面具有电接触点的第一芯片的另一侧面。 在第一芯片上堆叠具有在一个侧面上的电接触点的第二芯片，并且连接第一芯片和第二芯片的电接触点（110）。 通过用绝热构件（120）涂覆散热器来封装第一和第二芯片。 通过冲压绝缘构件（130）来处理与电接触点连接的第一通孔。
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