Abstract:
A nano or micro size diode and a method for preparing the same are provided to manufacture a diode having uniform quality by including a rectifying layer having a superior p-n junction. A rectifying layer(35) comprises a first electrode(31), a second electrode(33), a first layer(35a), and a second level(35b). The first layer is interposed between the first electrode and the second level. The second level is interposed between the first layer and the second electrode. The second side(35b2) of the first layer has protrusion. A control layer is included between the second electrode and the rectifying layer.
Abstract:
본 발명은, 제1전극, 제2전극 및 상기 제1전극과 상기 제2전극 사이에 개재되며, 제1층 및 제2층을 포함한 전류정제층을 포함하고, 상기 제1층은 상기 제1전극과 상기 제2층 사이에 개재되고, 상기 제2층은 상기 제1층과 상기 제2전극 사이에 개재되고, 상기 제1층은, 상기 제1전극과 전기적으로 연결된 제1면 및 상기 제1층의 제1면과 대향되는 제2면을 갖고, 상기 제1층의 제2면은 돌출부(protrude part)를 가지며, 상기 제2층은, 상기 제1층의 제2면에 위치한 돌출부에 대응된 인입부(recess part)를 갖는 제1면 및 상기 제2층의 제1면에 대향되는 제2면을 갖고, 상기 제2층의 제2면은 상기 제2전극과 전기적으로 연결된 나노 또는 마이크로 크기의 다이오드 및 이의 제조 방법에 관한 것이다. 다이오드
Abstract:
PURPOSE: A production method of reduced graphene oxide is provided to obtain the reduced graphene oxide at a room temperature and the atmospheric pressure in short time. CONSTITUTION: A production method of reduced graphene oxide comprises the following steps: forming a graphene oxide layer on a conductive substrate (11) to produce a negative electrode; soaking the negative electrode and a positive electrode in electrolyte containing a base; and applying the voltage to the negative and positive electrodes to reduce graphene oxide.
Abstract:
PURPOSE: A semiconductor device and a manufacturing method thereof are provided to improve a performance characteristic of the device by reducing a resistance with forming a p+ domain on the central part of a first oxide channel layer. CONSTITUTION: A first oxide channel layer(C10) is formed into a first conductive type oxide on a lower part layer. A first electrode layer covering the first channel layer is formed on the lower part layer. The first electrode layer and a second electrode layer separated are formed. A second oxide channel layer(C20) is formed into a second conductive type oxide on the lower part later. The first electrode layer is patterned. A first source, a first drain and the second drain are formed by the patterning of the first electrode layer.