트리플 밴드 프런트 엔드 장치 및 그 구성 방법
    12.
    发明公开
    트리플 밴드 프런트 엔드 장치 및 그 구성 방법 失效
    三段前端装置及其构造方法

    公开(公告)号:KR1020090124316A

    公开(公告)日:2009-12-03

    申请号:KR1020080050449

    申请日:2008-05-29

    CPC classification number: H04B1/0057 H04B1/401 H04B1/48

    Abstract: PURPOSE: A triple band frontend apparatus and a constitution equipped with a WIMAX triplexer are provided to transmit and receive the signal on special band and attenuate the high frequency noise in signal transmission. CONSTITUTION: A receiving triplexer(10) includes a WiMAX(Worldwide Interoperability for Microwave Access) triplexer and separates the receiving signal by special frequency band to a WiMAX transceiver. A transmitting triplexer(30) includes the WiMAX triplexer and transmits the transmission signal to an antenna. A switch(40) converts a mode according to the receiving signal and the transmitting signal. The reception triplexer comprises the first matching unit and a plurality of BPF(Band Pass Filter).

    Abstract translation: 目的:提供三频带前端装置和配备有WIMAX三工器的结构,以在特殊频带上发送和接收信号,并在信号传输中衰减高频噪声。 构成:接收三路复用器(10)包括WiMAX(全球微波接入互操作性)三路复用器,并将接收信号由专用频带分离到WiMAX收发器。 发射三工器(30)包括WiMAX三路复用器,并将发送信号发送到天线。 开关(40)根据接收信号和发送信号转换模式。 接收三工器包括第一匹配单元和多个BPF(带通滤波器)。

    능동 소자 칩 내장형 기판 및 그의 제조 방법
    13.
    发明公开
    능동 소자 칩 내장형 기판 및 그의 제조 방법 无效
    具有嵌入式有源器件芯片的衬底及其制造方法

    公开(公告)号:KR1020090124064A

    公开(公告)日:2009-12-03

    申请号:KR1020080050061

    申请日:2008-05-29

    Abstract: PURPOSE: A substrate with active device chip embedded therein and fabricating method thereof are provided to prevent the damage of chip in the polymer laminate process. CONSTITUTION: The second copper layer(120) is formed at the upper part of the polymer film(100). The first copper layer(110) is formed at the lower part of the polymeric film. A part of the polymer thin layer and the first copper layer is eliminated to form the cavity. The both sides of the first copper layer and the second copper layer are eliminated to expose the polymer film. The active device chip(200) is bonded in the second copper layer exposing inside cavity. Polymer is laminated while protecting the active device chips, and the first copper layer and the second copper layer. The third copper layer(170) is formed at the upper part of the laminated polymer(150).

    Abstract translation: 目的:提供一种嵌有有源器件芯片的衬底及其制造方法,以防止聚合物层压工艺中芯片的损坏。 构成:第二铜层(120)形成在聚合物膜(100)的上部。 第一铜层(110)形成在聚合物膜的下部。 聚合物薄层和第一铜层的一部分被消除以形成空腔。 消除第一铜层和第二铜层的两面以露出聚合物膜。 有源器件芯片(200)接合在暴露在腔内的第二铜层中。 聚合物层压,同时保护有源器件芯片,以及第一铜层和第二铜层。 第三铜层(170)形成在层压聚合物(150)的上部。

    전원단 회로, 전원단 회로 설계장치 및 방법
    14.
    发明授权
    전원단 회로, 전원단 회로 설계장치 및 방법 失效
    用于设计电源电路的装置和方法以及使用该电源电路的电源电路

    公开(公告)号:KR100903681B1

    公开(公告)日:2009-06-18

    申请号:KR1020070140099

    申请日:2007-12-28

    CPC classification number: G06F17/5045 G06F3/14 G06F17/5009

    Abstract: A power circuit, a power circuit design device, and a method thereof are provided to operate plural power lines with one external power source, thereby minimizing the number of capacitors. A power circuit design device(200) comprises as follows. An input unit(21) receives a design request of a power circuit. A memory(23) stores a design program of the power circuit. The memory stores an optimal isolation value between power ports of the power circuit. The memory stores a 3D inductor structure design program for 3D image simulation of the power circuit. A controller(25) controls an overall operation to design the power circuit with an optimal isolation value. A display unit(27) displays design data of the power circuit under control of the controller.

    Abstract translation: 提供电源电路,电源电路设计装置及其方法来操作具有一个外部电源的多个电力线,从而最小化电容器的数量。 电源电路设计装置(200)包括如下。 输入单元(21)接收电源电路的设计请求。 存储器(23)存储电源电路的设计程序。 存储器在电源电路的电源端口之间存储最佳隔离值。 存储器存储用于电源电路的3D图像模拟的3D电感器结构设计程序。 控制器(25)控制整体操作以设计具有最佳隔离值的电力电路。 显示单元(27)在控制器的控制下显示电源电路的设计数据。

    프론트 엔드 모듈
    15.
    发明授权
    프론트 엔드 모듈 失效
    前端模块

    公开(公告)号:KR100781055B1

    公开(公告)日:2007-11-30

    申请号:KR1020060132607

    申请日:2006-12-22

    CPC classification number: H04B1/48 H01P1/203

    Abstract: A front end module is provided to minimize a mobile communication terminal by patterning a capacitor and a strip line on a dielectric sheet and mounting a transmitting SAW filter, a power amplifier, a power detector, the capacitor, a resistor, and a duplexer as component elements to reduce an area of a circuit board occupied in the mobile communication terminal. A frond end module includes a first-layer dielectric sheet, a second-layer dielectric sheet, third-layer and fourth-layer dielectric sheets, fifth-layer and seventh-layer dielectric sheets, a sixth-layer dielectric sheet, and an eighth-layer dielectric sheet. Components of duplexer(130) including a transmitting SAW filter(100), a power amplifier(110), a power detector(120), a capacitor, a resistor(124), a transmitting filter(132), and a receiving filter(136) are mounted on the first-layer dielectric sheet. A plurality of connection patterns for electrically connecting the first-layer dielectric sheet is formed on the second-layer dielectric sheet. A pattern of the capacitor is formed on the third-layer and fourth-layer dielectric sheets. A ground pattern is formed on the fifth-layer and seventh-layer dielectric sheets. A pattern of a strip line is formed on the sixth-layer dielectric sheet. Plural terminal patterns to be electrically connected with external components are formed on the eighth-layer dielectric sheet.

    Abstract translation: 提供前端模块以通过在电介质片上形成电容器和带状线并使安装传输SAW滤波器,功率放大器,功率检测器,电容器,电阻器和双工器的组件来最小化移动通信终端,作为组件 元件,以减少在移动通信终端中占用的电路板的面积。 第一层电介质片,第二层电介质片,第三层和第四层电介质片,第五层和第七层电介质片,第六层电介质片和第八层电介质片, 层介电片。 包括发射SAW滤波器(100),功率放大器(110),功率检测器(120),电容器,电阻器(124),发射滤波器(132)和接收滤波器 136)安装在第一层电介质片上。 在第二层电介质片上形成用于电连接第一层电介质片的多个连接图案。 电容器的图案形成在第三层和第四层电介质片上。 在第五层和第七层电介质层上形成接地图案。 带状线的图案形成在第六层电介质片上。 在第八层电介质片上形成与外部部件电连接的多个端子图案。

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