Abstract:
The present invention provides a compound capable of forming an irregular wrinkled structure, a composition containing the compound, a film having the irregular wrinkled structure, a method of forming the film, and an organic light emitting diode comprising the film. The film can be formed with the irregular wrinkled structure by simply coating the compound of the present invention, and curing using UV rays or heat. By applying the formed film to the organic light emitting diode, light emitted from the organic light emitting diode is scattered on the surface of irregular wrinkles and is extracted to the outside after controlling the optical wave or total reflection. A random structure located on the outside of the diode functions as a light extraction unit for improving the light efficiency of the organic light emitting diode.
Abstract:
PURPOSE: A method for fabricating an organic light emitting diode is provided to simplify a fabrication process, by not including a vacuum process in an optical extraction mask forming process. CONSTITUTION: A substrate(100) is prepared. A rugged part(101) is formed on the substrate and is arranged at random. A planarization layer(102) planarizing the rugged part is formed on the rugged part. A first electrode is formed on the planarization layer. An organic light emission layer(104) is formed on the first electrode. A second electrode(105) is formed on the organic light emitting layer.
Abstract:
PURPOSE: A direct current voltage conversion circuit of a liquid crystal display device is provided to correspond to the dispersion of broad threshold voltage by applying positive gate source voltage when turning on a TFT(Thin Film Transistor), and applying negative gate source voltage when turning off the TFT. CONSTITUTION: A main pumping circuit part(710) comprises multiple TFTs(M1-M8). The multiple TFTs are turned on and off by turns. A main pumping circuit part outputs voltage for driving a liquid crystal display device. A switch control signal generating part(720) controls the voltage applied to the gate of multiple thin film transistors with a clock signal inversion.
Abstract:
본 발명은 적외선 감지용 픽셀 및 이의 제조 방법에 관한 것으로, 볼로미터 구조체의 대칭적 적층 구조를 구현함으로써 스트레스에 둔감한 적외선 감지용 픽셀 및 이의 제조 방법을 제공한다. 이를 위하여, 본 발명의 일실시 예에 따른 적외선 감지용 픽셀은, 내부에 신호 취득 회로(Read-Out Integrated Circuit; ROIC)가 포함되어 있으며, 적외선 반사를 위한 반사층이 적층된 기판; 상기 기판으로부터 간격을 두고 형성되며, 온도 감응형 저항체, 상기 온도 감응형 저항체의 일면에 패턴을 가지고 형성되는 제 1 금속층, 적외선을 보완적으로 흡수하기 위하여 상기 온도 감응형 저항체의 타면에 상기 제 1 금속층과 상보적인 패턴으로 형성되는 제 2 금속층 및 상기 온도 감응형 저항체와 상기 제 1 금속층 사이에 형성된 절연층을 포함하는 볼로미터 구조체; 및 상기 제 1 금속층 및 상기 제 2 금속층에서 흡수된 적외선에 따른 상기 온도 감응형 저항체의 저항 변화를 상기 제 2 금속층으로부터 입력받아 상기 신호 취득 회로로 전달하는 금속 패드를 포함한다. 그럼으로써, 향상된 응답도를 기대할 수 있으며, 스트레스에 강한 구조 및 간단한 구조를 구현할 수 있고, 이로 인한 공정 수율의 향상을 도모할 수 있고, 그 부피를 줄임으로써 응용되는 제품의 부피, 무게 및 가격 등의 감소 효과를 기대할 수 있다. 볼로미터, 적외선 센서, 온도 감응 저항체
Abstract:
본 발명은 비휘발성 메모리 소자에 관한 것으로, 상 변화 메모리 소자의 제조 방법은, (a) 기판 상에 제 1 반응층을 형성하는 단계; (b) 상기 제 1 반응층 상부의 일부를 노출시키는 컨택 홀이 형성되도록 상기 제 1 반응층을 덮는 절연층을 형성하는 단계; (c) 상기 컨택 홀을 매립하는 제 2 반응층을 형성하는 단계; 및 (d) 상기 제 1 반응층 및 상기 제 2 반응층을 이루는 물질 간의 고상 반응을 일으킴으로써 상기 제 1 반응층 및 상기 제 2 반응층 사이에 상 변화층을 생성하는 단계를 포함한다. 따라서, 낮은 전력 소모를 가지며 동작 속도가 빠른 상 변화 메모리 소자를 제공할 수 있다.
Abstract:
PURPOSE: A high-sensitivity MEMS type z-axis vibration sensor and a manufacturing method thereof are provided to apply to a seismometer detecting a low frequency of a seismic wave with very little vibration quantity and low vibration speed. CONSTITUTION: A manufacturing method of a high-sensitivity mems type z-axis vibration sensor is as follows. After preparing a SOI substrate, The top silicon layer(130a) of the SOI substrate to be used as a bottom electrode is doped. A poly silicon layer(170a) to be used as a center ground electrode and an oxide film of a predetermined thickness are formed at the top of the doped top silicon layer. The poly silicon layer is doped. A sacrifice layer oxidation film(147a) of a predetermined thickness and a top electrode(190) are formed at the top of the doped poly silicon layer. An etching process is continuously performed from the silicon wafer(110) of the bottom of the SOI substrate to isolate the area to be further connected to center of mass of a center ground electrode from the doped top silicon layer. By etching the sacrifice layer oxidation film and the oxide film through the top of the top electrode, the doped poly silicon layer forms a vibration space capable of vibrating in the Z-axis direction.
Abstract:
PURPOSE: A non-volatile programmable switch device using a phase-change memory device and a method for manufacturing the same are provided to reduce the power consumption of the switch device using heating due to the resistance of a phase-change material in order to perform a memory operation. CONSTITUTION: A first metal electrode layer(12) is formed on a substrate(10). A plurality of lead-in regions is electrically connected to the terminal of the first metal electrode layer on the substrate. A phase-change material layer(14) includes a channel region which is arranged between the lead-in regions and which is a self-heating type channel structure. An insulation layer is formed on the first metal electrode layer and the phase-change material layer. A via-hole is formed on the upper side of the first metal electrode layer. A second metal electrode layer(20) buries the via-hole.
Abstract:
PURPOSE: A phase change memory and a manufacturing method thereof are provided to reduce power consumption of a memory device by minimizing the heat loss by the thermal conductivity of a metal electrode. CONSTITUTION: A phase change memory device includes a substrate(10), a first metal electrode layer(12), a phase change material layer(14), an insulation layer, a via hole, and a second metal electrode layer(20). A plurality of first metal electrode layers are formed on the substrate. The phase change material layer is formed between the first metal electrode layers on the substrate. The phase change material layer is comprised of a self heating channel structure. The insulation layer is formed on the first metal electrode layers and the phase change material layers. The via hole is formed on the first metal electrode layers. The second metal electrode layer fills the via hole.