EXTRUDABLE PRESSURE-SENSITIVE ADHESIVE
    14.
    发明申请

    公开(公告)号:WO2020174396A1

    公开(公告)日:2020-09-03

    申请号:PCT/IB2020/051604

    申请日:2020-02-25

    Abstract: Methods of bonding a pressure-sensitive adhesive to a substrate are provided. The methods include heating a styrenic block copolymer composition to provide an adhesive melt composition, wherein the styrenic block copolymer composition contains a hard segment block with a glass transition temperature of from 90°C to 220°C; masticating the adhesive melt composition; delivering the adhesive melt composition onto the substrate at a temperature that exceeds the glass transition temperature of the hard segment block by from 20°C to 150°C; and cooling the adhesive melt composition to obtain a bonded pressure-sensitive adhesive. Optionally, the substrate can be a non-film substrate, or the styrenic block copolymer composition can be provided in a core-sheath filament that includes a styrenic block copolymer core and a sheath that is non-tacky at ambient temperature.

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