公开(公告)号：EP3115729B1

公开(公告)日：2018-12-05

申请号：EP16175015.3

申请日：2016-06-17

Applicant: ABB Schweiz AG

Inventor： Agostini, Bruno ,  Torresin, Daniele ,  Agostini, Francesco ,  Habert, Mathieu

IPC: F28D15/02 ,  H01L23/00 ,  H05K7/20

CPC classification number: F28D15/0266 ,  F28D7/0075 ,  F28D15/0233 ,  F28D15/04 ,  F28D2015/0216 ,  F28D2021/0028 ,  F28D2021/0029 ,  F28F3/025 ,  H01L23/3677 ,  H01L23/427 ,  H05K7/20936

Abstract: The invention relates to a heat exchanger (1) comprising a base plate (2) for receiving a heat load from one or more electric components (3), an evaporator (5) being in thermal contact with a surface of the base plate (2) for transferring said heat load into a first fluid in the evaporator channels (7), and a condenser (8) dissipating heat from the first fluid. In order to provide an efficient heat exchanger the heat exchanger comprises a collector space (16) receiving first fluid from the condenser (8'), and the collector space (16) which is located higher than the lower ends of the evaporator channels (7) is in fluid communication with lower ends of the evaporator channels (7) for passing first fluid received from the condenser (8) to the lower ends of the evaporator channels (7).

公开(公告)号：EP3190371B1

公开(公告)日：2018-08-01

申请号：EP16150431.1

申请日：2016-01-07

Applicant: ABB Schweiz AG

Inventor： Torresin, Daniele ,  Agostini, Bruno ,  Agostini, Francesco ,  Gradinger, Thomas ,  Habert, Mathieu

IPC: F28D15/02 ,  F28F13/00 ,  F28F1/02 ,  H05K7/20

CPC classification number: H05K7/20309 ,  F28D15/0233 ,  F28D15/0266 ,  F28D15/0275 ,  F28F1/022 ,  F28F13/00 ,  F28F2270/00 ,  F28F2275/02 ,  H05K7/20318 ,  H05K7/20327 ,  H05K7/20336 ,  H05K7/20936

Abstract: It is proposed a two-phase heat exchanger device (100) for a power-electronic module arrangement having a semiconductor module. The two-phase heat exchanger device includes a base plate (110) configured for being in contact with a first semiconductor module (201) at a first side (123) of the base plate; and at least one tube element (120) for a first cooling medium (131) including a first portion (121) having at least one evaporator channel and a second portion (122) having at least one condenser channel. The base plate has a groove (111; 112) containing the tube element, wherein the groove is dimensioned for enabling thermal contact between the base plate and the first portion of the tube element and dimensioned to form a gap (113) between the base plate and the second portion of the tube element for thermal separation of the base plate and the second portion of the tube element.

公开(公告)号：EP3203512A1

公开(公告)日：2017-08-09

申请号：EP16154626.2

申请日：2016-02-08

Applicant: ABB Schweiz AG

Inventor： Agostini, Bruno ,  Kearney, Daniel ,  Torresin, Daniele ,  Agostini, Francesco ,  Habert, Mathieu

IPC: H01L23/36 ,  H01L23/46 ,  H01L23/473 ,  H01L23/427

CPC classification number: H01L23/427

Abstract: The invention relates to a heat spreader (1) comprising a base plate (2) for receiving a heat load from at least one electric component (3), the base plate including pulsating heat pipes (4) for fluid flow arranged therein, wherein the base plate (2) has a first side (A), and a second side (B) which is opposite to the first side (A); the pulsating heat pipes comprise a plurality of multichannel heat tubes (4) which are embedded side by side on the first side of the base plate (A); and the second side of the base plate (2) is provided for attaching the electric components (3). The invitation provides also a power module comprising the heat spreader.

Abstract translation: 本发明涉及一种散热器（1），其包括用于接收来自至少一个电气部件（3）的热负载的基板（2），该基板包括布置在其中的用于流体流动的脉动热管（4），其中， （2）具有第一侧面（A）和与第一侧面（A）相对的第二侧面（B）。 所述脉动热管包括多个多通道热管（4），所述多个热管（4）并排埋置在所述基板（A）的所述第一侧上; 并且底板（2）的第二侧设置用于附接电气部件（3）。 邀请函还提供了一个由散热器组成的电源模块。

公开(公告)号：EP3147621B1

公开(公告)日：2019-09-11

申请号：EP15186625.8

申请日：2015-09-24

Applicant: ABB Schweiz AG

Inventor： Agostini, Francesco ,  Torresin, Daniele ,  Habert, Mathieu ,  Agostini, Bruno

IPC: F28F9/02 ,  F28D15/02

公开(公告)号：EP3026990B1

公开(公告)日：2019-01-30

申请号：EP14195342.2

申请日：2014-11-28

Applicant: ABB Schweiz AG

Inventor： Habert, Mathieu ,  Agostini, Bruno ,  Agostini, Francesco

IPC: H05K7/20 ,  F25B15/10

公开(公告)号：EP3232470B1

公开(公告)日：2019-01-02

申请号：EP16165167.4

申请日：2016-04-13

Applicant: ABB Schweiz AG

Inventor： Agostini, Bruno ,  Torresin, Daniele ,  Agostini, Francesco ,  Habert, Mathieu ,  Rahimo, Munaf

IPC: H01L23/427 ,  H01L23/473 ,  F25B25/00 ,  H01L29/16 ,  H01L29/20 ,  H01L29/22

公开(公告)号：EP3196586B1

公开(公告)日：2018-09-12

申请号：EP17150422.8

申请日：2017-01-05

Applicant: ABB Schweiz AG

Inventor： Gradinger, Thomas ,  Agostini, Bruno ,  Agostini, Francesco ,  Habert, Mathieu ,  Torresin, Daniele

IPC: F28F13/06 ,  F28D15/02 ,  F28F1/02 ,  H05K7/20

CPC classification number: F28F13/06 ,  F28D15/0233 ,  F28D15/0266 ,  F28D15/0275 ,  F28F1/022 ,  H05K7/20145 ,  H05K7/20936

Abstract: It is proposed a cooling unit (100) for a power electronic module arrangement. The cooling unit includes a two-phase heat exchanger (101) including a plurality of tube elements (120), each of which having at least one tube extending in a width direction (301) of the cooling unit, within and communicating between an evaporator portion (121) and a condenser portion (122) of the cooling unit (100). The tube elements are arranged in a spaced-apart manner along a depth direction (303) of the cooling unit forming cooling paths (213) for allowing an external cooling medium (130) to flow through the cooling paths, the cooling paths traversing the condenser portion in a length direction (302) of the cooling unit (100). The cooling unit further includes flow guides (141; 142) for forcing an external cooling medium (130) arriving at the heat exchanger through the cooling paths and then away from the cooling unit.

公开(公告)号：EP3144625B1

公开(公告)日：2018-07-04

申请号：EP15186080.6

申请日：2015-09-21

Applicant: ABB Schweiz AG

Inventor： Agostini, Bruno ,  Torresin, Daniele ,  Agostini, Francesco ,  Habert, Mathieu ,  Koivuluoma, Timo

IPC: F28F3/02 ,  F28D15/02 ,  F28D15/04 ,  H01L23/427 ,  H01L23/467

CPC classification number: F28D15/046 ,  F28D15/0233 ,  F28D15/0266 ,  F28D15/0275 ,  F28D15/0283 ,  F28D15/04 ,  F28D2021/0029 ,  F28F3/02 ,  F28F3/025 ,  F28F13/10 ,  F28F2215/06 ,  H01L23/427 ,  H01L23/467

Abstract: A cooling assembly comprising a plurality of fin elements (2) stacked in a stack direction (101), a plurality of coolant channels (4) each located between adjacent fin elements (2) and extending in a coolant channel direction (102) perpendicular to the stack direction (101), a first heat transfer surface (10) adapted to be in contact with a heat generating element (19), and a second heat transfer surface (20) spaced apart from the first heat transfer surface (10), the plurality of fin elements (2) and the plurality of coolant channels (4) being located between the first heat transfer surface (10) and the second heat transfer surface (20). Each of the fin elements (2) comprises a pulsating heat pipe (6) embedded therein, a main pulsating direction of each of the pulsating heat pipes (6) being substantially parallel to a normal of the first heat transfer surface (10).

公开(公告)号：EP2734020B1

公开(公告)日：2017-07-12

申请号：EP12193249.5

申请日：2012-11-19

Applicant: ABB Schweiz AG

Inventor： Agostini, Bruno ,  Agostini, Francesco ,  Habert, Mathieu

IPC: H05K7/20 ,  H01L23/427 ,  F28D15/06 ,  F28D15/02

CPC classification number: H01L23/427 ,  F28D15/0266 ,  F28D15/06 ,  H01L2924/0002 ,  H05K7/20936 ,  H01L2924/00