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    COOLING DEVICE AND METHOD FOR COOLING AT LEAST TWO POWER ELECTRONIC DEVICES
    11.
    发明公开
    COOLING DEVICE AND METHOD FOR COOLING AT LEAST TWO POWER ELECTRONIC DEVICES 审中-公开
    冷却装置和方法用于冷却至少两个电子功率器件

    公开(公告)号：EP3147621A1

    公开(公告)日：2017-03-29

    申请号：EP15186625.8

    申请日：2015-09-24

    Applicant: ABB Schweiz AG

    Inventor： Agostini, Francesco ,  Torresin, Daniele ,  Habert, Mathieu ,  Agostini, Bruno

    IPC: F28F9/02 ,  F28D15/02

    CPC classification number: H05K7/20936 ,  F28D15/025 ,  F28D15/0266 ,  F28D15/0275 ,  F28F9/0278 ,  F28F13/10 ,  H05K7/209

    Abstract: A cooling device for cooling at least two power electronic devices (4) by a working fluid (61). The cooling device has a heat receiver portion of the Pulsating Heat Pipe circuit system (60) and a pair of thermo-conducting walls provided on mutually opposite sides of the heat receiver arrangement (20) and sandwiching the heat receiver portion between them. These walls are adapted for being thermally connected to a respective one of the power electronic devices. The cooling device further has a heat dissipator arrangement (40) with a heat dissipator portion of the Pulsating Heat Pipe circuit system (60) and a plurality of fins (42) thermally coupled to the heat dissipator portion for transferring heat from the heat dissipator portion to an external cooling fluid for cooling the working fluid in the heat dissipator portion. The Pulsating Heat Pipe circuit system (60) connects the heat receiver portion with the heat dissipator portion for transferring heat from the heat receiver portion to the heat dissipator portion by the Pulsating Heat Pipe action of the working fluid.

    Abstract translation: 用于由工作流体（61）的冷却的至少两个电力电子器件（4）的冷却装置。 所述冷却装置具有脉动热管电路系统（60）和设置在所述热接收器装置（20）和夹持在它们之间的热接收器部分的彼此相对的两侧的一对热传导壁的热接收器部分。 这些壁angepasst用于连接到一个热respectivement电力电子器件中的一个。 所述冷却装置还具有热从所述散热器的部分耦合到用于传递环热散热器部分的散热器装置（40）与所述脉动热管电路系统（60）的部分的散热器和散热片的多个（42） 到用于冷却所述工作流体在所述散热器中的部分的外部冷却流体。 脉动热管电路系统（60）与从所述工作流体的脉动热管作用在部分热接收器部分，以所述散热器的散热部用于传递环的热的接收器部分连接。

    COOLING ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME
    12.
    发明公开
    COOLING ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME 有权
    维多利亚ZU DEREN HERSTELLUNG

    公开(公告)号：EP3144625A1

    公开(公告)日：2017-03-22

    申请号：EP15186080.6

    申请日：2015-09-21

    Applicant: ABB Schweiz AG

    Inventor： Agostini, Bruno ,  Torresin, Daniele ,  Agostini, Francesco ,  Habert, Mathieu ,  Koivuluoma, Timo

    IPC: F28F3/02 ,  F28D15/02 ,  F28D15/04 ,  H01L23/427 ,  H01L23/467

    CPC classification number: F28D15/046 ,  F28D15/0233 ,  F28D15/0266 ,  F28D15/0275 ,  F28D15/0283 ,  F28D15/04 ,  F28D2021/0029 ,  F28F3/02 ,  F28F3/025 ,  F28F13/10 ,  F28F2215/06 ,  H01L23/427 ,  H01L23/467

    Abstract: A cooling assembly comprising a plurality of fin elements (2) stacked in a stack direction (101), a plurality of coolant channels (4) each located between adjacent fin elements (2) and extending in a coolant channel direction (102) perpendicular to the stack direction (101), a first heat transfer surface (10) adapted to be in contact with a heat generating element (19), and a second heat transfer surface (20) spaced apart from the first heat transfer surface (10), the plurality of fin elements (2) and the plurality of coolant channels (4) being located between the first heat transfer surface (10) and the second heat transfer surface (20). Each of the fin elements (2) comprises a pulsating heat pipe (6) embedded therein, a main pulsating direction of each of the pulsating heat pipes (6) being substantially parallel to a normal of the first heat transfer surface (10).

    Abstract translation: 一种冷却组件，包括沿堆叠方向（101）堆叠的多个翅片元件（2），多个冷却剂通道（4），每个冷却剂通道（4）各自位于相邻的翅片元件（2）之间并且沿着与冷却剂通道方向（102）垂直的方式延伸 堆叠方向（101），适于与发热元件（19）接触的第一传热表面（10）和与第一传热表面（10）间隔开的第二传热表面（20） 多个翅片元件（2）和多个冷却剂通道（4）位于第一传热表面（10）和第二传热表面（20）之间。 每个翅片元件（2）包括嵌入其中的脉动热管（6），每个脉动热管（6）的主脉动方向基本上平行于第一传热表面（10）的法线。

    POWER-ELECTRONIC MODULE ARRANGEMENT
    16.
    发明授权
    POWER-ELECTRONIC MODULE ARRANGEMENT 有权

    公开(公告)号：EP3196586B1

    公开(公告)日：2018-09-12

    申请号：EP17150422.8

    申请日：2017-01-05

    Applicant: ABB Schweiz AG

    Inventor： Gradinger, Thomas ,  Agostini, Bruno ,  Agostini, Francesco ,  Habert, Mathieu ,  Torresin, Daniele

    IPC: F28F13/06 ,  F28D15/02 ,  F28F1/02 ,  H05K7/20

    CPC classification number: F28F13/06 ,  F28D15/0233 ,  F28D15/0266 ,  F28D15/0275 ,  F28F1/022 ,  H05K7/20145 ,  H05K7/20936

    Abstract: It is proposed a cooling unit (100) for a power electronic module arrangement. The cooling unit includes a two-phase heat exchanger (101) including a plurality of tube elements (120), each of which having at least one tube extending in a width direction (301) of the cooling unit, within and communicating between an evaporator portion (121) and a condenser portion (122) of the cooling unit (100). The tube elements are arranged in a spaced-apart manner along a depth direction (303) of the cooling unit forming cooling paths (213) for allowing an external cooling medium (130) to flow through the cooling paths, the cooling paths traversing the condenser portion in a length direction (302) of the cooling unit (100). The cooling unit further includes flow guides (141; 142) for forcing an external cooling medium (130) arriving at the heat exchanger through the cooling paths and then away from the cooling unit.

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