公开(公告)号：EP3190371A1

公开(公告)日：2017-07-12

申请号：EP16150431.1

申请日：2016-01-07

Applicant: ABB Schweiz AG

Inventor： Torresin, Daniele ,  Agostini, Bruno ,  Agostini, Francesco ,  Gradinger, Thomas ,  Habert, Mathieu

IPC: F28D15/02 ,  F28F13/00 ,  F28F1/02 ,  H05K7/20

CPC classification number: H05K7/20309 ,  F28D15/0233 ,  F28D15/0266 ,  F28D15/0275 ,  F28F1/022 ,  F28F13/00 ,  F28F2270/00 ,  F28F2275/02 ,  H05K7/20318 ,  H05K7/20327 ,  H05K7/20336 ,  H05K7/20936

Abstract: It is proposed a two-phase heat exchanger device (100) for a power-electronic module arrangement having a semiconductor module. The two-phase heat exchanger device includes a base plate (110) configured for being in contact with a first semiconductor module (201) at a first side (123) of the base plate; and at least one tube element (120) for a first cooling medium (131) including a first portion (121) having at least one evaporator channel and a second portion (122) having at least one condenser channel. The base plate has a groove (111; 112) containing the tube element, wherein the groove is dimensioned for enabling thermal contact between the base plate and the first portion of the tube element and dimensioned to form a gap (113) between the base plate and the second portion of the tube element for thermal separation of the base plate and the second portion of the tube element.

Abstract translation: 提出了一种用于具有半导体模块的功率电子模块装置的两相热交换器装置（100）。 该两相热交换器装置包括基板（110），该基板构造成在基板的第一侧（123）处与第一半导体模块（201）接触; 和用于第一冷却介质（131）的至少一个管元件（120），所述第一冷却介质包括具有至少一个蒸发器通道的第一部分（121）和具有至少一个冷凝器通道的第二部分（122）。 基板具有容纳管元件的凹槽（111; 112），其中凹槽的尺寸设定为能够实现基板与管元件的第一部分之间的热接触，并且其尺寸被设计为在基板与基板之间形成间隙（113） 以及管件的第二部分，用于热分离底板和管件的第二部分。

公开(公告)号：EP3147621A1

公开(公告)日：2017-03-29

申请号：EP15186625.8

申请日：2015-09-24

Applicant: ABB Schweiz AG

Inventor： Agostini, Francesco ,  Torresin, Daniele ,  Habert, Mathieu ,  Agostini, Bruno

IPC: F28F9/02 ,  F28D15/02

CPC classification number: H05K7/20936 ,  F28D15/025 ,  F28D15/0266 ,  F28D15/0275 ,  F28F9/0278 ,  F28F13/10 ,  H05K7/209

Abstract: A cooling device for cooling at least two power electronic devices (4) by a working fluid (61). The cooling device has a heat receiver portion of the Pulsating Heat Pipe circuit system (60) and a pair of thermo-conducting walls provided on mutually opposite sides of the heat receiver arrangement (20) and sandwiching the heat receiver portion between them. These walls are adapted for being thermally connected to a respective one of the power electronic devices. The cooling device further has a heat dissipator arrangement (40) with a heat dissipator portion of the Pulsating Heat Pipe circuit system (60) and a plurality of fins (42) thermally coupled to the heat dissipator portion for transferring heat from the heat dissipator portion to an external cooling fluid for cooling the working fluid in the heat dissipator portion. The Pulsating Heat Pipe circuit system (60) connects the heat receiver portion with the heat dissipator portion for transferring heat from the heat receiver portion to the heat dissipator portion by the Pulsating Heat Pipe action of the working fluid.

Abstract translation: 用于由工作流体（61）的冷却的至少两个电力电子器件（4）的冷却装置。 所述冷却装置具有脉动热管电路系统（60）和设置在所述热接收器装置（20）和夹持在它们之间的热接收器部分的彼此相对的两侧的一对热传导壁的热接收器部分。 这些壁angepasst用于连接到一个热respectivement电力电子器件中的一个。 所述冷却装置还具有热从所述散热器的部分耦合到用于传递环热散热器部分的散热器装置（40）与所述脉动热管电路系统（60）的部分的散热器和散热片的多个（42） 到用于冷却所述工作流体在所述散热器中的部分的外部冷却流体。 脉动热管电路系统（60）与从所述工作流体的脉动热管作用在部分热接收器部分，以所述散热器的散热部用于传递环的热的接收器部分连接。

公开(公告)号：EP3144625A1

公开(公告)日：2017-03-22

申请号：EP15186080.6

申请日：2015-09-21

Applicant: ABB Schweiz AG

Inventor： Agostini, Bruno ,  Torresin, Daniele ,  Agostini, Francesco ,  Habert, Mathieu ,  Koivuluoma, Timo

IPC: F28F3/02 ,  F28D15/02 ,  F28D15/04 ,  H01L23/427 ,  H01L23/467

CPC classification number: F28D15/046 ,  F28D15/0233 ,  F28D15/0266 ,  F28D15/0275 ,  F28D15/0283 ,  F28D15/04 ,  F28D2021/0029 ,  F28F3/02 ,  F28F3/025 ,  F28F13/10 ,  F28F2215/06 ,  H01L23/427 ,  H01L23/467

Abstract: A cooling assembly comprising a plurality of fin elements (2) stacked in a stack direction (101), a plurality of coolant channels (4) each located between adjacent fin elements (2) and extending in a coolant channel direction (102) perpendicular to the stack direction (101), a first heat transfer surface (10) adapted to be in contact with a heat generating element (19), and a second heat transfer surface (20) spaced apart from the first heat transfer surface (10), the plurality of fin elements (2) and the plurality of coolant channels (4) being located between the first heat transfer surface (10) and the second heat transfer surface (20). Each of the fin elements (2) comprises a pulsating heat pipe (6) embedded therein, a main pulsating direction of each of the pulsating heat pipes (6) being substantially parallel to a normal of the first heat transfer surface (10).

Abstract translation: 一种冷却组件，包括沿堆叠方向（101）堆叠的多个翅片元件（2），多个冷却剂通道（4），每个冷却剂通道（4）各自位于相邻的翅片元件（2）之间并且沿着与冷却剂通道方向（102）垂直的方式延伸 堆叠方向（101），适于与发热元件（19）接触的第一传热表面（10）和与第一传热表面（10）间隔开的第二传热表面（20） 多个翅片元件（2）和多个冷却剂通道（4）位于第一传热表面（10）和第二传热表面（20）之间。 每个翅片元件（2）包括嵌入其中的脉动热管（6），每个脉动热管（6）的主脉动方向基本上平行于第一传热表面（10）的法线。

公开(公告)号：EP4246077A1

公开(公告)日：2023-09-20

申请号：EP22161773.1

申请日：2022-03-14

Applicant: ABB SCHWEIZ AG

Inventor： Agostini, Bruno ,  Torresin, Daniele ,  Petrov, Andrey

IPC: F28D15/02

Abstract: The invention relates to a vapor chamber (1), comprising walls sealing off an interior space of the vapor chamber from surroundings, said walls including at least an evaporator wall (3) and a condenser wall (4). In order to obtain a reliable and efficient vapor chamber, the vapor chamber comprises porous pillars (6) with different porosity in different parts of the pillars extend into the vapor chamber from the evaporator wall for evaporating fluid (5) by a heat load (7) received via the evaporator wall (3), and a condenser section (8) at the condenser wall (4) for condensing the evaporated fluid by dissipating heat (9) to surroundings via the condenser wall (4).

公开(公告)号：EP4130631A1

公开(公告)日：2023-02-08

申请号：EP21189808.5

申请日：2021-08-05

Applicant: ABB SCHWEIZ AG

Inventor： Sologubenko, Oleksandr ,  Torresin, Daniele ,  Petrov, Andrey ,  Agostini, Bruno

IPC: F28D20/02 ,  F28D15/02 ,  F28D15/06

Abstract: A method for testing a two-phase cooling device (20) is provided. The cooling device (20) has a housing (22) surrounding a cavity (24) and a cooling medium (32) within the cavity (24). The method comprises: controlling a temperature of ambient air of the cooling device (20) such that the cooling medium (32) within the cavity (24) transitions from its liquid state to its solid state and/or from its solid state to its liquid state, while monitoring a first temperature (T1) of the cooling device (20); determining whether the monitored first temperature (T1) fulfills a predetermined criterion; and determining that the cooling device (20) is overfilled with the cooling medium (32) if the predetermined criterion is fulfilled.

公开(公告)号：EP4015972A1

公开(公告)日：2022-06-22

申请号：EP20216178.2

申请日：2020-12-21

Applicant: ABB Schweiz AG

Inventor： Torresin, Daniele ,  Agostini, Bruno ,  Petrov, Andrey

IPC: F28F1/12

Abstract: 1. A heat dissipation device (10) comprises an evaporator chamber (14) at least partially filled with a working fluid (24) to be evaporated when being heated by a heat source (12); at least one condenser chamber (16) for receiving evaporated working fluid (24) and for condensing the evaporated working fluid (24), wherein the condenser chamber (16) is interconnected with the evaporator chamber (14) in a fluid conductive manner; and at least one air fin element (18, 18') interconnected between the condenser chamber (16) and one of a further condenser chamber (16) and a side wall (20) of the heat dissipation device (10); wherein the air fin element (18, 18') has a triply periodic surface providing air fins (19).

公开(公告)号：EP3816559A1

公开(公告)日：2021-05-05

申请号：EP19206017.6

申请日：2019-10-29

Applicant: ABB Schweiz AG

Inventor： Petrov, Andrey ,  Jacimovic, Jacim ,  Boehm, Moritz ,  Agostini, Bruno ,  Torresin, Daniele

IPC: F28D15/02 ,  F28D15/04 ,  H01L23/427 ,  H05K7/20

Abstract: The invention relates to a two-phase heat transfer device (10) for dissipating heat from a heat source, for instance a power semiconductor module (26), by a heat transfer medium, wherein the two-phase heat transfer device (10) comprises a main body (12), wherein the main body (12) is formed by a body material (14) and comprises a multi-dimensional void network (16), wherein the multi-dimensional void network (16) comprises voids and is adapted for containing the heat transfer medium, wherein the multi-dimensional void network (16) is adapted such that a flow of the heat transfer medium along a path (20) through the main body (12) is based on a variation in capillary action exerted by the multi-dimensional void network (16) on the heat transfer medium along the path (20). Further the invention relates to a power semiconductor module (26) comprising the above two-phase heat transfer device (10) for heat dissipation and to a method for producing the above two-phase heat transfer device (10).

公开(公告)号：EP3813098A1

公开(公告)日：2021-04-28

申请号：EP19205351.0

申请日：2019-10-25

Applicant: ABB Schweiz AG

Inventor： Torresin, Daniele ,  Agostini, Bruno ,  Petrov, Andrey

IPC: H01L21/48 ,  F28D15/04 ,  H01L23/367 ,  H01L23/427 ,  H05K7/20

Abstract: The invention relates to a vapor chamber (10) for cooling a heat source, wherein the vapor chamber (10) comprises an evaporator (12) proceeding in a first plane (14,) and wherein the vapor chamber (10) comprises at least a first condenser (16 a ) and a second condenser (16 b ), wherein the first (16 a ) and second (16 b ) condenser are internally coupled to the evaporator (12), wherein the first condenser (16 a ) proceeds in a second plane, and the second condenser (16 b ) proceeds in a third plane, wherein the second plane and the third plane are arranged in an angle to the first plane (14), wherein at least one air fin (20) is provided, wherein the at least one an air fin (20) proceeds in a fourth plane, and wherein the first condenser (16 a ) and the second condenser (16 b ) are internally coupled to the air fin (20), and wherein the evaporator (12), the first condenser (16 a ), the second condenser (16 b ) and the air fin (20) form a common internal volume.

公开(公告)号：EP3798564A1

公开(公告)日：2021-03-31

申请号：EP19200270.7

申请日：2019-09-27

Applicant: ABB Schweiz AG

Inventor： Bortolato, Matteo ,  Agostini, Bruno ,  Petrov, Andrey ,  Torresin, Daniele

IPC: F28D15/02 ,  F28D15/04 ,  H01L23/427

Abstract: The invention relates to a vapor chamber (10), comprising a sealed casing (12) which comprises two main walls, wherein a first main wall is an evaporator wall (14) and a second main wall is a condenser wall (16), wherein the two main walls are connected by side connections (18, 20) to form a sealed volume (21) inside the two main walls and the side connections (18, 20), wherein a plurality of pillars (22) is provided in the sealed volume (21) such, that the pillars (22) connect the evaporator wall (14) and the condenser wall (16), wherein the pillars (22) have a first contact area (24) to the evaporator wall (14) and a second contact area (26) to the condenser wall (16), and wherein the pillars (22) further comprise an intermediate cross section area (28) being arranged between the first contact area (24) and the second contact area (26), wherein the extension of the intermediate cross section area (28) is smaller compared to the extension of both of the first contact area (24) and the second contact area (26).

公开(公告)号：EP3115728B1

公开(公告)日：2019-05-01

申请号：EP16175004.7

申请日：2016-06-17

Applicant: ABB Schweiz AG

Inventor： Agostini, Bruno ,  Torresin, Daniele ,  Agostini, Francesco ,  Riedel, Gernot ,  Habert, Mathieu

IPC: F28D15/02 ,  F28D15/04 ,  H01L23/427 ,  H05K7/20