Abstract:
PROBLEM TO BE SOLVED: To provide a clock data recovery circuit which is provided on a programmable logic device or coupled to the programmable logic device. SOLUTION: A programmable logic device ("PLD") includes a programmable clock data recover ("CDR") circuit in order to communicate with PLD by arbitrary one of a large number of CDR signaling protocols. The CDR circuit can be built in the PLD, or it can be made entirely or partially independent integrated circuit. The circuit can perform CDR input, CDR output, or those both. The CDR function can be provided, in combination with other non-CDR signaling function, such as non-CDR low voltage driving signaling ("LVDS"). The circuit can be a part of a large-scale system. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a clock data recovery circuitry which is provided on a programmable logic device or is coupled with the programmable logic device. SOLUTION: A programmable logic device ("PLD") is installed with a programmable clock data recover ("CDR") circuitry to allow the PLD, to communicate via any of a large number of CDR signaling protocols. The CDR circuit may be integrated with the PLD, or it may be made wholly or partly on a separate integrated circuit. The circuit may be capable of CDR input, CDR output, or both. The CDR capability may be provided, in combination with other non-CDR signaling capability, such as non-CDR low voltage differential signaling ("LVDS"). The circuit may be a part of a large-scaled system. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
A programmable logic device package comprising: a package (64); a solder ball (66) positioned on a first surface of said package, said solder ball located for receiving an external signal, a plurality of signal interface bumps (62) positioned on a second surface of the package, and a set of routing leads (68) extending through said package and connecting said solder ball to each of the plurality of signal interface bumps, wherein said set of routing leads distribute said external signal to said signal interface bumps.
Abstract:
PROBLEM TO BE SOLVED: To provide interconnection resources for increasing operation speed of a programmable logic array integrated circuit device, by application on a programmable logic device.SOLUTION: A programmable logic integrated circuit (10) has a plurality of regions (20) of programmable logic disposed on the device in an array consisting of a plurality of intersecting rows and columns of regions. Interconnection resources (e.g., interconnection conductors, etc.) are provided for making programmable interconnections to, from, and/or between the regions. At least some of these interconnection resources are provided in two forms that are architecturally similar but that have significantly different signal propagation speed characteristics. For example, a major or larger portion (200a, 210a, 230a) of such dual-form interconnection resources has speed termed normal speed, while a smaller minor portion (200b, 210b, 230b) has significantly faster signal speed.
Abstract:
PROBLEM TO BE SOLVED: To provide a circuitry to compensate for losses including diminished signal amplitude and reduced transition steepness in order to maintain accurate, high-speed data transmission.SOLUTION: Equalization circuitry (10) for receiving a digital data signal includes both feed-forward equalizer ("FFE") circuitry (30) and decision-feedback equalizer ("DFE") circuitry (90). The FFE circuitry (30) may be used to give the DFE circuitry (90) a signal that is at least minimally adequate for proper start-up of the DFE circuitry (90). Thereafter, the more the burden of the equalization task is, the more task may be shifted from the FFE circuitry (30) to the DFE circuitry (90).
Abstract:
A programmable logic device package comprising: a package (64); a solder ball (66) positioned on a first surface of said package, said solder ball located for receiving an external signal, a plurality of signal interface bumps (62) positioned on a second surface of the package, and a set of routing leads (68) extending through said package and connecting said solder ball to each of the plurality of signal interface bumps, wherein said set of routing leads distribute said external signal to said signal interface bumps.
Abstract:
PROBLEM TO BE SOLVED: To provide interconnection resources applied to programmable logic devices for accelerating an operating speed of a programmable logic array integrated circuit device.SOLUTION: A programmable logic integrated circuit (10) has a plurality of programmable logic regions (20) disposed on a device in an array of intersecting rows and columns of the plurality of regions. Interconnection resources (e.g., interconnection conductors or the like) are provided for forming programmable interconnections region to region and/or between the regions. At least some of these interconnection resources are configured in two forms having architecturally similar but significantly different signal transmission speed characteristics. For example, a major or larger portions (200a, 210a, 230a) of the dual-form interconnection resources have what is termed a normal speed, and smaller portions (200b, 210b, 230b) have a significantly faster signal speed.
Abstract:
PROBLEM TO BE SOLVED: To provide a clock data recovery circuitry provided on or associated with a programmable logic device circuitry. SOLUTION: A programmable logic device ("PLD") is augmented with programmable clock data recovery ("CDR") circuitry to allow the PLD to communicate via any one of a large number of CDR signaling protocols. The CDR circuitry may be integrated with the PLD, or it may be wholly or partly on a separate integrated circuit. The circuitry may be capable of CDR input, CDR output, or both. The CDR capability may be provided in combination with other non-CDR signaling capability such as non-CDR low voltage differential signaling ("LVDS"). The circuitry may be part of a larger system. COPYRIGHT: (C)2011,JPO&INPIT