Abstract:
A programmable logic device is adapted to predict carry values in long-chain-carry logic configurations. In the most preferred embodiment, which functions in any long-carry-chain logic configuration, each logic region calculates a result for both values of the carry-in signal to that region, and when a carry signal for the group to which the region belongs reaches the region, the correct result in each region, and thece the correct carry-out for that group, are calculated and propagated. The carry-out terminal of one group is arranged to be adjacent to the carry-in terminal of the next group, to enhance carry propagation speed. In another embodiment, each region looks back two regions to predict the carry-in. In two additional embodiments, logic is provided to mathematically calculate the carry values.
Abstract:
A programmable logic device has many regions of programmable logic, together with relatively general-purpose, programmable, interconnection resources that can be used to make interconnections between virtually any of the logic regions. In addition, various types of more local interconnection resources are associated with each logic region for facilitating the making of interconnections between adjacent or nearby logic regions without the need to use the general-purpose interconnection resources for those interconnections. The local interconnection resources support flexible clustering of logic regions via relatively direct and therefore high-speed interconnections, preferably in both horizontal and vertical directions in the typically two-dimensional array of logic regions. The logic region clustering options provided by the local interconnection resources are preferably boundary-less or substantially boundary-less within the array of logic regions.
Abstract:
A programmable logic integrated circuit device (10) has a plurality of regions (20) of programmable logic disposed on the device in a plurality of intersecting rows and columns of such regions. Interconnection resources (e.g., interconnection conductors, signal buffers/drivers, programmable connectors, etc.) are provided on the device for making programmable interconnections to, from and/or between the regions. At least some of these interconnection resources are provided in two forms that are architecturally similar (e.g., with similar and substantially parallel routing) but that have significantly different signal propagation speed characteristics. For example, a major or larger portion of such dual-form interconnection resources (200a, 210a, 230a) may have what may be termed normal signal speed, while a smaller minor portion (200b, 210b, 230b) may have significantly faster signal speed. Secondary (e.g., clock and clear) signal distribution may also be enhanced, and so may be input/output circuitry and cascade connections between adjacent or nearby logic modules on the device.
Abstract:
A programmable logic device package comprising: a package (64); a solder ball (66) positioned on a first surface of said package, said solder ball located for receiving an external signal, a plurality of signal interface bumps (62) positioned on a second surface of the package, and a set of routing leads (68) extending through said package and connecting said solder ball to each of the plurality of signal interface bumps, wherein said set of routing leads distribute said external signal to said signal interface bumps.
Abstract:
A high-performance programmable logic architecture has embedded memory (608). arranged at the peripheries or edges of the integrated circuit. This enhances the performance of the programmable logic integrated circuit by shortening the lengths of the programmable interconnect (748). In a specific embodiment, the memory blocks (703) are organized in rows along the top and bottom edges of the integrated circuit. The logic elements (805) can be directly programmable routed and connected to driver blocks (809) of the logic block in adjacent rows and columns. This permits fast interconnection of signals without using the global programmable interconnect resources (815, 825). Using similar direct programmable interconnections (828, 830, 835), the logic blocks can directly programmable connect to the memory blocks without using the global programmable interconnect resources. The present invention also provides technique of flexibly combining or stitching multiple memories together to form memories of a desired size.
Abstract:
A programmable logic device package comprising: a package (64); a solder ball (66) positioned on a first surface of said package, said solder ball located for receiving an external signal, a plurality of signal interface bumps (62) positioned on a second surface of the package, and a set of routing leads (68) extending through said package and connecting said solder ball to each of the plurality of signal interface bumps, wherein said set of routing leads distribute said external signal to said signal interface bumps.
Abstract:
A high-performance programmable logic architecture has embedded memory arranged at peripheries or edges of the integrated circuit. This enhances the performance of the programmable logic integrated circuit by shortening the lengths of the programmable interconnect (748). In a specific embodiment, the memory blocks (703,706) are organized in rows along the top and bottom edges of the integrated circuit. The logic elements can be directly programmable routed and connected to driver blocks of the logic blocks in adjacent rows and columns. This permits fast interconnection of signals without using the global programmable interconnect resources. Using similar direct programmable interconnections the logic blocks can directly programmable connect to the memory blocks without using the global programmable interconnect resources. The present invention also provides technique of flexibly combining or stitching multiple memories together to form memories of a desired size
Abstract:
A high-performance programmable logic architecture has embedded memory arranged at the peripheries or edges of the integrated circuit. This enhances the performance of the programmable logic integrated circuit by shortening the lengths of the programmable interconnect (748). In a specific embodiment, the memory blocks (703,706) are organized in rows along the top and bottom edges of the integrated circuit. The logic elements can be directly programmable routed and connected to driver blocks of the logic block in adjacent rows and columns. This permits fast interconnection of signals without using the global programmable interconnect resources. Using similar direct programmable interconnections the logic blocks can directly programmable connect to the memory blocks without using the global programmable interconnect resources.
Abstract:
PROBLEM TO BE SOLVED: To provide interconnection resources applied to programmable logic devices for accelerating an operating speed of a programmable logic array integrated circuit device. SOLUTION: A programmable logic integrated circuit (10) has a plurality of regions of programmable logic (20) disposed on the device in a plurality of intersecting rows and columns of such regions. Interconnection resources (e.g., interconnection conductors, etc.) are provided for making programmable interconnections to, from and/or between the regions. At least some of these interconnection resources are provided in two forms having architecturally similar but significantly different signal propagation speed characteristics. For example, a major or larger portion of such dual-form interconnection resources (200a, 210a, 230a) may have what may be termed normal signal speed, while a smaller minor portion (200b, 210b, 230b) may have significantly faster signal speed. COPYRIGHT: (C)2009,JPO&INPIT