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公开(公告)号:AU2018203006B2
公开(公告)日:2019-11-07
申请号:AU2018203006
申请日:2018-05-01
Applicant: APPLE INC
Inventor: JOHANNESSEN THOMAS , COLEMAN MICHAEL P , WOODHULL CHARLES B , KIPLE BRYAN P , PAKULA DAVID A , TAN TANG Y , HELEY RICHARD W , WEBER DOUGLAS J , PREST CHRISTOPHER D , MEMERING DALE N
IPC: H04B1/38
Abstract: Abstract Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.
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公开(公告)号:AU2016201649A1
公开(公告)日:2016-04-07
申请号:AU2016201649
申请日:2016-03-15
Applicant: APPLE INC
Inventor: WOODHULL CHARLES B , KIPLE BRYAN P , PAKULA DAVID A , TAN TANG Y , HELEY RICHARD W , WEBER DOUGLAS J , PREST CHRISTOPHER D , MEMERING DALE N , JOHANNESSEN THOMAS , COLEMAN MICHAEL P
IPC: H04B1/38
Abstract: Abstract Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one 5 or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.
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公开(公告)号:AU2013267596B2
公开(公告)日:2015-12-17
申请号:AU2013267596
申请日:2013-05-28
Applicant: APPLE INC
Inventor: WOODHULL CHARLES B , KIPLE BRYAN P , PAKULA DAVID A , TAN TANG Y , HELEY RICHARD W , WEBER DOUGLAS J , PREST CHRISTOPHER D , MEMERING DALE N , JOHANNESSEN THOMAS , COLEMAN MICHAEL P
IPC: H04B1/38
Abstract: Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.
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公开(公告)号:AU2010257134A1
公开(公告)日:2011-12-01
申请号:AU2010257134
申请日:2010-03-31
Applicant: APPLE INC
Inventor: PREST CHRISTOPHER D , MATTHEW ROHRBACH
Abstract: Plugs with core structural members (110, 210) and methods for manufacturing plugs with core structural members are provided. A plug can include a core structural member (110, 210) that may increase the structural integrity of the plug. The plug can further include contact pads (251, 252, 253, 254) and traces (261, 262, 263, 264), and each trace can electrically couple with one of the contact pads and extend along a plug axis (205) towards the proximal end (e.g., base section) of the plug. In orientation-specific embodiments, the traces may be disposed on the surface of the plug. However, in other embodiments, the traces may be disposed below but near the surface of the plug. The plug may also include one or more insulating layers (220) to prevent contact pads and traces from shorting.
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公开(公告)号:AU2020200881A1
公开(公告)日:2020-02-27
申请号:AU2020200881
申请日:2020-02-07
Applicant: APPLE INC
Inventor: WOODHULL CHARLES B , KIPLE BRYAN P , PAKULA DAVID A , TAN TANG Y , HELEY RICHARD W , WEBER DOUGLAS J , PREST CHRISTOPHER D , MEMERING DALE N , JOHANNESSEN THOMAS , COLEMAN MICHAEL P
IPC: H04B1/38
Abstract: Abstract Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.
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公开(公告)号:AU2013260725B2
公开(公告)日:2014-08-14
申请号:AU2013260725
申请日:2013-11-22
Applicant: APPLE INC
Inventor: PREST CHRISTOPHER D , ROHRBACH MATTHEW
Abstract: Abstract Plugs with core structural members (110, 210) and methods for manufacturing plugs with core structural members are provided. A plug can include a core structural member (110, 210) that may increase the structural integrity of the plug. The plug can 0 further include contact pads (251, 252, 253, 254) and traces (261, 262, 263, 264), and each trace can electrically couple with one of the contact pads and extend along a plug axis (205) towards the proximal end (e.g., base section) of the plug. In orientation-specific embodiments, the traces may be disposed on 5 the surface of the plug. However, in other embodiments, the traces may be disposed below but near the surface of the plug. The plug may also include one or more insulating layers (220) to prevent contact pads and traces from shorting.
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公开(公告)号:AU2010257134B2
公开(公告)日:2013-08-22
申请号:AU2010257134
申请日:2010-03-31
Applicant: APPLE INC
Inventor: PREST CHRISTOPHER D , ROHRBACH MATTHEW
Abstract: Plugs with core structural members (110, 210) and methods for manufacturing plugs with core structural members are provided. A plug can include a core structural member (110, 210) that may increase the structural integrity of the plug. The plug can further include contact pads (251, 252, 253, 254) and traces (261, 262, 263, 264), and each trace can electrically couple with one of the contact pads and extend along a plug axis (205) towards the proximal end (e.g., base section) of the plug. In orientation-specific embodiments, the traces may be disposed on the surface of the plug. However, in other embodiments, the traces may be disposed below but near the surface of the plug. The plug may also include one or more insulating layers (220) to prevent contact pads and traces from shorting.
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公开(公告)号:AU2011326123A1
公开(公告)日:2013-05-09
申请号:AU2011326123
申请日:2011-11-08
Applicant: APPLE INC
Inventor: PREST CHRISTOPHER D , ZADESKY STEPHEN P , WEBER TRENT , BROWNING LUCY E
IPC: H01L23/043 , G06F1/16 , H01L23/047 , H01L23/053 , H01L23/057 , H01L23/10
Abstract: An electronic device having a unitary housing is disclosed. The device can include a first housing component having an open cavity, an internal electronic part disposed within the cavity, a second housing component disposed across the cavity, and a support feature disposed within the cavity and arranged to support the second housing component. The first housing component can be formed from metal, while the second housing component can be formed from a plurality of laminated foil metal layers. The second housing component can be attached to the first housing component via one or more ultrasonic welds, such that a fully enclosed housing is created. The fully enclosed housing can be hermetically sealed, and the outside surfaces thereof can be machined or otherwise finished after the ultrasonic welding.
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公开(公告)号:AU2010273845A1
公开(公告)日:2012-02-02
申请号:AU2010273845
申请日:2010-06-22
Applicant: APPLE INC
Inventor: PREST CHRISTOPHER D , ZADESKY STEPHEN P , PAKULA DAVID A
IPC: H01L51/52
Abstract: An electronic device may have a display. The display may have active components such as display pixels formed on a display substrate layer. The display substrate layer may be formed from a glass substrate layer. Thin-film transistors and other components for the display pixels may be formed on the glass substrate. An encapsulation glass layer may be bonded to the glass substrate using a ring-shaped bond structure. The ring- shaped bond structure may extend around the periphery of the encapsulation glass layer and the substrate glass layer. The bond structure may be formed from a glass frit, a solid glass ring, integral raised glass portions of the glass layers, meltable metal alloys, or other bond materials. Chemical and physical processing operations may be used to temper the glass layers, to perform annealing operations, to preheat the glass layers, and to promote adhesion.
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20.
公开(公告)号:AU2008203892B2
公开(公告)日:2011-01-27
申请号:AU2008203892
申请日:2008-01-03
Applicant: APPLE INC
Inventor: SANFORD EMERY A , RUSSELL-CLARK PETER , HANKEY M EVANS , IULIIS DANIELE DE , PREST CHRISTOPHER D
Abstract: A headset connector system for interfacing with a headset accessory including at least two headset accessory electrical contacts (6290,6292), the headset connector system comprising: a tube housing (1110); a connector plate (6040) fixed within the tube housing (1110) and formed from a ferromagnetic material, the connector plate (6040) comprising a mating face and at least two apertures through the mating face; a non-conductive casing (5603) comprising at least two protruding members, each protruding member extending through a respective one of the at least two apertures; and at least two electrical contacts (5561,5562), wherein each contact is electrically insulated from the connector plate by a protruding member of the casing, and wherein each of the at least two electrical contacts is operative to couple with one of the at least two headset accessory electrical contacts.
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