Audio plug with core structural member

    公开(公告)号:AU2010257134A1

    公开(公告)日:2011-12-01

    申请号:AU2010257134

    申请日:2010-03-31

    Applicant: APPLE INC

    Abstract: Plugs with core structural members (110, 210) and methods for manufacturing plugs with core structural members are provided. A plug can include a core structural member (110, 210) that may increase the structural integrity of the plug. The plug can further include contact pads (251, 252, 253, 254) and traces (261, 262, 263, 264), and each trace can electrically couple with one of the contact pads and extend along a plug axis (205) towards the proximal end (e.g., base section) of the plug. In orientation-specific embodiments, the traces may be disposed on the surface of the plug. However, in other embodiments, the traces may be disposed below but near the surface of the plug. The plug may also include one or more insulating layers (220) to prevent contact pads and traces from shorting.

    Audio plug with core structural member

    公开(公告)号:AU2013260725B2

    公开(公告)日:2014-08-14

    申请号:AU2013260725

    申请日:2013-11-22

    Applicant: APPLE INC

    Abstract: Abstract Plugs with core structural members (110, 210) and methods for manufacturing plugs with core structural members are provided. A plug can include a core structural member (110, 210) that may increase the structural integrity of the plug. The plug can 0 further include contact pads (251, 252, 253, 254) and traces (261, 262, 263, 264), and each trace can electrically couple with one of the contact pads and extend along a plug axis (205) towards the proximal end (e.g., base section) of the plug. In orientation-specific embodiments, the traces may be disposed on 5 the surface of the plug. However, in other embodiments, the traces may be disposed below but near the surface of the plug. The plug may also include one or more insulating layers (220) to prevent contact pads and traces from shorting.

    Audio plug with core structural member

    公开(公告)号:AU2010257134B2

    公开(公告)日:2013-08-22

    申请号:AU2010257134

    申请日:2010-03-31

    Applicant: APPLE INC

    Abstract: Plugs with core structural members (110, 210) and methods for manufacturing plugs with core structural members are provided. A plug can include a core structural member (110, 210) that may increase the structural integrity of the plug. The plug can further include contact pads (251, 252, 253, 254) and traces (261, 262, 263, 264), and each trace can electrically couple with one of the contact pads and extend along a plug axis (205) towards the proximal end (e.g., base section) of the plug. In orientation-specific embodiments, the traces may be disposed on the surface of the plug. However, in other embodiments, the traces may be disposed below but near the surface of the plug. The plug may also include one or more insulating layers (220) to prevent contact pads and traces from shorting.

    Unitary housing for electronic device

    公开(公告)号:AU2011326123A1

    公开(公告)日:2013-05-09

    申请号:AU2011326123

    申请日:2011-11-08

    Applicant: APPLE INC

    Abstract: An electronic device having a unitary housing is disclosed. The device can include a first housing component having an open cavity, an internal electronic part disposed within the cavity, a second housing component disposed across the cavity, and a support feature disposed within the cavity and arranged to support the second housing component. The first housing component can be formed from metal, while the second housing component can be formed from a plurality of laminated foil metal layers. The second housing component can be attached to the first housing component via one or more ultrasonic welds, such that a fully enclosed housing is created. The fully enclosed housing can be hermetically sealed, and the outside surfaces thereof can be machined or otherwise finished after the ultrasonic welding.

    Display modules
    19.
    发明专利

    公开(公告)号:AU2010273845A1

    公开(公告)日:2012-02-02

    申请号:AU2010273845

    申请日:2010-06-22

    Applicant: APPLE INC

    Abstract: An electronic device may have a display. The display may have active components such as display pixels formed on a display substrate layer. The display substrate layer may be formed from a glass substrate layer. Thin-film transistors and other components for the display pixels may be formed on the glass substrate. An encapsulation glass layer may be bonded to the glass substrate using a ring-shaped bond structure. The ring- shaped bond structure may extend around the periphery of the encapsulation glass layer and the substrate glass layer. The bond structure may be formed from a glass frit, a solid glass ring, integral raised glass portions of the glass layers, meltable metal alloys, or other bond materials. Chemical and physical processing operations may be used to temper the glass layers, to perform annealing operations, to preheat the glass layers, and to promote adhesion.

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