Abstract:
A substrate is provided with device structures and metrology structures (800). The device structures include materials exhibiting inelastic scattering of excitation radiation of one or more wavelengths. The device structures include structures small enough in one or more dimensions that the characteristics of the inelastic scattering are influenced significantly by quantum confinement. The metrology structures (800) include device-like structures (800b) similar in composition and dimensions to the device features, and calibration structures (800a). The calibration structures are similar to the device features in composition but different in at least one dimension. Using an inspection apparatus and method implementing Raman spectroscopy, the dimensions of the device-like structures can be measured by comparing spectral features of radiation scattered inelastically from the device-like structure and the calibration structure.
Abstract:
A spectroscopic scatterometer detects both zero order and higher order radiation diffracted from an illuminated spot on a target grating. The apparatus forms and detects a spectrum of zero order (reflected) radiation, and separately forms and detects a spectrum of the higher order diffracted radiation. Each spectrum is formed using a symmetrical phase grating, so as to form and detect a symmetrical pair of spectra. The pair of spectra can be averaged to obtain a single spectrum with reduced focus sensitivity. Comparing the two spectra can yield information for improving height measurements in a subsequent lithographic step. The target grating is oriented obliquely so that the zero order and higher order radiation emanate from the spot in different planes. Two scatterometers can operate simultaneously, illuminating the target from different oblique directions. A radial transmission filter reduces sidelobes in the spot and reduces product crosstalk.
Abstract:
A lithographic system has a lithographic apparatus, an inspection system and a controller. The lithographic apparatus includes a projection system configured to project a radiation beam onto a layer of material on or above a substrate. The inspection system is configured to inspect a pattern formed on the substrate. The pattern is formed on the substrate by application of the radiation beam. The controller is configured to control the lithographic apparatus to form a pattern based on data from an inspection by the inspection system of a previously exposed pattern.
Abstract:
An article such as an EUV (extreme ultraviolet) lithography reticle is inspected to detect contaminant particles. The inspection apparatus (900) comprises illumination optics (602) with primary radiation (λρ). An imaging optical system with plural branches is arranged to form and detect a plurality of images, each branch having an image sensor (610,910) and forming its image with a different portion of radiation received from the illuminated article. A processor (PU) combines information from the detected images to report on the presence and location of contaminant particles. In one or more branches the primary radiation is filtered out(612), so that the detected image is formed using only secondary radiation emitted by contaminant material in response to the primary radiation. In a dark field imaging branch using the scattered primary radiation, a spatial filter (918) blocks spatial frequency components associated with periodic features of the article under inspection, to allow detection of particles which cannot be detected by secondary radiation.
Abstract:
An object provided with a particular alignment arrangement for use in aligning the object and a further object with respect to each other is disclosed. The alignment arrangement includes a first fine alignment mark in the form of a substantially regular grating, and a second coarse alignment mark located in the same area as the first alignment mark.
Abstract:
Methods of inspection and apparatus usable, for example, in the manufacture of devices by lithographic techniques to detect processing faults on semiconductor wafers. Illuminating a strip of a die along a scan path with a moving measurement spot. Detecting scattered radiation to obtain an angle-resolved spectrum that is spatially integrated over the strip. Comparing the scattering data with a library of reference spectra, obtained by measurement or calculation. Based on the comparison, determining the presence of a fault of the die at the strip. The measurement spot is scanned across the wafer in a scan path trajectory comprising large (constant) velocity portions and the acquisition of the angle-resolved spectrum is taken, and comparisons are done, at full scan speed. If a long acquisition is performed along a strip across the die in the Y direction, then variation in the acquired spectrum resulting from position variation will primarily depend on the X position of the spot. Spot position variation will occur because no alignment of the spot to the wafer is performed along the high-speed scan path trajectory. A library of reference spectra are obtained for a range of scan paths at respective X- positions on the die to allow for variation in the X position of the high-speed measurement spot.
Abstract:
A metrology device for inspecting a substrate is provided. In an embodiment, the metrology device includes a remote radiation source device, an optical system for creating a radiation beam, and an optical fibre for transferring radiation from the optical system to the location where the metrology operations are performed. The optical system includes a control system that includes a deformable mirror, a detector that detects the position of a radiation beam, and a controller that produces a control signal for input into the deformable mirror, the control signal being based on the detected position of the radiation. In this way, the shape of the deformable mirror can be used to control the position of the radiation beam output by the optical system into the optical fibre.
Abstract:
A inspection apparatus, method, and system associated therewith are described herein. In a non-limiting embodiment, a inspection apparatus includes an optical system and an imaging system. The optical system may be configured to output an illumination beam incident on a target including one or more features, and the illumination beam being polarized with a first polarization when incident on the target. The imaging system may be configured to obtain intensity data representing at least a portion of the illumination beam scattered by the one or more features, where the portion of the illumination beam has a second polarization orthogonal to the first polarization; generate image data representing an image of each of the feature(s) based on the intensity data; and determine a measurement of a parameter of interest associated with the feature(s) based on an amount of the portion of the illumination beam having the second polarization.
Abstract:
An apparatus (AS) measures positions of marks (202) on a lithographic substrate (W). An illumination arrangement (940, 962, 964) provides off-axis radiation from at least first and second regions. The first and second source regions are diametrically opposite one another with respect to an optical axis (O) and are limited in angular extent. The regions may be small spots selected according to a direction of periodicity of a mark being measured, or larger segments. Radiation at a selected pair of source regions can be generated by supplying radiation at a single source feed position to a self-referencing interferometer. A modified half wave plate is positioned downstream of the interferometer, which can be used in the position measuring apparatus. The modified half wave plate has its fast axis in one part arranged at 45° to the fast axis in another part diametrically opposite.
Abstract:
A metrology apparatus is arranged to illuminate a plurality of targets with an off-axis illumination mode. Images of the targets are obtained using only one first order diffracted beam. Where the target is a composite grating, overlay measurements can be obtained from the intensities of the images of the different gratings. Overlay measurements can be corrected for errors caused by variations in the position of the gratings in an image field.