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11.发明公开公开(公告)号：US20240118629A1
公开(公告)日：2024-04-11
申请号：US17766585
申请日：2020-10-05
Applicant: ASML NETHERLANDS B.V.
Inventor： Aliasghar KEYVANI JANBAHAN , Frans Reinier SPIERING , Jochem Sebastiaan WILDENBERG , Everhardus Cornelis MOS
IPC: G03F7/00
CPC classification number: G03F7/706839 , G03F7/706837 , G03F7/70625 , G03F7/70633 , G03F7/70641
Abstract: A method of processing measurement data relating to a substrate processed by a manufacturing process. The method includes obtaining measurement data relating to a performance parameter for at least a portion of the substrate; and fitting the measurement data to a model by minimizing a complexity metric applied to fitting parameters of the model while not allowing the deviation between the measurement data and the fitted model to exceed a threshold value.
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公开(公告)号：US20230141495A1
公开(公告)日：2023-05-11
申请号：US17916746
申请日：2021-03-10
Applicant: ASML Netherlands B.V.
Inventor： Hugo Augustinus Joseph CRAMER , Patricius Aloysius Jacobus TINNEMANS , Jeroen Arnoldus Leonardus Johannes RAAYMAKERS , Jochem Sebastiaan WILDENBERG
IPC: G03F7/20
CPC classification number: G03F7/70525 , G03F7/70625 , G03F7/70633
Abstract: Disclosed is a method of determining a sampling scheme. The method comprises obtaining a parallel sensor description and identifying a plurality of candidate acquisition configurations based on said parallel sensor description and potential metrology locations. Each of said candidate acquisition configurations is evaluated in terms of an evaluation metric and a candidate acquisition configuration is selected based on said evaluation. The corresponding metrology locations for the selected acquisition configuration is added to the sampling scheme.
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公开(公告)号：US20220187714A1
公开(公告)日：2022-06-16
申请号：US17686586
申请日：2022-03-04
Applicant: ASML NETHERLANDS B.V.
Abstract: A method for selecting an optimal set of locations for a measurement or feature on a substrate, the method includes: defining a first candidate solution of locations, defining a second candidate solution with locations based on modification of a coordinate in a solution domain of the first candidate solution, and selecting the first and/or second candidate solution as the optimal solution according to a constraint associated with the substrate.
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14.发明申请公开(公告)号：US20220155698A1
公开(公告)日：2022-05-19
申请号：US17440251
申请日：2020-03-19
Applicant: ASML NETHERLANDS B.V.
Inventor： Kevin VAN DE RUIT , Roy WERKMAN , Jochem Sebastiaan WILDENBERG
Abstract: A method of determining a set of metrology point locations, the set including a subset of potential metrology point locations on a substrate, the method including: determining a relation between noise distributions associated with a plurality of the potential metrology point locations using existing knowledge; and using the determined relation and a model associated with the substrate to determine the set.
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公开(公告)号：US20210271171A1
公开(公告)日：2021-09-02
申请号：US17055215
申请日：2019-04-02
Applicant: ASML NETHERLANDS B.V.
Inventor： Svetla Petrova MATOVA , Jochem Sebastiaan WILDENBERG , Roy WERKMAN , Luc ROUMEN
IPC: G03F7/20
Abstract: A method for estimating a parameter across a region on a substrate, the region being divided into a plurality of sub-regions, the method including: obtaining values of the parameter for at least two sub-regions out of the plurality of sub-regions; and estimating the parameter for a position on the region by evaluation of a function having said values of the parameter as input values, wherein the function: a) has piecewise defined base functions, wherein a single base function is defined across a sub-region; and b) is continuous between one or more adjacent sub-regions of the at least two sub-regions within the region.
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Patent Agency Ranking
16.发明申请公开(公告)号：US20190278188A1
公开(公告)日：2019-09-12
申请号：US16351873
申请日：2019-03-13
Applicant: ASML Netherlands B.V.
Inventor： Alexander YPMA , Jasper MENGER , David DECKERS , David HAN , Adrianus Cornelis Matheus KOOPMAN , Irina LYULINA , Scott Anderson MIDDLEBROOKS , Richard Johannes Franciscus VAN HAREN , Jochem Sebastiaan WILDENBERG
Abstract: In a lithographic process, product units such as semiconductor wafers are subjected to lithographic patterning operations and chemical and physical processing operations. Alignment data or other measurements are made at stages during the performance of the process to obtain object data representing positional deviation or other parameters measured at points spatially distributed across each unit. This object data is used to obtain diagnostic information by performing a multivariate analysis to decompose a set of vectors representing the units in the multidimensional space into one or more component vectors. Diagnostic information about the industrial process is extracted using the component vectors. The performance of the industrial process for subsequent product units can be controlled based on the extracted diagnostic information.
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公开(公告)号：US20240061346A1
公开(公告)日：2024-02-22
申请号：US18270644
申请日：2021-12-23
Applicant: ASML NETHERLANDS B.V.
Inventor： Thomas THEEUWES , Jochem Sebastiaan WILDENBERG , Lei ZHANG , Ronald VAN ITHERSUM
IPC: G03F7/00
CPC classification number: G03F7/706837 , G03F7/706839
Abstract: Disclosed is a method of determining a performance parameter or a parameter derived therefrom, the performance parameter being associated with a performance of a lithographic process for forming one or more structures on a substrate subject to the lithographic process. The method comprises obtaining a probability description distribution comprising a plurality of probability descriptions of the performance parameter, each probability description corresponding to a different position on the substrate and decomposing each probability description into a plurality of component probability descriptions to obtain a plurality of component probability description distributions. A component across-substrate-area model is determined for each of said plurality of component probability descriptions, which models its respective component probability description across a substrate area; and a value for said performance parameter or parameter derived therefrom is determined based on the component across-substrate-area models.
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公开(公告)号：US20240036479A1
公开(公告)日：2024-02-01
申请号：US18281614
申请日：2022-03-08
Applicant: ASML NETHERLANDS B.V.
Inventor： Roy WERKMAN , Jochem Sebastiaan WILDENBERG , Manouk RIJPSTRA
IPC: G03F7/00
CPC classification number: G03F7/70525 , G03F7/70625 , G03F7/70633 , G03F7/70641
Abstract: A method of optimizing a target layout for a patterning device and a sampling scheme for measuring the targets of the target layout exposed on a substrate, the method including co-optimizing the target layout and the sampling scheme to obtain an optimized target layout for the patterning device and an optimized sampling scheme for measuring the targets of the optimized target layout exposed on a substrate.
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公开(公告)号：US20230082858A1
公开(公告)日：2023-03-16
申请号：US17797506
申请日：2021-01-14
Applicant: ASML NETHERLANDS B.V.
Inventor： Jochem Sebastiaan WILDENBERG , Hermanus Adrianus DILLEN , Fan FENG , Ronald VAN ITTERSUM , Willem Louis VAN MIERLO , Koen THUIJS
IPC: G03F7/20
Abstract: A method and associated apparatuses for controlling a process of manufacturing semiconductor devices on a substrate. The method includes obtaining process data relating to the process and determining a correction for the process based on the process data and a first control objective associated with the devices on the substrate. A first probability of the first control objective being achievable is determined and the correction adjusted based on the probability and at least a second control objective having a second probability of being achievable compared to the first control objective.
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20.发明申请公开(公告)号：US20220326623A1
公开(公告)日：2022-10-13
申请号：US17836099
申请日：2022-06-09
Applicant: ASML Netherlands B.V.
Inventor： Alexander YPMA , Jasper MENGER , David DECKERS , David HAN , Adrianus Cornelis Matheus KOOPMAN , Irina LYULINA , Scott Anderson MIDDLEBROOKS , Richard Johannes Franciscus VAN HAREN , Jochem Sebastiaan WILDENBERG
IPC: G03F7/20
Abstract: In a lithographic process, product units such as semiconductor wafers are subjected to lithographic patterning operations and chemical and physical processing operations. Alignment data or other measurements are made at stages during the performance of the process to obtain object data representing positional deviation or other parameters measured at points spatially distributed across each unit. This object data is used to obtain diagnostic information by performing a multivariate analysis to decompose a set of vectors representing the units in the multidimensional space into one or more component vectors. Diagnostic information about the industrial process is extracted using the component vectors. The performance of the industrial process for subsequent product units can be controlled based on the extracted diagnostic information.
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