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    METHOD FOR REVERSIBLY MOUNTING A DEVICE WAFER TO A CARRIER SUBSTRATE
    13.
    发明专利
    METHOD FOR REVERSIBLY MOUNTING A DEVICE WAFER TO A CARRIER SUBSTRATE 未知

    公开(公告)号：CA2711266A1

    公开(公告)日：2009-07-30

    申请号：CA2711266

    申请日：2009-01-23

    Applicant: BREWER SCIENCE INC

    Inventor： FLAIM TONY D ,  MCCUTCHEON JEREMY

    IPC: H01L23/12 ,  H01L23/48

    Abstract: New temporary bonding methods and articles formed from those methods are provided. The methods comprise bonding a device wafer to a carrier wafer or substrate only at their outer perimeters in order to assist in protecting the device wafer and its device sites during subsequent processing and handling. The edge bonds formed by this method are chemically and thermally resistant, but can also be softened, dissolved, or mechanically disrupted to allow the wafers to be easily separated with very low forces and at or near room temperature at the appropriate stage in the fabrication process.

    15.
    发明专利
    未知

    公开(公告)号：DE69518171T2

    公开(公告)日：2001-03-15

    申请号：DE69518171

    申请日：1995-12-14

    Applicant: BREWER SCIENCE INC

    Inventor： FLAIM TONY D ,  MEADOR JIM D ,  SHAO XIE ,  BREWER TERRY L

    IPC: C08G59/16 ,  C08G59/14 ,  C08G59/40 ,  C08G59/68 ,  C08L63/00 ,  C09D163/00 ,  G03F7/09

    Abstract: A thermosetting anti-reflective coating and method for making and using the same is disclosed for a broad range of exposure wavelengths, said coating containing an active curing catalyst, ether or ester linkages derived from epoxy functionality greater than 3.0, a dye-grafted hydroxyl-functional oligomer, and an alkylated aminoplast crosslinking agent, all present in a low-to-medium alcohol-containing solvent.

    16.
    发明专利
    未知

    公开(公告)号：DE69518171D1

    公开(公告)日：2000-08-31

    申请号：DE69518171

    申请日：1995-12-14

    Applicant: BREWER SCIENCE INC

    Inventor： FLAIM TONY D ,  MEADOR JIM D ,  SHAO XIE ,  BREWER TERRY L

    IPC: C08G59/16 ,  C08G59/14 ,  C08G59/40 ,  C08G59/68 ,  C08L63/00 ,  C09D163/00 ,  G03F7/09

    Abstract: A thermosetting anti-reflective coating and method for making and using the same is disclosed for a broad range of exposure wavelengths, said coating containing an active curing catalyst, ether or ester linkages derived from epoxy functionality greater than 3.0, a dye-grafted hydroxyl-functional oligomer, and an alkylated aminoplast crosslinking agent, all present in a low-to-medium alcohol-containing solvent.

    THERMOSETTING POLYESTER ANTI-REFLECTIVE COATINGS FOR MULTILAYER PHOTORESIST PROCESSES
    17.
    发明专利
    THERMOSETTING POLYESTER ANTI-REFLECTIVE COATINGS FOR MULTILAYER PHOTORESIST PROCESSES 未知

    公开(公告)号：CA2305461A1

    公开(公告)日：1999-04-29

    申请号：CA2305461

    申请日：1998-10-20

    Applicant: BREWER SCIENCE INC

    Inventor： SHAO XIE ,  HESTER COLIN ,  FLAIM TONY D ,  BREWER TERRY L

    IPC: G03F7/11 ,  C08G63/54 ,  C09D167/00 ,  G03F7/09 ,  G03C1/492

    Abstract: Thermosetting, bottom-applied polymeric anti-reflective coatings exhibiting high optical density, rapid plasma etch rates, high solubility in preferred coating solvents, excellent feature coverage, and improved stability in solution are disclosed. The principal component of these new anti-reflective coatings is a polyester resin produced by the reaction of one or more difunctional aliphatic carboxylic acids with a stoichiometric excess of a diand/or a trifunctional aliphatic primary alcohol, wherein at least one of the dicarboxylic acids may contain a reactive methylene (-CH2-) group. The resulting polyester resin reaction product is further modified by attaching light-absorbing groups to some or all of the reactive methylene groups (if present) and/or hydroxy groups present on the resin. The dye-attached polyester resin is combined with an aminoplast crosslinking agent and acid catalyst in a suitable solvent system to form the final anti-reflective coating.

    POLYIMIDES AS LASER RELEASE MATERIALS FOR 3-D IC APPLICATIONS
    18.
    发明专利
    POLYIMIDES AS LASER RELEASE MATERIALS FOR 3-D IC APPLICATIONS 未知

    公开(公告)号：SG11201700478YA

    公开(公告)日：2017-02-27

    申请号：SG11201700478Y

    申请日：2015-07-22

    Applicant: BREWER SCIENCE INC

    Inventor： LIU XIAO ,  BAI DONGSHUN ,  FLAIM TONY D ,  ZHONG XING-FU ,  WU QI

    IPC: H01L21/58

    Abstract: The invention broadly relates to release layer compositions that enable thin wafer handling during microelectronics manufacturing. Preferred release layers are formed from compositions comprising a polyamic acid or polyimide dissolved or dispersed in a solvent system, followed by curing and/or solvent removal at about 250° C. to about 350° C. for less than about 10 minutes, yielding a thin film. This process forms the release compositions into polyimide release layers that can be used in temporary bonding processes, and laser debonded after the desired processing has been carried out.

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