公开(公告)号：EP2365308A2

公开(公告)日：2011-09-14

申请号：EP11152364.3

申请日：2011-01-27

Applicant: Delphi Technologies, Inc.

Inventor： Borzabadi, Hamid R. ,  Wilcox, Ronald D. ,  Kuznia, Philip D. ,  Vas, Timothy A. ,  Little, Lewis Henry ,  Miller, David G.

IPC: G01L9/00

CPC classification number: G01L19/0654 ,  G01L19/147

Abstract: An engine control module (10) having an environmentally-sealed housing (12, 12a) includes a housing-mounted air pressure sensor (18) for providing a reliable measure of atmospheric air pressure to a control circuit (14a) mounted within the housing (12, 12a). The sensor (18) is mounted on an inboard face of the housing (12a), and includes a sensor element (18a), a body portion (18b) and a riser portion (18c). The sensor element (18a) is mounted in the body portion (18b), and the riser portion (18c) protrudes through an opening (20) in the housing (12a) to couple the sensor element (18a) to atmospheric pressure outside the housing (12, 12a). The body portion (18b) is sealingly secured to the inboard face of the housing (12a), and a set of conductor pins (26) molded into the body portion (18b) extend inward to engage a circuit board (14) enclosed by the housing (12, 12a), and thereby directly couple the sensor element (18a) to the ECM's control circuit (14a). The top of the riser portion (18c) is capped by a splash-proof lid (24) to prevent water intrusion.

Abstract translation: 具有环境密封的壳体（12,12a）的发动机控制模块（10）包括壳体安装的空气压力传感器（18），用于向安装在壳体内的控制电路（14a）提供可靠的大气压力测量值 12,12a）。 传感器（18）安装在壳体（12a）的内侧面上，并包括传感器元件（18a），主体部分（18b）和立管部分（18c）。 传感器元件（18a）安装在主体部分（18b）中，并且提升部分（18c）通过壳体（12a）中的开口（20）突出，以将传感器元件（18a）耦合到壳体外部的大气压力 （12,12a）。 主体部分（18b）密封地固定在壳体（12a）的内侧面上，并且一组模制到主体部分（18b）中的导体销（26）向内延伸以与电路板（14）包围 壳体（12,12a），从而将传感器元件（18a）直接耦合到ECM的控制电路（14a）。 提升部分（18c）的顶部由防溅盖（24）盖住以防止水侵入。

公开(公告)号：EP1806565A1

公开(公告)日：2007-07-11

申请号：EP06077303.3

申请日：2006-12-22

Applicant: Delphi Technologies, Inc.

Inventor： Manlove, Gregory J. ,  Long, Stephen P. ,  Borzabadi, Hamid R. ,  Vas, Timothy A. ,  Hawes, Kevin J.

IPC: G01D11/24 ,  G01P1/02

CPC classification number: G01D11/245 ,  G01P1/023

Abstract: A sensor module (10) is provided having a compact housing (12) containing a sensor (22). A low temperature co-fired ceramic substrate (20) is located on the housing (12). The sensor (22) and signal processing circuitry (24) are located on the low temperature co-fired ceramic substrate (20). The sensor module (10) further includes a metal shield (26, 28) substantially encapsulating the sensor (22).

Abstract translation: 传感器模块（10）设置有具有包含传感器（22）的紧凑壳体（12）。 低温共烧陶瓷基板（20）位于壳体（12）上。 传感器（22）和信号处理电路（24）位于低温共烧陶瓷基片（20）上。 传感器模块（10）还包括基本上封装传感器（22）的金属屏蔽（26,28）。

公开(公告)号：EP1333504A3

公开(公告)日：2007-01-31

申请号：EP03075163.0

申请日：2003-01-17

Applicant: Delphi Technologies, Inc.

Inventor： Chavan, Abhijeet V. ,  Logsdon, James H. ,  Chilcott, Dan W. ,  Lee, Han-Sheng ,  Lambert, David K. ,  Vas, Timothy A.

IPC: H01L35/02 ,  H01L35/08

CPC classification number: G01J5/14 ,  G01J5/12

Abstract: An integrated sensor (10) comprising a thermopile transducer (12) and signal processing circuitry (4) that are combined on a single semiconductor substrate (20), such that the transducer output signal is sampled in close vicinity by the processing circuitry (14). The sensor (10) comprises a frame (18) formed of a semiconductor material that is not heavily doped, and with which a diaphragm (16) is supported. The diaphragm (16) has a first surface for receiving thermal (e.g., infrared) radiation, and comprises multiple layers that include a sensing layer containing at least a pair of interlaced thermopiles (22). Each thermopile (22) comprises a sequence of thermocouples (24), each thermocouple (24) comprising dissimilar electrically-resistive materials that define hot junctions (26) located on the diaphragm (16) and cold junctions (28) located on the frame (18). The signal processing circuitry (14) is located on the frame (18) and electrically interconnected with the thermopiles (22). The thermopiles (22) are interlaced so that the output of one of the thermopiles (22) increases with increasing temperature difference between the hot and cold junctions (26,28) thereof, while the output of the second thermopile (22) decreases with increasing temperature difference between its hot and cold junctions (26,28).