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    Sensor module
    1.
    发明公开
    Sensor module 审中-公开
    Sensormodul

    公开(公告)号：EP1806565A1

    公开(公告)日：2007-07-11

    申请号：EP06077303.3

    申请日：2006-12-22

    Applicant: Delphi Technologies, Inc.

    Inventor： Manlove, Gregory J. ,  Long, Stephen P. ,  Borzabadi, Hamid R. ,  Vas, Timothy A. ,  Hawes, Kevin J.

    IPC: G01D11/24 ,  G01P1/02

    CPC classification number: G01D11/245 ,  G01P1/023

    Abstract: A sensor module (10) is provided having a compact housing (12) containing a sensor (22). A low temperature co-fired ceramic substrate (20) is located on the housing (12). The sensor (22) and signal processing circuitry (24) are located on the low temperature co-fired ceramic substrate (20). The sensor module (10) further includes a metal shield (26, 28) substantially encapsulating the sensor (22).

    Abstract translation: 传感器模块（10）设置有具有包含传感器（22）的紧凑壳体（12）。 低温共烧陶瓷基板（20）位于壳体（12）上。 传感器（22）和信号处理电路（24）位于低温共烧陶瓷基片（20）上。 传感器模块（10）还包括基本上封装传感器（22）的金属屏蔽（26,28）。

    Pressure transducer
    2.
    发明公开
    Pressure transducer 有权
    压力传感器

    公开(公告)号：EP1901050A3

    公开(公告)日：2009-09-16

    申请号：EP07024382.9

    申请日：2006-04-19

    Applicant: Delphi Technologies, Inc.

    Inventor： Vaz, Timothy A. ,  Betzner, Timothy M. ,  Long, Stephen P.

    IPC: G01L9/00 ,  G01L19/14

    CPC classification number: G01L19/0645 ,  G01L19/0038 ,  Y10T29/4998

    Abstract: A silicon-based high pressure sensor module incorporates a low temperature co-fired ceramic (LTCC) substrate. The LTCC substrate can withstand high pressures. A bossed container filled with oil is mounted on the substrate and houses a sensor cell. The top surface of the bossed container is flexible and deflects under pressure. By controlling the surface area and the thickness of the top surface, the pressure sensor can be configured to measure a wide range of pressures. The oil transfers pressure from the bossed container to the diaphragm of the sensor cell while protecting the sensor cell from high pressures and harsh media.

    Pressure transducer
    3.
    发明公开
    Pressure transducer 有权
    Druckwandler

    公开(公告)号：EP1901050A2

    公开(公告)日：2008-03-19

    申请号：EP07024382.9

    申请日：2006-04-19

    Applicant: Delphi Technologies, Inc.

    Inventor： Vaz, Timothy A. ,  Betzner, Timothy M. ,  Long, Stephen P.

    IPC: G01L9/00

    CPC classification number: G01L19/0645 ,  G01L19/0038 ,  Y10T29/4998

    Abstract: A silicon-based high pressure sensor module incorporates a low temperature co-fired ceramic (LTCC) substrate. The LTCC substrate can withstand high pressures. A bossed container filled with oil is mounted on the substrate and houses a sensor cell. The top surface of the bossed container is flexible and deflects under pressure. By controlling the surface area and the thickness of the top surface, the pressure sensor can be configured to measure a wide range of pressures. The oil transfers pressure from the bossed container to the diaphragm of the sensor cell while protecting the sensor cell from high pressures and harsh media.

    Abstract translation: 硅基高压传感器模块包含低温共烧陶瓷（LTCC）基板。 LTCC基板可承受高压。 装有油的凸起的容器安装在基板上并且容纳传感器单元。 凸起的容器的顶表面是柔性的并且在压力下偏转。 通过控制上表面的表面积和厚度，压力传感器可被配置成测量宽范围的压力。 油将压力从凸起的容器传递到传感器单元的隔膜，同时保护传感器单元免受高压和恶劣的介质。

    Integrated pressure sensor and method of manufacture
    10.
    发明公开
    Integrated pressure sensor and method of manufacture 有权
    Integrierter Drucksensor和Herstellungsverfahren

    公开(公告)号：EP1677089A1

    公开(公告)日：2006-07-05

    申请号：EP05077861.2

    申请日：2005-12-12

    Applicant: Delphi Technologies, Inc.

    Inventor： Borzabadi, Hamid R. ,  Koglin, Dennis M. ,  Long, Stephen P. ,  Vas, Timothy A.

    IPC: G01L19/04 ,  G01L9/00

    CPC classification number: G01L9/0051 ,  G01L9/045 ,  G01L19/069

    Abstract: A technique for manufacturing an integrated pressure sensor (150) includes a number of steps. Initially, a substrate (200) with conductive electrical traces located on first and second sides of the substrate (200) is provided. A plurality of compensation circuits (100) are positioned in an array on the first side of the substrate (200) in electrical contact with one or more of the conductive electrical traces on the first side of the substrate (200). A plurality of pressure sensors (10) are positioned on the second side of the substrate (200) in electrical contact with one or more of the conductive electrical traces on the second side of the substrate (200). Each one of the sensors (10) is associated with one of the compensation circuits (100) to form a plurality of pressure sensor-compensation circuit pairs. The substrate (200) includes conductive vias to electrically connect each of the sensor-compensation circuit pairs. Each of the compensation circuits (100) provides temperature compensation for an associated one of the sensors (10). The sensor-compensation circuit pairs are calibrated and singulated for final packaging.

    Abstract translation: 一种用于制造集成压力传感器（150）的技术包括多个步骤。 首先，提供具有位于衬底（200）的第一和第二侧上的导电电迹线的衬底（200）。 多个补偿电路（100）以与衬底（200）的第一侧上的一个或多个导电电迹线电接触的方式位于衬底（200）的第一侧上的阵列中。 多个压力传感器（10）位于基板（200）的第二侧上，与基板（200）的第二侧上的一个或多个导电电迹线电接触。 传感器（10）中的每一个与补偿电路（100）中的一个相关联，以形成多个压力传感器 - 补偿电路对。 衬底（200）包括用于电连接传感器 - 补偿电路对中的每一个的导电通路。 每个补偿电路（100）为相关联的一个传感器（10）提供温度补偿。 对传感器补偿电路对进行校准和分组，以进行最终的封装。

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