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    Monolithically-integrated infrared sensor
    1.
    发明公开
    Monolithically-integrated infrared sensor 有权
    Monolithisch integrierter Infrarots传感器

    公开(公告)号：EP1333504A2

    公开(公告)日：2003-08-06

    申请号：EP03075163.0

    申请日：2003-01-17

    Applicant: Delphi Technologies, Inc.

    Inventor： Chavan, Abhijeet V. ,  Logsdon, James H. ,  Chilcott, Dan W. ,  Lee, Han-Sheng ,  Lambert, David K. ,  Vas, Timothy A.

    IPC: H01L35/02 ,  H01L35/08

    CPC classification number: G01J5/14 ,  G01J5/12

    Abstract: An integrated sensor (10) comprising a thermopile transducer (12) and signal processing circuitry (4) that are combined on a single semiconductor substrate (20), such that the transducer output signal is sampled in close vicinity by the processing circuitry (14). The sensor (10) comprises a frame (18) formed of a semiconductor material that is not heavily doped, and with which a diaphragm (16) is supported. The diaphragm (16) has a first surface for receiving thermal (e.g., infrared) radiation, and comprises multiple layers that include a sensing layer containing at least a pair of interlaced thermopiles (22). Each thermopile (22) comprises a sequence of thermocouples (24), each thermocouple (24) comprising dissimilar electrically-resistive materials that define hot junctions (26) located on the diaphragm (16) and cold junctions (28) located on the frame (18). The signal processing circuitry (14) is located on the frame (18) and electrically interconnected with the thermopiles (22). The thermopiles (22) are interlaced so that the output of one of the thermopiles (22) increases with increasing temperature difference between the hot and cold junctions (26,28) thereof, while the output of the second thermopile (22) decreases with increasing temperature difference between its hot and cold junctions (26,28).

    Abstract translation: 包括组合在单个半导体衬底（20）上的热电堆换能器（12）和信号处理电路（4）的集成传感器（10），使得所述换能器输出信号在所述处理电路（14）附近被采样， 。 传感器（10）包括由不重掺杂的半导体材料形成的框架（18），并且支撑有隔膜（16）。 隔膜（16）具有用于接收热（例如，红外线）辐射的第一表面，并且包括包含至少一对隔行热电堆（22）的感测层的多个层。 每个热电堆（22）包括一系列热电偶（24），每个热电偶（24）包括不同的电阻材料，其限定位于隔膜（16）上的热接点（26）和位于框架上的冷接点（28） 18）。 信号处理电路（14）位于框架（18）上并与热电堆（22）电互连。 热电堆（22）交错，使得其中一个热电堆（22）的输出随着热连接点（26,28）之间温差的增加而增加，而第二热电堆（22）的输出随着增加 其热连接点之间的温差（26,28）。

    Dual pressure sensor apparatus
    5.
    发明公开
    Dual pressure sensor apparatus 有权
    设备与两个压力传感器

    公开(公告)号：EP1983324A3

    公开(公告)日：2010-07-21

    申请号：EP08153904.1

    申请日：2008-04-01

    Applicant: Delphi Technologies, Inc.

    Inventor： Kuznia, Philip D. ,  Vas, Timothy A. ,  Delrymple, Derek A.

    IPC: G01L9/06 ,  G01L15/00

    CPC classification number: G01L15/00 ,  G01L19/141

    Abstract: A dual pressure sensor apparatus (10) configured for attachment to a manifold (22) includes a molded plastic housing (12) with a body portion (20) featuring an upper cavity (40), a measurement port (24), and a lower cavity (42) closed by the manifold (22). First and second pressure sensor modules (16, 14) are mounted in first and second wells (50, 48) formed in the upper cavity (40), and electrically coupled to a set of leadframe terminals (46a, 46b, 46c, 46d) disposed in the upper cavity (40). An opening (54) in the first well (50) couples the first pressure sensor module (16) to the measurement port (24), and an opening (52) in the second well (48) couples the second pressure sensor module (14) to the lower cavity (42). The measurement port (24) sealingly extends through an opening (26) in the manifold (22) so that the first pressure sensor module (16) measures pressure in the manifold (22), and the body portion walls (20a, 20b) bounding the lower cavity (42) are notched (64, 66) so that the second pressure sensor module (14) measures atmospheric or barometric pressure outside the manifold (22).

    Dual pressure sensor apparatus
    6.
    发明公开
    Dual pressure sensor apparatus 有权
    Vorrichtung mit zwei Drucksensoren

    公开(公告)号：EP1983324A2

    公开(公告)日：2008-10-22

    申请号：EP08153904.1

    申请日：2008-04-01

    Applicant: Delphi Technologies, Inc.

    Inventor： Kuznia, Philip D. ,  Vas, Timothy A. ,  Delrymple, Derek A.

    IPC: G01L9/06 ,  G01L15/00

    CPC classification number: G01L15/00 ,  G01L19/141

    Abstract: A dual pressure sensor apparatus (10) configured for attachment to a manifold (22) includes a molded plastic housing (12) with a body portion (20) featuring an upper cavity (40), a measurement port (24), and a lower cavity (42) closed by the manifold (22). First and second pressure sensor modules (16, 14) are mounted in first and second wells (50, 48) formed in the upper cavity (40), and electrically coupled to a set of leadframe terminals (46a, 46b, 46c, 46d) disposed in the upper cavity (40). An opening (54) in the first well (50) couples the first pressure sensor module (16) to the measurement port (24), and an opening (52) in the second well (48) couples the second pressure sensor module (14) to the lower cavity (42). The measurement port (24) sealingly extends through an opening (26) in the manifold (22) so that the first pressure sensor module (16) measures pressure in the manifold (22), and the body portion walls (20a, 20b) bounding the lower cavity (42) are notched (64, 66) so that the second pressure sensor module (14) measures atmospheric or barometric pressure outside the manifold (22).

    Abstract translation: 构造成附接到歧管（22）的双压力传感器装置（10）包括模制塑料壳体（12），其具有主体部分（20），其特征在于上空腔（40），测量口（24）和下部 腔（42）被歧管（22）封闭。 第一和第二压力传感器模块（16,14）安装在形成在上部空腔（40）中的第一和第二孔（50,48）中，并且电耦合到一组引线框架端子（46a，46b，46c，46d） 设置在上腔（40）中。 第一井（50）中的开口（54）将第一压力传感器模块（16）耦合到测量端口（24），并且第二井（48）中的开口（52）将第二压力传感器模块（14） ）到下腔（42）。 测量端口（24）密封地延伸通过歧管（22）中的开口（26），使得第一压力传感器模块（16）测量歧管（22）中的压力，并且包围主体部分壁（20a，20b） 下腔（42）被切口（64,66），使得第二压力传感器模块（14）测量歧管（22）外部的大气压或大气压力。

    Sealed engine control module with integral ambient air pressure sensor
    8.
    发明公开
    Sealed engine control module with integral ambient air pressure sensor 审中-公开
    与intregriertem环境空气压力传感器密封发动机控制模块

    公开(公告)号：EP2365308A3

    公开(公告)日：2014-10-01

    申请号：EP11152364.3

    申请日：2011-01-27

    Applicant: Delphi Technologies, Inc.

    Inventor： Borzabadi, Hamid R. ,  Wilcox, Ronald D. ,  Kuznia, Philip D. ,  Vas, Timothy A. ,  Little, Lewis Henry ,  Miller, David G.

    IPC: G01L9/00 ,  G01L19/06 ,  G01L19/14

    CPC classification number: G01L19/0654 ,  G01L19/147

    Abstract: An engine control module (10) having an environmentally-sealed housing (12, 12a) includes a housing-mounted air pressure sensor (18) for providing a reliable measure of atmospheric air pressure to a control circuit (14a) mounted within the housing (12, 12a). The sensor (18) is mounted on an inboard face of the housing (12a), and includes a sensor element (18a), a body portion (18b) and a riser portion (18c). The sensor element (18a) is mounted in the body portion (18b), and the riser portion (18c) protrudes through an opening (20) in the housing (12a) to couple the sensor element (18a) to atmospheric pressure outside the housing (12, 12a). The body portion (18b) is sealingly secured to the inboard face of the housing (12a), and a set of conductor pins (26) molded into the body portion (18b) extend inward to engage a circuit board (14) enclosed by the housing (12, 12a), and thereby directly couple the sensor element (18a) to the ECM's control circuit (14a). The top of the riser portion (18c) is capped by a splash-proof lid (24) to prevent water intrusion.

    Integrated pressure sensor and method of manufacture
    10.
    发明公开
    Integrated pressure sensor and method of manufacture 有权
    Integrierter Drucksensor和Herstellungsverfahren

    公开(公告)号：EP1677089A1

    公开(公告)日：2006-07-05

    申请号：EP05077861.2

    申请日：2005-12-12

    Applicant: Delphi Technologies, Inc.

    Inventor： Borzabadi, Hamid R. ,  Koglin, Dennis M. ,  Long, Stephen P. ,  Vas, Timothy A.

    IPC: G01L19/04 ,  G01L9/00

    CPC classification number: G01L9/0051 ,  G01L9/045 ,  G01L19/069

    Abstract: A technique for manufacturing an integrated pressure sensor (150) includes a number of steps. Initially, a substrate (200) with conductive electrical traces located on first and second sides of the substrate (200) is provided. A plurality of compensation circuits (100) are positioned in an array on the first side of the substrate (200) in electrical contact with one or more of the conductive electrical traces on the first side of the substrate (200). A plurality of pressure sensors (10) are positioned on the second side of the substrate (200) in electrical contact with one or more of the conductive electrical traces on the second side of the substrate (200). Each one of the sensors (10) is associated with one of the compensation circuits (100) to form a plurality of pressure sensor-compensation circuit pairs. The substrate (200) includes conductive vias to electrically connect each of the sensor-compensation circuit pairs. Each of the compensation circuits (100) provides temperature compensation for an associated one of the sensors (10). The sensor-compensation circuit pairs are calibrated and singulated for final packaging.

    Abstract translation: 一种用于制造集成压力传感器（150）的技术包括多个步骤。 首先，提供具有位于衬底（200）的第一和第二侧上的导电电迹线的衬底（200）。 多个补偿电路（100）以与衬底（200）的第一侧上的一个或多个导电电迹线电接触的方式位于衬底（200）的第一侧上的阵列中。 多个压力传感器（10）位于基板（200）的第二侧上，与基板（200）的第二侧上的一个或多个导电电迹线电接触。 传感器（10）中的每一个与补偿电路（100）中的一个相关联，以形成多个压力传感器 - 补偿电路对。 衬底（200）包括用于电连接传感器 - 补偿电路对中的每一个的导电通路。 每个补偿电路（100）为相关联的一个传感器（10）提供温度补偿。 对传感器补偿电路对进行校准和分组，以进行最终的封装。

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