公开(公告)号：US20190252585A1

公开(公告)日：2019-08-15

申请号：US16274659

申请日：2019-02-13

Applicant: EPISTAR CORPORATION

Inventor： Min-Hsun HSIEH ,  Tzu-Hsiang WANG

IPC: H01L33/62 ,  H01L33/50 ,  H01L33/38 ,  H01L27/15 ,  H01L25/075

CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L27/156 ,  H01L33/38 ,  H01L33/50 ,  H01L2933/0066

Abstract: The application discloses a light-emitting device including a carrier, a light-emitting element and a connecting structure. The carrier includes a first connecting portion and a first necking portion extended from the first connecting portion. The first connecting portion has a first width, and the first necking portion has a second width. The second width is less than the first width. The light-emitting element includes a first light-emitting layer being able to emit a first light and a first contacting electrode formed under the first light-emitting layer. The first contacting electrode is corresponded to the first connecting portion. The connecting structure includes a first electrical connecting portion and a protection portion surrounding the first electrical connecting portion. The first electrical connecting portion is electrically connected to the first connecting portion and the first contacting electrode. The first connecting portion substantially is located within a range surrounded by the protection portion.

公开(公告)号：US20230395562A1

公开(公告)日：2023-12-07

申请号：US18450373

申请日：2023-08-15

Applicant: EPISTAR CORPORATION

Inventor： Min-Hsun HSIEH ,  Shih-An LIAO ,  Ying-Yang SU ,  Hsin-Mao LIU ,  Tzu-Hsiang WANG ,  Chi-Chih PU

IPC: H01L23/00 ,  H01L25/16 ,  H01L25/075 ,  H01L23/498 ,  B23K26/22

CPC classification number: H01L24/81 ,  H01L25/167 ,  H01L25/0753 ,  H01L24/83 ,  H01L23/49866 ,  B23K26/22 ,  B23K2101/40

Abstract: Disclosed is a die-bonding method which provides a target substrate having a circuit structure with multiple electrical contacts and multiple semiconductor elements each semiconductor element having a pair of electrodes, arranges the multiple semiconductor elements on the target substrate with the pair of electrodes of each semiconductor element aligned with two corresponding electrical contacts of the target substrate, and applies at least one energy beam to join and electrically connect the at least one pair of electrodes of every at least one of the multiple semiconductor elements and the corresponding electrical contacts aligned therewith in a heating cycle by heat carried by the at least one energy beam in the heating cycle. The die-bonding method delivers scattering heated dots over the target substrate to avoid warpage of PCB and ensures high bonding strength between the semiconductor elements and the circuit structure of the target substrate.

公开(公告)号：US20230207540A1

公开(公告)日：2023-06-29

申请号：US18082199

申请日：2022-12-15

Applicant: EPISTAR CORPORATION ,  Yenrich Technology Corporation

Inventor： Min-Hsun HSIEH ,  Hsin-Mao LIU ,  Tzu-Hsiang WANG ,  Ya-Wen LIN ,  Chi-Chih PU ,  Hsiao-Pei CHIU ,  Ching-Tai CHENG ,  Chong-Yu WANG

IPC: H01L25/13 ,  H01L25/075 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62

CPC classification number: H01L25/13 ,  H01L25/0753 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62

Abstract: A light-emitting device includes a circuit carrier board having a short side and a long side, a plurality of light-emitting units on the circuit carrier board for emitting three or more color lights, and a light-transmitting glue layer on the circuit carrier board and covering the plurality of light-emitting units. The short side is shorter than the long side. The plurality of light-emitting units include a first light-emitting unit. The first light-emitting unit has a light exit surface, a first sidewall, and a second sidewall. The first sidewall faces the short side and has a first included angle with the light exit surface, and the second sidewall faces the long side and has a second included angle with the light exit surface. The first included angle is between 85 to 95 degrees, and the second included angle is less than 85 degrees or greater than 105 degrees.

公开(公告)号：US20230086456A1

公开(公告)日：2023-03-23

申请号：US18070669

申请日：2022-11-29

Applicant: EPISTAR CORPORATION

Inventor： Min-Hsun HSIEH ,  Tzu-Hsiang WANG

IPC: H01L25/075 ,  H01L33/62 ,  H01L23/00

Abstract: The application discloses a light-emitting device including a carrier which includes an insulating layer, an upper conductive layer formed on the insulating layer, a plurality of conducting vias passing through the insulating layer, and a lower conductive layer formed under the insulating layer; four light-emitting elements arranged in rows and columns flipped on the carrier; and a light-passing unit formed on the carrier and covering the four light-emitting elements; wherein each of the light-emitting elements including a first light-emitting bare die emitting a first dominant wavelength, a second light-emitting bare die emitting a second dominant wavelength, and a third light-emitting bare die emitting a third dominant wavelength; and wherein two adjacent first light-emitting bare die in a row has a first distance W1, two adjacent first light-emitting bare die in a column has a second distance W2, and W1 is the same as W2.

公开(公告)号：US20210343918A1

公开(公告)日：2021-11-04

申请号：US17376515

申请日：2021-07-15

Applicant: EPISTAR CORPORATION

Inventor： Min-Hsun HSIEH ,  Tzu-Hsiang WANG

IPC: H01L33/62 ,  H01L33/50 ,  H01L27/15 ,  H01L25/075 ,  H01L33/38

Abstract: A light-emitting device comprises a carrier, which comprises a plurality of side surfaces, an insulating layer, an upper conductive layer arranged on the insulating layer, a lower conductive layer arranged under the insulating layer, and a plurality of conductive through holes arranged between and connected to the upper conductive layer and the lower conductive layer; a plurality of light-emitting units arranged on and electrically connected to the upper conductive layer; and a transparent unit fully covering the plurality of light-emitting units, and exposing the lower conductive layer, wherein the plurality of conductive through holes are not completely buried within the insulating layer, and each conductive through hole is sandwiched by two adjacent ones of the plurality of side surfaces.

公开(公告)号：US20210057395A1

公开(公告)日：2021-02-25

申请号：US17000249

申请日：2020-08-21

Applicant: EPISTAR CORPORATION

Inventor： Min-Hsun HSIEH ,  Tzu-Hsiang WANG

IPC: H01L25/075 ,  H01L33/62 ,  H01L23/00

Abstract: The application discloses a light-emitting device including a carrier which includes an insulating layer, an upper conductive layer formed on the insulating layer, a plurality of conducting vias passing through the insulating layer, and a lower conductive layer formed under the insulating layer; four light-emitting elements arranged in rows and columns flipped on the carrier; and a light-passing unit formed on the carrier and covering the four light-emitting elements; wherein each of the light-emitting elements including a first light-emitting bare die emitting a first dominant wavelength, a second light-emitting bare die emitting a second dominant wavelength, and a third light-emitting bare die emitting a third dominant wavelength; and wherein two adjacent first light-emitting bare die in a row has a first distance W1, two adjacent first light-emitting bare die in a column has a second distance W2, and W1 is the same as W2.

公开(公告)号：US20190252586A1

公开(公告)日：2019-08-15

申请号：US16274666

申请日：2019-02-13

Applicant: EPISTAR CORPORATION

Inventor： Min-Hsun HSIEH ,  Tzu-Hsiang WANG

IPC: H01L33/62 ,  H01L33/60 ,  H01L33/50 ,  H01L25/16

Abstract: The invention discloses a light-emitting device and a manufacturing method thereof. The light-emitting device comprising: a light-emitting unit, the light-emitting unit comprises a non-light-emitting element and a light-emitting diode; a reflective layer covering the non-light-emitting element; a light-transmitting layer covering the reflective layer and the light-emitting diode; a metal connection layer electrically connecting the non-light-emitting element and the light-emitting diode.