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    SILICON MICROPHONE WITH SUSPENDED DIAPHRAGM AND SYSTEM WITH THE SAME
    11.
    发明申请
    SILICON MICROPHONE WITH SUSPENDED DIAPHRAGM AND SYSTEM WITH THE SAME 审中-公开
    硅胶麦克风带有悬挂的胶片和系统

    公开(公告)号：WO2015196468A1

    公开(公告)日：2015-12-30

    申请号：PCT/CN2014/080990

    申请日：2014-06-27

    Applicant: GOERTEK INC.

    Inventor： WANG, Zhe

    IPC: H04R19/04 ,  B81B7/00

    CPC classification number: H04R19/04 ,  B81B3/001 ,  B81B3/0051 ,  B81B3/0072 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/04 ,  B81B2207/015 ,  B81C2203/0714 ,  H04R19/005 ,  H04R2201/003

    Abstract: A silicon microphone with a suspended diaphragm and a system with the same are provided, the microphone comprises: a silicon substrate provided with a back hole therein; a compliant diaphragm disposed above the back hole of the silicon substrate and separated from the silicon substrate; a perforated backplate disposed above the diaphragm with an air gap sandwiched in between; and a precisely defined support mechanism, disposed between the diaphragm and the backplate with one end thereof fixed to the edge of the diaphragm and the other end thereof fixed to the backplate, wherein the diaphragm and the backplate are used to form electrode plates of a variable condenser. The microphone with a suspended diaphragm can improve the repeatability and reproducibility in performance and can reduce the diaphragm stress induced by the substrate.

    Abstract translation: 提供具有悬挂隔膜的硅麦克风及其系统，所述麦克风包括：在其中设置有后孔的硅基板; 柔性膜，其设置在所述硅衬底的所述背孔的上方并与所述硅衬底分离; 设置在隔膜上方的穿孔背板，夹在其间的气隙; 以及精确限定的支撑机构，其设置在隔膜和背板之间，其一端固定在隔膜的边缘，另一端固定在背板上，其中隔膜和背板用于形成可变的电极板 冷凝器。 具有悬挂隔膜的麦克风可以提高性能的重复性和再现性，并可以减少由基板引起的隔膜应力。

    A SILICON BASED MEMS MICROPHONE, A SYSTEM AND A PACKAGE WITH THE SAME
    12.
    发明申请
    A SILICON BASED MEMS MICROPHONE, A SYSTEM AND A PACKAGE WITH THE SAME 审中-公开
    一种基于硅的MEMS麦克风，一个系统和一个包装

    公开(公告)号：WO2013097135A1

    公开(公告)日：2013-07-04

    申请号：PCT/CN2011/084889

    申请日：2011-12-29

    Applicant: GOERTEK INC. ,  WANG, Zhe ,  CAI, Mengjin

    Inventor： WANG, Zhe ,  CAI, Mengjin

    IPC: B81B7/00 ,  B81C1/00 ,  H04R19/04 ,  H04R7/00

    CPC classification number: H04R1/02 ,  B81B7/0061 ,  B81B2201/0257 ,  H01L2924/1461 ,  H04R1/086 ,  H04R7/04 ,  H04R19/005 ,  H04R19/04 ,  H04R2201/003 ,  H04R2201/02 ,  H04R2207/00

    Abstract: A silicon based MEMS microphone comprises a silicon substrate (100) and an acoustic sensing part (11) supported on the silicon substrate, wherein a mesh-structured back hole (140) is formed in the substrate and aligned with the acoustic sensing part, the mesh-structured back hole includes a plurality of mesh beams (141) which are interconnected with each other and supported on the sidewall (142) of the mesh-structure back hole, the plurality of mesh beams and the side wall define a plurality of mesh holes (143) which all have a tapered profile and merge into one hole in the vicinity of the acoustic sensing part at the top side of the silicon substrate. The mesh-structured back hole can help to streamline the air pressure pulse caused, for example, in a drop test and thus reduce the impact on the acoustic sensing part of the microphone, and also serve as a protection filter to prevent alien substances such as particles entering the microphone.

    Abstract translation: 基于硅的MEMS麦克风包括硅衬底（100）和支撑在硅衬底上的声学感测部件（11），其中在衬底中形成网状结构的后孔（140）并与声学感测部件对准， 网格结构的后孔包括彼此互连并支撑在网状结构后孔的侧壁（142）上的多个网格梁（141），多个网格梁和侧壁限定多个网格 孔（143），其全部具有锥形轮廓并且在硅衬底的顶侧处合并到声学传感部分附近的一个孔中。 网格结构的后孔可以帮助简化例如在跌落测试中引起的空气压力脉冲，从而减少对麦克风的声学传感部分的影响，并且还用作保护过滤器以防止外来物质例如 颗粒进入麦克风。

    A MEMS MICROPHONE AND METHOD FOR PACKAGING THE SAME
    13.
    发明申请
    A MEMS MICROPHONE AND METHOD FOR PACKAGING THE SAME 审中-公开
    一种MEMS麦克风及其包装方法

    公开(公告)号：WO2012088688A1

    公开(公告)日：2012-07-05

    申请号：PCT/CN2010/080486

    申请日：2010-12-30

    Applicant: GOERTEK INC. ,  WANG, Zhe ,  SONG, Qinglin ,  PANG, Shengli ,  GU, Fanghui

    Inventor： WANG, Zhe ,  SONG, Qinglin ,  PANG, Shengli ,  GU, Fanghui

    IPC: H04R19/00

    CPC classification number: B81B3/0018 ,  B81B2201/0257 ,  B81B2207/015 ,  B81C1/00158 ,  B81C1/00246 ,  H04R1/021 ,  H04R19/005 ,  H04R31/00 ,  H04R2201/003

    Abstract: The present invention relates to a MEMS microphone and a method of manufacturing the same, the MEMS microphone comprising: a monolithic silicon chip incorporating an acoustic sensing element and one or more conditioning CMOS integrated circuits; a silicon-based carrier chip having an acoustic cavity; a substrate for surface mounting the assembly of the monolithic chip and the silicon-based carrier chip thereon; a conductive cover attached and electrically connected to the substrate to accommodates the assembly of the monolithic chip and the silicon- based carrier chip; and an acoustic port formed on either the conductive cover or the substrate for an external acoustic wave to reach the acoustic sensing element, wherein the monolithic silicon chip, the silicon-based carrier chip and the acoustic port are configured in such a way that the diaphragm of the acoustic sensing element can be vibrated by the external sound wave from one side thereof.

    Abstract translation: MEMS麦克风及其制造方法技术领域本发明涉及一种MEMS麦克风及其制造方法，该MEMS麦克风包括：包含声学感测元件和一个或多个调节CMOS集成电路的单片硅芯片; 具有声腔的硅基载体芯片; 用于将单片芯片和硅基载体芯片的组件表面安装在其上的基板; 导电盖，其附接并电连接到所述基板以适应所述单片芯片和所述硅基载体芯片的组装; 以及形成在导电盖或用于外部声波的基板上的声波端口到达声学感测元件，其中单片硅芯片，硅基载体芯片和声学端口被构造成使得隔膜 的声学传感元件可以通过外部声波从其一侧振动。

    TRANSFERRING METHOD, MANUFACTURING METHOD, DEVICE AND ELECTRONIC APPARATUS OF MICRO-LED
    19.
    发明公开
    TRANSFERRING METHOD, MANUFACTURING METHOD, DEVICE AND ELECTRONIC APPARATUS OF MICRO-LED 审中-公开
    传输方法，制造方法，装置和微型LED的电子装置

    公开(公告)号：EP3207572A1

    公开(公告)日：2017-08-23

    申请号：EP15886926.3

    申请日：2015-04-01

    Applicant: Goertek. Inc

    Inventor： ZOU, Quanbo ,  WANG, Zhe

    IPC: H01L33/36

    CPC classification number: H01L25/0753 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2933/0066

    Abstract: The present invention discloses a transferring method, a manufacturing method, a device and an electronic apparatus of micro-LED. The method for transferring micro-LED comprises: forming a micro-LED on a laser-transparent original substrate; bringing the micro-LED into contact with a pad preset on a receiving substrate; and irradiating the original substrate with laser from the original substrate side to lift-off the micro-LED from the original substrate.

    Abstract translation: 本发明公开了一种微型LED的转移方法，制造方法，装置和电子设备。 微型LED的传输方法包括：在激光透明的原始基板上形成微型LED; 使微型LED与预设在接收基板上的垫片接触; 以及从原始衬底侧用激光照射原始衬底以将微型LED从原始衬底抬起。

    MEMS DEVICE WITH VALVE MECHANISM
    20.
    发明公开
    MEMS DEVICE WITH VALVE MECHANISM 审中-公开
    具有阀机构的MEMS装置

    公开(公告)号：EP3186979A1

    公开(公告)日：2017-07-05

    申请号：EP14900342.8

    申请日：2014-08-27

    Applicant: Goertek. Inc

    Inventor： WANG, Zhe ,  ZOU, Quanbo ,  TAO, Jifang

    IPC: H04R19/04 ,  H04R1/08

    CPC classification number: H04R1/083 ,  H04R1/023 ,  H04R3/007 ,  H04R19/005 ,  H04R19/016 ,  H04R19/04 ,  H04R2201/003

    Abstract: The disclosure provides a MEMS device. The MEMS device comprises a printed circuit board, a cover attached to the printed circuit board to form a housing, at least one sound hole formed in the housing, a transducer with a diaphragm inside the housing, and at least one shutter structure. Each shutter structure is mounted to the housing around a respective sound hole. Each shutter structure comprises a moveable component disposed near the inner surface of the housing, the moveable component remains at an open position under regular pressure such that an air flow path from the sound hole to the at least one ventilation hole of the substrate across the moveable component is opened, and moves to a first closed position under a high external pressure to block the at least one ventilation hole and close the air flow path.

    Abstract translation: MEMS器件（100）被提供。 MEMS装置（100）包括印刷电路板（110），附接到印刷电路板（110）以形成壳体的盖（120），形成在壳体中的至少一个音孔（112），换能器 140）以及在壳体内部的隔膜（142）以及壳体内部的至少一个活门结构（150）。 每个活门结构（150）围绕相应的音孔（112）安装到外壳。 每个活门结构（150）包括设置在壳体的内表面附近的可移动部件（156），所述可移动部件具有形成在其中的至少一个气隙和可移动部分（1563）以及具有至少一个通气孔 1521）。 可移动部件（156）连接在基板（152）和壳体之间，并且可移动部分（1563）在常规压力下保持在打开位置，使得从音孔（112）到 穿过可移动部件（156）的基板（152）的至少一个通气孔（1521）打开，并且在高外部压力下移动到第一关闭位置以阻塞至少一个通气孔（1521）并关闭空气 流动路径。

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