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公开(公告)号:CA2443846A1
公开(公告)日:2003-07-17
申请号:CA2443846
申请日:2001-12-31
Applicant: HONEYWELL INT INC
Inventor: KOROLEV BORIS A , BEDWELL BRIAN , LI BO , LAU KREISLER , APEN PAUL G , IWAMOTO NANCY
IPC: C08K5/10 , C08F38/00 , C08G8/10 , C08G61/02 , C08G65/40 , C08G77/00 , C08G77/60 , C08K5/34 , C08L49/00 , C08L61/10 , C08L63/00 , C08L65/00 , C08L71/10 , C08L83/16 , C08L101/02 , H01L21/312 , H05K1/03
Abstract: The present composition provides a composition comprising: (a) thermosetting component wherein the thermosetting component comprises monomer having the structure dimer having the structure or a mixture of the monomer and the dim er wherein Y is selected from cage compound and silicon atom; R1, R 2, R3, R4, R5, and R6 are independently selected from aryl, branched aryl, and arylene ether; at least one of the aryl, the branched aryl, and the arylene ether ha s an ethynyl group; R7 is aryl or substituted aryl; and at least one of the R1 , R2, R3, R4, R5, and R6 comprises at least two isomers; and (b) adhesion promoter comprising compound having at least bifunctionality wherein the bifunctionality may be the same or different and the first functionality is capable of interacting with the thermosetting component (a) and the second functionality is capable of interacting with a substrate when the compositio n is applied to a substrate. The present composition is particularly useful as a dielectric material in microelectronic applications.
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公开(公告)号:DE60314719T2
公开(公告)日:2008-04-10
申请号:DE60314719
申请日:2003-01-07
Applicant: HONEYWELL INT INC
Inventor: APEN PAUL G , ZHEREBIN RUSLAN , LI BO , KOROLEV BORIS A , LAU KREISLER S , KANSCHIK-CONRADSEN ANDREAS , KELLERMEIER BERND , DEMEL SONJA , WERNER CHRISTIAN , SULLIVAN EDWARD J
IPC: C07C13/615 , C08G61/12 , C07C13/68 , C08F38/02 , C08F290/00 , C08G61/02 , H01B3/30 , H01L21/768 , H01L23/522
Abstract: The present invention provides adamantane or diamantane compositions that are useful as a dielectric material in microelectronic applications such as microchips.
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公开(公告)号:AU2003295370A8
公开(公告)日:2004-06-07
申请号:AU2003295370
申请日:2003-10-31
Applicant: HONEYWELL INT INC
Inventor: ZHOU DE-LING , NAMAN ANANTH , APEN PAUL , LI BO
IPC: C08G61/02 , C08L65/00 , H01L21/312 , H01L21/316 , H01L21/768 , H01L23/522 , H01L23/532 , H01B3/30 , H01L21/47 , H01L21/4763
Abstract: The present invention provides gas layer formation material selected from the group consisting of acenaphthylene homopolymers; acenaphthylene copolymers; poly(arylene ether); polyamide; B-staged multifunctional acrylate/methacrylate; crosslinked styrene divinyl benzene polymers; and copolymers of styrene and divinyl benzene with maleimide or bis-maleimides. The formed gas layers are used in microchips and multichip modules.
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公开(公告)号:AU2003219658A1
公开(公告)日:2003-07-30
申请号:AU2003219658
申请日:2003-01-13
Applicant: HONEYWELL INT INC
Inventor: APEN PAUL G , NAMAN ANANTH , LI BO , LAU KREISLER , KOROLEV BORIS A , IWAMOTO NANCY , BEDWELL WILLIAM B
IPC: C08G61/02 , H01L21/312 , H01L21/316
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公开(公告)号:AU2003295517A1
公开(公告)日:2004-06-03
申请号:AU2003295517
申请日:2003-11-12
Applicant: HONEYWELL INT INC
Inventor: IWAMOTO NANCY , NAKANO TADASHI , BEDWELL WILLIAM , STUCK JASON , SUEDEMEYER ARLENE , HEBERT MELLO , LI BO , BALDWIN TERESA , KENNEDY JOSEPH
IPC: C08G20060101 , C08G77/02 , C08G77/14 , C08G77/18 , C08G77/22 , C08L83/06 , C09D183/06 , C09D183/08 , G03F7/075 , G03F7/09
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公开(公告)号:DE60314719D1
公开(公告)日:2007-08-16
申请号:DE60314719
申请日:2003-01-07
Applicant: HONEYWELL INT INC
Inventor: APEN PAUL G , ZHEREBIN RUSLAN , LI BO , KOROLEV BORIS A , LAU KREISLER S , KANSCHIK-CONRADSEN ANDREAS , KELLERMEIER BERND , DEMEL SONJA , WERNER CHRISTIAN , SULLIVAN EDWARD J
IPC: C07C13/615 , C08G61/12 , C07C13/68 , C08F38/02 , C08F290/00 , C08G61/02 , H01B3/30 , H01L21/768 , H01L23/522
Abstract: The present invention provides adamantane or diamantane compositions that are useful as a dielectric material in microelectronic applications such as microchips.
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公开(公告)号:AU2003300056A1
公开(公告)日:2005-02-14
申请号:AU2003300056
申请日:2003-12-30
Applicant: HONEYWELL INT INC
Inventor: LAU KREISLER , APEN PAUL , LI BO
IPC: C07C13/615 , C07C13/64 , C07C17/10 , C07C17/269 , C08G61/06 , C08G61/00 , C07C15/20 , C07C13/00 , C07C15/00 , C07C15/16 , C07C5/367
Abstract: Compositions and methods of forming and using those compositions are provided herein where the composition comprises at least one oligomer or polymer of Formula I wherein E is a cage compound; each Q is the same or different and selected from aryl, branched aryl, and substituted aryl wherein the substituents include hydrogen, halogen, alkyl, aryl, substituted aryl, heteroaryl, aryl ether, alkenyl, alkynyl, alkoxyl, hydroxyalkyl, hydroxyaryl, hydroxyalkenyl, hydroxyalkynyl, hydroxyl, or carboxyl; A is substituted or unsubstituted aryl with substituted or unsubstituted arylalkynyl group (substituents include hydrogen, halogen, alkyl, phenyl or substituted aryl; and aryl includes phenyl, biphenyl, naphthyl, terphenyl, anthracenyl, polyphenylene, polyphenylene ether, or substituted aryl); h is from 0 to 10; i is from 0 to 10; j is from 0 to 10; and w is 0 or 1.
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公开(公告)号:AU2003224597A8
公开(公告)日:2003-07-30
申请号:AU2003224597
申请日:2003-01-14
Applicant: HONEYWELL INT INC
Inventor: LI BO , LAU KREISLER S , SULLIVAN EDWARD J , APEN PAUL G
IPC: C07C17/10 , C07C17/266 , C07C25/22 , C07C25/24 , C08G61/02 , C08L65/00 , H01L21/312 , H01L21/316 , H01L21/768 , H01L23/14 , H01L23/532 , H05K1/00 , H05K1/02 , H05K1/03 , C08L49/00 , C08J9/26
Abstract: The present invention provides a composition comprising (a) thermosetting component comprising: (1) optionally monomer of Formula I as set forth below and (2) at least one oligomer or polymer of Formula II as set forth below where E, Q, G, h, I, j, and w are as set forth below and (b) porogen that bonds to thermosetting component (a). Preferably, the porogen is selected from the group consisting of unsubstituted polynorbornene, substituted polynorbornene, polycaprolactone, unsubstituted polystyrene, substituted polystyrene, polyacenaphthylene homopolymer, and polyacenaphthylene copolymer. Preferably, the present compositions may be used as dielectric substrate in microchips, multichip modules, laminated circuit boards, or printed wiring boards.
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公开(公告)号:AU2003202905A1
公开(公告)日:2003-07-24
申请号:AU2003202905
申请日:2003-01-07
Applicant: HONEYWELL INT INC
Inventor: SULLIVAN EDWARD J , APEN PAUL G , ZHEREBIN RUSLAN , LI BO , KOROLEV BORIS A , LAU KREISLER S , KANSCHIK-CONRADSEN ANDREAS , KELLERMEIER BERND , DEMEL SONJA , WERNER CHRISTIAN
IPC: C07C13/615 , C07C13/68 , C08F38/02 , C08F290/00 , C08G61/02 , C08G61/12 , H01B3/30 , H01L21/768 , H01L23/522
Abstract: The present invention provides adamantane or diamantane compositions that are useful as a dielectric material in microelectronic applications such as microchips.
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