公开(公告)号：DE3485828T2

公开(公告)日：1993-03-11

申请号：DE3485828

申请日：1984-10-19

Applicant: IBM

Inventor： ARAPS CONSTANCE JOAN ,  KANDETZKE STEVEN MICHAEL ,  TAKACS MARK ANTHONY

IPC: C08F299/00 ,  C08F290/00 ,  C08F299/02 ,  C08G73/00 ,  C08G73/10 ,  G11C11/416 ,  H01B3/30 ,  H01L21/312 ,  H01L21/76 ,  H01L21/762 ,  H01L23/532 ,  H03F3/45 ,  H05K1/00 ,  H05K1/03 ,  H05K3/46 ,  H01L23/52

Abstract: Electronic components are disclosed comprising an insulator which is the in situ cured reaction product of a polymerizable oligomer which is end capped with a vinyl and/or acetylenic end groups. A process for forming the same is also disclosed.

公开(公告)号：DE3485758T2

公开(公告)日：1993-02-04

申请号：DE3485758

申请日：1984-10-19

Applicant: IBM DEUTSCHLAND

Inventor： ARAPS CONSTANCE JOAN ,  KANDETZKE STEVEN MICHAEL ,  TAKACS MARK ANTHONY

IPC: H01L23/29 ,  C08F290/00 ,  C08F299/02 ,  C08G73/10 ,  H01L21/312 ,  H01L23/31

Abstract: Thin dielectric films are formed on an electronic component by in situ curing a polymerizable oligomer which is end capped with vinyl and/or acetylenic end groups. An electronic component comprising the cured product is also disclosed.

公开(公告)号：DE3778741D1

公开(公告)日：1992-06-11

申请号：DE3778741

申请日：1987-01-09

Applicant: IBM

Inventor： ANDERSON JR ,  ARAPS CONSTANCE JOAN ,  DIVAKARUNI RENUKA SHASTRI ,  SACHDEV KRISHNA GANDHI ,  ZALAR STOYAN MATHIAS ,  KIRBY DANIEL PATRICK ,  WOLFFNUFER ROBERT ,  SACHDEV HARBANS SINGH ,  SURYANARAYANA DARBHA

IPC: C03C10/00 ,  C04B35/622 ,  C04B35/628 ,  C04B35/63 ,  C04B35/632 ,  C04B35/634 ,  H01L21/48 ,  H05K1/03 ,  C04B35/00 ,  H05K3/46

Abstract: Prepn. comprises (a) forming a finely divided cpd. that includes particles of ceramic particles, (b) coating the particles with a heat decomposable surface modification organo cpd. (I) selected from organo silanes, organo silazanes, titanium chelates and titanium esters, (c) combining and mixing the coated particles of finely divided cpd. with an organic resin binder and solvent for the binder to form a slurry, (d) shaping the slurry to form the desired element, heating the element to remove the coating, the binder and the solvent and (e) continuing the heating to fuse the particles of finely divided cpd.