11.
    发明专利
    未知

    公开(公告)号:DE3788649D1

    公开(公告)日:1994-02-10

    申请号:DE3788649

    申请日:1987-10-20

    Applicant: IBM

    Abstract: In a switching system interconnecting transmission links (21-i, 23-i) on which circuit switched (CS) and packet switched (PS) information is transferred, a switch fabric (11) is provided which interconnects a plurality of input ports (15-i) to a plurality of output ports (19-i). The information arriving on incoming links is converted in switch adapters (13-i) to uniform minipackets, each having a routing address designating the required output port. The switch fabric consists of parallel equal switching slices, e.g. binary routing trees (71), which transfer in a non-blocking manner each minipacket from its input port to one output port in response to the routing address. Collecting means (73, 75) are provided at each output port for accepting the minipackets arriving from the different input ports.

    12.
    发明专利
    未知

    公开(公告)号:DE3685331D1

    公开(公告)日:1992-06-17

    申请号:DE3685331

    申请日:1986-10-23

    Applicant: IBM

    Abstract: The energy of the focused laser beam is sufficient to cause photo electric emission from each selected pad (P21) on which the beam is directed, but is insufficient to produce photoelectric emission from the non-conducting substrate. Consequently, a specific voltage level is induced in each selected pad and in each non-selected pad which is connected electrically to a selected pad. The action of the flooding laser beam causes voltage-dependent photoelectric emission from the pads, that is the electrons from the previously-charged pads are of lower kinetic energy than those from uncharged pads. A position-sensitive channel plate (15) is disposed in the vicinity of the flooded face for detecting the pattern of voltage-dependent photoelectric emission from the flooded face of the substrate.

    NONCONTACT DYNAMIC TESTER FOR INTEGRATED CIRCUITS

    公开(公告)号:DE3573320D1

    公开(公告)日:1989-11-02

    申请号:DE3573320

    申请日:1985-10-04

    Applicant: IBM

    Abstract: Testing of integrated circuit process intermediates, such as wafers, dice or chips in various stages of production (test chip) is facilitated by a nonintrusive, noncontact dynamic testing technique, using a pulsed laser 7, with laser light modification 8 to increase photon energy through conversion to shorter wavelength. The high energy laser light excites electron emissions to pass to the detection system 13, 14 as a composite function of applied light energy and of dynamic operation of the circuit; detecting those emissions by an adjacent detector requires no ohmic contacts or special circuitry on the integrated circuit chip or wafer. Photoelectron energy 10 emitted from a test pad 3 on the test chip 1 is detected as a composite function of the instantaneous input voltage as processed on the test chip, in dynamic operation including improper operation due to fault. The pulse from the 'laser, as modified through light modification, the parameters of detection of bias voltages, and the distances involved in chip-grid-detector juxtaposition, provides emissions for detection of circuit voltages occuring on the test chip under dynamic conditions simulating actual or stressed operation, with high time resolution of the voltages and their changes on the circuit.

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