Noncontact testing of integrated circuits.
    1.
    发明公开
    Noncontact testing of integrated circuits. 失效
    非接触式测试集成电路。

    公开(公告)号:EP0205760A1

    公开(公告)日:1986-12-30

    申请号:EP86103212

    申请日:1986-03-11

    Applicant: IBM

    CPC classification number: G01R31/308

    Abstract: Simultaneous noncontact testing of voltages across a full line of test sites (2) on an integrated circuit chip-to-test (1) is achieved with high time resolution using photoelectron emission induced by a pulsed laser (3) focussed to a line (4) on the chip-to-test, together with high speed electrostatic deflection perpendicular to the line focus. Photoelectrons produced by the line focus of pulsed laser light are imaged to a line on an array detector (5), the measured photoelectron intensities at array points along this line representing voltages at corresponding points along the line illuminated by the laser focus. High speed electrostatic deflection applied to plates (7) during the laser pulse, perpendicular to the direction of the line focus, disperses the line image - (column) on the array detector across a sequence of sites at right angles (rows), thereby revealing the time-dependence of voltages in the column of test sites with high time resolution (in the picosecond
    ' range).

    EXAMINATION OF SAMPLE SURFACE STRUCTURE

    公开(公告)号:JPS6412201A

    公开(公告)日:1989-01-17

    申请号:JP12223288

    申请日:1988-05-20

    Applicant: IBM

    Abstract: PURPOSE: To realize femtosecond-order to picosecond-order time resolution and atomic-level space resolution by holding a tunnel chip at a tunnel distance above a sample and applying a tunnel voltage across the gap between the chip and sample, and then, supplying at least one pulsed laser. CONSTITUTION: A tunnel chip 1 is placed at a tunnel distance (namely, at about 1nm) above the surface 2 of a sample 3 to be investigated. A pulsed laser beam (pump beam) 4 is projected upon the surface 2 of the sample 3 from the chip 1 which is separated from the surface 2 by a distance by performing stroboscopic scanning. At every exciting pulse, thermoelectrons are generated at the place of collision and move in the sample 3. The dynamic response of a system including the material of the sample 3 and the electrons moving in the sample 3 is investigated by stroboscopic extraction. When another laser beam 5 is projected upon the surface 2 of the sample 3 near the tunnel chip 1 synchronously to the pump beam 4, the moving thermoelectrons are excited to a higher energy level.

    4.
    发明专利
    未知

    公开(公告)号:DE3675236D1

    公开(公告)日:1990-12-06

    申请号:DE3675236

    申请日:1986-03-04

    Applicant: IBM

    Abstract: The method comprising covering metal test pads (4) of an integrated circuit chip-to-test (11), with a photon-transmissive passivation layer (2) susceptible to photon assisted tunneling, covering the layer (2) with a thin conductive photon-transparent overlayer (3), and then accessing the test pads through the passivation layer and conductive overlayer, by a pulsed laser to provide voltage-modulated photon-assisted tunneling through the insulation layer, to the conductive overlayer as an electron current, and detecting the resulting electron current, thus providing a nondestructive test of integrated circuits. The passivation, normally present to protect the integrated circuit, also lowers the threshold for photoelectron emission. The conductive overlayer acts as a photoelectron collector for the detector. A chip-to-test which is properly designed for photon assisted tunneling testing has test sites accessible to laser photons even though passivated. Such a chip-to-test may be nondestructively tested in air at one or several stages of its processing, without the sacrifices of mechanical probing or of bringing test sites out to output pads.

    5.
    发明专利
    未知

    公开(公告)号:DE3683053D1

    公开(公告)日:1992-01-30

    申请号:DE3683053

    申请日:1986-10-23

    Applicant: IBM

    Abstract: The surface of the IC substrate and the pads on the surface which are connected to the conducting paths to be tested are covered with three layers. The first (13) is of passivating oxide, a second layer of electroluminescent material (15) and a third layer (17) of a conductive material which is so thin as to be transparent to the passage of photons. The focused laser beam is directed to a pad or pads to generate charges by photon-assisted tunnelling of electrons from each selected pad. Consequently, a specific voltage level is induced in each selectedpad and in each non-selected pad which is connected electrically with a selected pad. The whole substrate surface is flooded with a laser beam to excite voltage-dependent photon-assisted electron-tunnelling from pads, the tunnelling intensity being dependent on the potential of each pad. The excitation pattern is detected in the electroluminescent layer, viewed by a TV camera (21).

    6.
    发明专利
    未知

    公开(公告)号:DE3667547D1

    公开(公告)日:1990-01-18

    申请号:DE3667547

    申请日:1986-03-11

    Applicant: IBM

    Abstract: Simultaneous noncontact testing of voltages across a full line of test sites (2) on an integrated circuit chip-to-test (1) is achieved with high time resolution using photoelectron emission induced by a pulsed laser (3) focussed to a line (4) on the chip-to-test, together with high speed electrostatic deflection perpendicular to the line focus. Photoelectrons produced by the line focus of pulsed laser light are imaged to a line on an array detector (5), the measured photoelectron intensities at array points along this line representing voltages at corresponding points along the line illuminated by the laser focus. High speed electrostatic deflection applied to plates (7) during the laser pulse, perpendicular to the direction of the line focus, disperses the line image - (column) on the array detector across a sequence of sites at right angles (rows), thereby revealing the time-dependence of voltages in the column of test sites with high time resolution (in the picosecond ' range).

    High-speed modular switching apparatus for circuit and packet switched traffic

    公开(公告)号:SG173494G

    公开(公告)日:1995-04-28

    申请号:SG173494

    申请日:1994-12-06

    Applicant: IBM

    Abstract: In a switching system interconnecting transmission links (21-i, 23-i) on which circuit switched (CS) and packet switched (PS) information is transferred, a switch fabric (11) is provided which interconnects a plurality of input ports (15-i) to a plurality of output ports (19-i). The information arriving on incoming links is converted in switch adapters (13-i) to uniform minipackets, each having a routing address designating the required output port. The switch fabric consists of parallel equal switching slices, e.g. binary routing trees (71), which transfer in a non-blocking manner each minipacket from its input port to one output port in response to the routing address. Collecting means (73, 75) are provided at each output port for accepting the minipackets arriving from the different input ports.

    High-speed modular switching apparatus for circuit and packet switched traffic

    公开(公告)号:HK7795A

    公开(公告)日:1995-01-27

    申请号:HK7795

    申请日:1995-01-19

    Applicant: IBM

    Abstract: In a switching system interconnecting transmission links (21-i, 23-i) on which circuit switched (CS) and packet switched (PS) information is transferred, a switch fabric (11) is provided which interconnects a plurality of input ports (15-i) to a plurality of output ports (19-i). The information arriving on incoming links is converted in switch adapters (13-i) to uniform minipackets, each having a routing address designating the required output port. The switch fabric consists of parallel equal switching slices, e.g. binary routing trees (71), which transfer in a non-blocking manner each minipacket from its input port to one output port in response to the routing address. Collecting means (73, 75) are provided at each output port for accepting the minipackets arriving from the different input ports.

    9.
    发明专利
    未知

    公开(公告)号:DE3788649T2

    公开(公告)日:1994-06-23

    申请号:DE3788649

    申请日:1987-10-20

    Applicant: IBM

    Abstract: In a switching system interconnecting transmission links (21-i, 23-i) on which circuit switched (CS) and packet switched (PS) information is transferred, a switch fabric (11) is provided which interconnects a plurality of input ports (15-i) to a plurality of output ports (19-i). The information arriving on incoming links is converted in switch adapters (13-i) to uniform minipackets, each having a routing address designating the required output port. The switch fabric consists of parallel equal switching slices, e.g. binary routing trees (71), which transfer in a non-blocking manner each minipacket from its input port to one output port in response to the routing address. Collecting means (73, 75) are provided at each output port for accepting the minipackets arriving from the different input ports.

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