Mask-less selective electroplating process

    公开(公告)号:IT1148822B

    公开(公告)日:1986-12-03

    申请号:IT2161180

    申请日:1980-04-24

    Applicant: IBM

    Abstract: A selective electroplating process involves placing a cathode and an anode in a non-photo decomposable electrolyte, directing a focusable beam of energy of intensity 102-106 W/cm2 onto the cathode surface to heat the regions to be plated, and establishing an electrical potential between the cathode and the anode. Also claimed is a similar process which employs a light beam of intensity \-102W/cm2 for heating the cathode surface. The process is esp. useful for personalising the repairing integrated circuits, but is also useful e.g. in video display techniques. Deposition rates of about 103 times greater on the heated regions than on the background can be achieved.

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