公开(公告)号：US3876389A

公开(公告)日：1975-04-08

申请号：US28902172

申请日：1972-09-14

Applicant: IBM

Inventor： CHAUDHARI PRAVEEN ,  FREEDMAN JAMES F ,  KOVAC ZLATA

IPC: B29C70/14 ,  B29C70/62 ,  C22C32/00 ,  C22C47/00 ,  B32B15/08 ,  B32B15/02

CPC classification number: B29C70/62 ,  B29C70/14 ,  C22C32/00 ,  C22C47/00 ,  C25D3/16 ,  C25D3/18 ,  C25D15/00 ,  Y10S428/902 ,  Y10S428/935 ,  Y10T428/12444 ,  Y10T428/12569 ,  Y10T428/12889 ,  Y10T428/12944 ,  Y10T428/294 ,  Y10T428/31522

Abstract: A composite material is provided by this disclosure which utilizes prior art host matrix materials with new resident inclusions for structural members with unique properties and applications. An illustrative embodiment of a composite material according to the principles of this invention is described with fiber inclusions fabricated by electroplating of a polycrystalline film on a substrate. Polycrystalline fibers are fabricated with a wide range of sizes to have strength approaching those of a single crystal whisker of the polycrystalline material. An illustrative composite material is fabricated with a host matrix of epoxy resin in which resident fiber inclusions are dispersed.

公开(公告)号：US3488166A

公开(公告)日：1970-01-06

申请号：US3488166D

申请日：1967-01-13

Applicant: IBM

Inventor： KOVAC ZLATA ,  OLSEN JUDITH D

IPC: C08J7/12 ,  C08L61/10 ,  C23C18/20 ,  C23C3/00 ,  C23B5/08

CPC classification number: C08J7/12 ,  C23C18/2086 ,  C23C18/30 ,  Y10S428/935 ,  Y10S428/936 ,  Y10T428/12049 ,  Y10T428/12104 ,  Y10T428/12118 ,  Y10T428/12472 ,  Y10T428/12569 ,  Y10T428/12868 ,  Y10T428/12931 ,  Y10T428/31877

公开(公告)号：DE3379899D1

公开(公告)日：1989-06-29

申请号：DE3379899

申请日：1983-11-29

Applicant: IBM

Inventor： AVIRAM ARI ,  KOVAC ZLATA ,  WANG HAN CHUNG

IPC: B41J2/305 ,  B41J1/20 ,  B41J2/495 ,  B41J9/10 ,  B41J27/20 ,  B41J3/12 ,  B41J3/08

公开(公告)号：DE3060612D1

公开(公告)日：1982-08-19

申请号：DE3060612

申请日：1980-03-27

Applicant: IBM

Inventor： BLUM SAMUEL EMIL ,  KOVAC ZLATA ,  VON GUTFELD ROBERT JACOB

IPC: B23K26/34 ,  C23C18/16 ,  C23C18/31 ,  H05K3/18 ,  H05K3/22 ,  C23C3/00 ,  B23K26/00

Abstract: A method for high resolution maskless electroless plating is described. Preferential plating results from exposing those regions where plating is sought to an energy beam to increase the plating rate by a factor of 103 to 104. This enhancement is sufficient to make masking unnecessary.

公开(公告)号：CA1107057A

公开(公告)日：1981-08-18

申请号：CA292605

申请日：1977-12-07

Applicant: IBM

Inventor： KOVAC ZLATA ,  SAMBUCETTI CARLOS J

IPC: C09D11/00 ,  C09C1/24 ,  C09D5/23 ,  H01F1/44 ,  H01F41/16 ,  C09D11/02

Abstract: WATER BASED SELECTABLE CHARGE MAGNETIC INKS Water based magnetic colloidal fluids, useable as inks, when prepared by coating chemically precipitated magnetite (Fe304) with an adsorption site providing coating agent including certain organic anions, such as sulfates, sulfonates or amino carboxilates, and then dispersing the coated product with non-ionic, anionic or cationic surfactants may exhibit selectably cationic, anionic or non-ionic charge responsiveness.

公开(公告)号：DE2061225A1

公开(公告)日：1971-09-09

申请号：DE2061225

申请日：1970-12-12

Applicant: IBM

Inventor： KOVAC ZLATA ,  DIANE OLSEN JUDITH

IPC: C25D3/56 ,  C25D5/18 ,  C25D15/02 ,  C25D21/12 ,  C23B5/32

Abstract: The effect of superimposing a sinusoidal alternating current on a direct current during electrodeposition of Ni-Fe alloys is disclosed in terms of the following factors: (a) maintaining the pH at the electrode equal to that of the bulk electrolyte; (b) ionic diffusion processes; and (c) chemical processes in solution prior to electrochemical reduction. The effect of frequency, amplitude and the rate of a-c current to d-c current on the composition of electrodeposited alloy are given for acid solutions of different pH and for alkaline solutions of metallic complexes with a variable concentration of complexing agent. It is shown that by proper choice of conditions, electrodeposited Fe-Ni alloys can be prepared with a desired uniform composition throughout their thickness.

公开(公告)号：CA1120656A

公开(公告)日：1982-03-30

申请号：CA347870

申请日：1980-03-18

Applicant: IBM

Inventor： BLUM SAMUEL E ,  KOVAC ZLATA ,  VON GUTFELD ROBERT J

IPC: B23K26/34 ,  C23C18/16 ,  C23C18/31 ,  H05K3/18 ,  H05K3/22 ,  B05D3/06

Abstract: MASKLESS METHOD FOR ELECTROLESS PLATING PATTERNS A method for high resolution maskless electroless plating is described. Preferential plating results from exposing those regions where plating is sought to an energy beam to increase the plating rate by a factor of 103 to 104. This enhancement is sufficient to make masking unnecessary. YO979-021

公开(公告)号：DE2529053A1

公开(公告)日：1976-03-04

申请号：DE2529053

申请日：1975-06-30

Applicant: IBM

Inventor： GARDINEER BARBARA ANN ,  KOVAC ZLATA

IPC: G03G15/11 ,  C09D5/23 ,  C09D11/00 ,  H01F1/44 ,  H01F41/16 ,  C09D11/16

公开(公告)号：CA945506A

公开(公告)日：1974-04-16

申请号：CA113589

申请日：1971-05-21

Applicant: IBM

Inventor： CHAUDHARI PRAVEEN ,  FREEDMAN JAMES F ,  KOVAC ZLATA

IPC: B29C70/14 ,  B29C70/62 ,  C22C32/00 ,  C22C47/00

公开(公告)号：DE1621095A1

公开(公告)日：1972-02-03

申请号：DEJ0035378

申请日：1967-12-29

Applicant: IBM

Inventor： KOVAC ZLATA ,  DIANE OLSEN JUDITH

IPC: C08J7/12 ,  C08L61/10 ,  C23C18/20 ,  C08G53/00

Abstract: 1,176,124. Coating with metals. INTERNATIONAL BUSINESS MACHINES CORP. Jan.8, 1968 [Jan.13, 1967], No.1038/68. Heading C7F. In the electroless deposition of a metal coating on a polymer, the surface is coated with a constituent monomer of the polymer, the monomer polymerized, and coated with a reducible metal salt, the monomer acting as a reducing agent for the metal salt. In an example a urea formaldehyde substrate is soaked in nitric acid, rinsed, dipped in formaldehyde, dried to polymerize the coating, and then the coatings is depolymerized in the presence of a metal salt which may be palladium, gold or nickel chloride or nickel, cobalt. or copper sulphate. The metal salt is reduced during this process. The substrate is then coated with Ni, Co, Cu, Pd or Ni-Fe, Ni-Co, or Ni-W-P alloys. Examples of both alkali and acid electroless nickel plating baths are desinked. The coating may be subsequently electro-plated.