公开(公告)号：CA3144801A1

公开(公告)日：2020-12-24

申请号：CA3144801

申请日：2020-06-04

Applicant: IBM

Inventor： SRIDHAR ARVIND RAJ MAHANKALI ,  BRUNSCHWILER THOMAS ,  YE SUIYING ,  DEL CARRO LUCA ,  AMMANN JENS OLIVER

IPC: H01F1/28 ,  H01F3/08 ,  H01F41/16

Abstract: A magnetic core comprises an anisotropic, composite material, which itself includes a matrix material (e.g., a dielectric, non-magnetic material, preferably a paramagnetic material), and magnetically aligned, ferromagnetic particles. The latter may for instance include micrometer- and/or nanometer-length scale particles. Such particles form chains of particles within the matrix material, wherein the chains form percolation paths of magnetic conduction. The paths extend along a first direction, whereby the chains extend, each, substantially along this first direction, while being distinct and distant from each other along a second direction that is perpendicular to the first direction and, possibly, to a third direction that is perpendicular to both the first direction and the second direction. Necking bridges are preferably formed between the particles. Related devices (e.g., inductor, amplifiers, transformers, etc.) and fabrication methods are also disclosed.

公开(公告)号：GB2498310A

公开(公告)日：2013-07-10

申请号：GB201307552

申请日：2011-10-21

Applicant: IBM

Inventor： BAROWSKI HARRY ,  HUBER ANDREAS ,  HARRER HUBERT ,  NIGGEMEIER TIM ,  SUPPER JOCHEN ,  MICHEL BRUNO ,  BRUNSCHWILER THOMAS ,  PAREDES STEPHAN

IPC: H01L23/50 ,  H01L23/36

Abstract: A mechanism is provided for integrated power delivery and distribution via a heat sink. The mechanism comprises a processor layer coupled to a signaling and input/output (I/O) layer via a first set of coupling devices and a heat sink coupled to the processor layer via a second set of coupling devices. In the mechanism, the heat sink comprises a plurality of grooves on one face, where each groove provides either a path for power or a path for ground to be delivered to the processor layer. In the mechanism, the heat sink is dedicated to only delivering power and does not provide data communication signals to the elements of the mechanism and the signaling and I/O layer is dedicated to only transmitting the data communication signals to and receiving the data communications signals from the processor layer and does not provide power to the elements of the process layer.