公开(公告)号：AU2020297854A1

公开(公告)日：2021-10-14

申请号：AU2020297854

申请日：2020-05-13

Applicant: IBM

Inventor： LEWANDOWSKI ERIC PETER ,  WEBB BUCKNELL ,  HERTZBERG JARED BARNEY ,  SANDBERG MARTIN ,  JINKA OBLESH

IPC: H01L23/44

Abstract: A thermalization structure is formed using a foil and a low temperature device (LTD). The foil includes a first layer of a first material. The LTD includes a surface from which heat is transferred away from the LTD. A coupling is formed between the foil and the surface of the LTD, where the coupling includes a bond formed between the foil and the surface such that forming the bond forms a set of ridges in the foil, a ridge in the set of ridges operating to dissipate the heat.