公开(公告)号：SG11202110210PA

公开(公告)日：2021-10-28

申请号：SG11202110210P

申请日：2020-05-13

Applicant: IBM

Inventor： LEWANDOWSKI ERIC ,  WEBB BUCKNELL ,  HERTZBERG JARED ,  SANDBERG MARTIN ,  JINKA OBLESH

IPC: H01L23/44

Abstract: A thermalization structure is formed using a foil and a low temperature device (LTD). The foil includes a first layer of a first material. The LTD includes a surface from which heat is transferred away from the LTD. A coupling is formed between the foil and the surface of the LTD, where the coupling includes a bond formed between the foil and the surface such that forming the bond forms a set of ridges in the foil, a ridge in the set of ridges operating to dissipate the heat.

公开(公告)号：AU2020296292A1

公开(公告)日：2021-10-14

申请号：AU2020296292

申请日：2020-06-19

Applicant: IBM

Inventor： JINKA OBLESH ,  OLIVADESE SALVATORE BERNARDO ,  HART SEAN ,  BRONN NICHOLAS TORLEIV ,  CHOW JERRY ,  BRINK MARKUS ,  GUMANN PATRYK ,  BOGORIN DANIELA FLORENTINA

IPC: F25D19/00 ,  H01L23/367

Abstract: A thermalization structure is formed using a cover configured with a set of pillars, the cover being a part of a cryogenic enclosure of a low temperature device (LTD). A chip including the LTD is configured with a set of cavities, a cavity in the set of cavities having a cavity profile. A pillar from the set of pillars and corresponding to the cavity has a pillar profile such that the pillar profile causes the pillar to couple with the cavity of the cavity profile within a gap tolerance to thermally couple the chip to the cover for heat dissipation in a cryogenic operation of the chip.

公开(公告)号：BR112021025725A2

公开(公告)日：2022-02-08

申请号：BR112021025725

申请日：2020-05-13

Applicant: IBM

Inventor： WEBB BUCKNELL ,  ERIC PETER LEWANDOWSKI ,  JARED BARNEY HERTZBERG ,  SANDBERG MARTIN ,  JINKA OBLESH

IPC: H01L23/44

Abstract: estrutura de termalização para dispositivos resfriados à temperatura criogênica. uma estrutura de termalização é formada utilizando uma folha e um dispositivo de baixa temperatura (ltd). a folha inclui uma primeira camada de um primeiro material. o ltd inclui uma superfície a partir da qual calor é transferido para longe do ltd. um acoplamento é formado entre a folha e a superfície do ltd, onde o acoplamento inclui uma ligação formada entre a folha e a superfície de modo que a formação da ligação forma um conjunto de cristas na folha, uma crista no conjunto de cristas operando para dissipar o calor.

公开(公告)号：BR112021025694A2

公开(公告)日：2022-02-08

申请号：BR112021025694

申请日：2020-06-19

Applicant: IBM

Inventor： BERNARDO SALVATORE OLIVADESE ,  DANIELA FLORENTINA BOGORIN ,  CHOW JERRY ,  BRINK MARKUS ,  NICHOLAS TORLEIV BRONN ,  JINKA OBLESH ,  GUMANN PATRYK ,  HART SEAN

IPC: F25D19/00 ,  H01L23/367

Abstract: embalagem criogênica para termalização de dispositivos de temperatura baixa. uma estrutura de termalização é formada utilizando uma cobertura configurada com um conjunto de pilares, a cobertura sendo parte de um invólucro criogênico de um dispositivo de baixa temperatura (ltd). um chip incluindo o ltd é configurado com um conjunto de cavidades, uma cavidade no conjunto de cavidades tendo um perfil de cavidade. um pilar a partir do conjunto de pilares e correspondendo à cavidade tem um perfil de pilar de modo que o perfil de pilar faça com que o pilar acople com a cavidade do perfil de cavidade em uma tolerância de folga para termicamente acoplar o chip à cobertura para dissipação de calor em uma operação criogênica do chip.

公开(公告)号：CA3143360A1

公开(公告)日：2020-12-24

申请号：CA3143360

申请日：2020-05-13

Applicant: IBM

Inventor： LEWANDOWSKI ERIC PETER ,  WEBB BUCKNELL ,  HERTZBERG JARED BARNEY ,  SANDBERG MARTIN ,  JINKA OBLESH

IPC: H01L23/36 ,  H01L39/00

Abstract: A thermalization structure is formed using a foil and a low temperature device (LTD). The foil includes a first layer of a first material. The LTD includes a surface from which heat is transferred away from the LTD. A coupling is formed between the foil and the surface of the LTD, where the coupling includes a bond formed between the foil and the surface such that forming the bond forms a set of ridges in the foil, a ridge in the set of ridges operating to dissipate the heat.

公开(公告)号：AU2020296292B2

公开(公告)日：2022-10-13

申请号：AU2020296292

申请日：2020-06-19

Applicant: IBM

Inventor： JINKA OBLESH ,  OLIVADESE SALVATORE BERNARDO ,  HART SEAN ,  BRONN NICHOLAS TORLEIV ,  CHOW JERRY ,  BRINK MARKUS ,  GUMANN PATRYK ,  BOGORIN DANIELA FLORENTINA

IPC: F25D19/00 ,  H01L23/367

Abstract: A thermalization structure is formed using a cover configured with a set of pillars, the cover being a part of a cryogenic enclosure of a low temperature device (LTD). A chip including the LTD is configured with a set of cavities, a cavity in the set of cavities having a cavity profile. A pillar from the set of pillars and corresponding to the cavity has a pillar profile such that the pillar profile causes the pillar to couple with the cavity of the cavity profile within a gap tolerance to thermally couple the chip to the cover for heat dissipation in a cryogenic operation of the chip.

公开(公告)号：IL288977D0

公开(公告)日：2022-02-01

申请号：IL28897721

申请日：2021-12-13

Applicant: IBM ,  JINKA OBLESH ,  OLIVADESE SALVATORE BERNARDO ,  HART SEAN ,  BRONN NICHOLAS TORLEIV ,  CHOW JERRY ,  BRINK MARKUS ,  GUMANN PATRYK ,  BOGORIN DANIELA FLORENTINA

Inventor： JINKA OBLESH ,  OLIVADESE SALVATORE BERNARDO ,  HART SEAN ,  BRONN NICHOLAS TORLEIV ,  CHOW JERRY ,  BRINK MARKUS ,  GUMANN PATRYK ,  BOGORIN DANIELA FLORENTINA

IPC: F25D19/00 ,  H01L21/265 ,  H01L23/367 ,  H01L23/44

Abstract: A thermalization structure is formed using a cover configured with a set of pillars, the cover being a part of a cryogenic enclosure of a low temperature device (LTD). A chip including the LTD is configured with a set of cavities, a cavity in the set of cavities having a cavity profile. A pillar from the set of pillars and corresponding to the cavity has a pillar profile such that the pillar profile causes the pillar to couple with the cavity of the cavity profile within a gap tolerance to thermally couple the chip to the cover for heat dissipation in a cryogenic operation of the chip.

公开(公告)号：CA3143434A1

公开(公告)日：2020-12-24

申请号：CA3143434

申请日：2020-06-19

Applicant: IBM

Inventor： JINKA OBLESH ,  OLIVADESE SALVATORE BERNARDO ,  HART SEAN ,  BRONN NICHOLAS TORLEIV ,  CHOW JERRY ,  BRINK MARKUS ,  GUMANN PATRYK ,  BOGORIN DANIELA FLORENTINA

IPC: F25D3/10 ,  F25D31/00 ,  F28D21/00 ,  H01L23/367

Abstract: A thermalization structure is formed using a cover configured with a set of pillars, the cover being a part of a cryogenic enclosure of a low temperature device (LTD). A chip including the LTD is configured with a set of cavities, a cavity in the set of cavities having a cavity profile. A pillar from the set of pillars and corresponding to the cavity has a pillar profile such that the pillar profile causes the pillar to couple with the cavity of the cavity profile within a gap tolerance to thermally couple the chip to the cover for heat dissipation in a cryogenic operation of the chip.

公开(公告)号：IL288745D0

公开(公告)日：2022-02-01

申请号：IL28874521

申请日：2021-12-07

Applicant: IBM ,  LEWANDOWSKI ERIC PETER ,  WEBB BUCKNELL C ,  HERTZBERG JARED BARNEY ,  SANDBERG MARTIN O ,  JINKA OBLESH

Inventor： LEWANDOWSKI ERIC PETER ,  WEBB BUCKNELL C ,  HERTZBERG JARED BARNEY ,  SANDBERG MARTIN O ,  JINKA OBLESH

IPC: G06N10/00 ,  H01L23/367 ,  H01L23/373 ,  H01L23/44 ,  H01L23/488 ,  H01L39/24

Abstract: A thermalization structure is formed using a foil and a low temperature device (LTD). The foil includes a first layer of a first material. The LTD includes a surface from which heat is transferred away from the LTD. A coupling is formed between the foil and the surface of the LTD, where the coupling includes a bond formed between the foil and the surface such that forming the bond forms a set of ridges in the foil, a ridge in the set of ridges operating to dissipate the heat.

公开(公告)号：SG11202110275QA

公开(公告)日：2021-10-28

申请号：SG11202110275Q

申请日：2020-06-19

Applicant: IBM

Inventor： JINKA OBLESH ,  OLIVADESE SALVATORE ,  HART SEAN ,  BRONN NICHOLAS ,  CHOW JERRY ,  BRINK MARKUS ,  GUMANN PATRYK ,  BOGORIN DANIELA

IPC: H01L23/367 ,  F25D19/00

Abstract: A thermalization structure is formed using a cover configured with a set of pillars, the cover being a part of a cryogenic enclosure of a low temperature device (LTD). A chip including the LTD is configured with a set of cavities, a cavity in the set of cavities having a cavity profile. A pillar from the set of pillars and corresponding to the cavity has a pillar profile such that the pillar profile causes the pillar to couple with the cavity of the cavity profile within a gap tolerance to thermally couple the chip to the cover for heat dissipation in a cryogenic operation of the chip.