Abstract:
PROBLEM TO BE SOLVED: To perform arbitrary adjustment of internal timing easily and externally by deriving the timing of an internal control signal from an internal signal in case of normal operation mode and deriving it from an external signal being fed with an internal control signal from an external terminal in case of rest mode. SOLUTION: In case of normal access mode, a WL, timer 11 times up to generate an SA Enable signal and then an SA timer 12 times up to generate a Col nable signal. When a test mode signal (TM GSAE and TM CCSLE) is activated and the timers 11, 12 are disabled, a DRAM integrated circuit is switched to test mode. If a WL Enable signal is formed, it is formed not through the timer 11 but through an external signal '/G' and an NAND gate 13. Furthermore, the Col Enable signal is formed through an external signal '/CAS' and an NAND gate 16.
Abstract:
PURPOSE: To reduce the power dissipating amounts of a bit line by providing a DRAM structure using a variable precharge voltage detecting technique. CONSTITUTION: In the end of a row address storage(RAS) cycle, a bit line 10 and a complementary bit 12 are short-circuited, and short-circuited through a line 32 with VEQ by equalizing devices 18, 20, and 22, and balancing is operated by bit line precharge in the next RAS cycle. This voltage is higher than the precharge voltage in the previous cycle. When a capacitance 88 of a memory cell to which access is performed stores 0V, the bit line precharge voltage is made lower than that in the previous RAS cycle. When a high level is stored in the cell capacitance of the cell connected with a word line and accessed in each following cycle, the same sequence is repeated in the following RAS cycle, and the bit line precharge voltage is increased in each cycle. Then, a bit line power can not be drawn from a DRAM power source by the balancing with a bit line pair voltage.
Abstract:
PURPOSE: To realize a DRAM capable of high speed operation by limiting a downward voltage swing of a low level side bit line to a prescribed voltage level higher than a reference voltage. CONSTITUTION: The downward voltage swing of the low level side bit line BLN generating by the activation of a first latch 10 is made to clamp to a prescribed bit line voltage level by controlling the voltage of a common node N1 of the first latch 10. And when FETs TN5, TN6 are continued to conduct, the voltage of the low level side bit line is dropped to about zero V. Hear, when the voltage of the low level side bit line BLN is dropped to a prescribed bit line low voltage level VBLL corresponding to a low level restore voltage by the activation of the latch 10, a PS1 and PS2 become low to turn off the TN5 and TN6. Therefore, the low level restore voltage is automatically provided to the low level side bit line.
Abstract:
PROBLEM TO BE SOLVED: To improve access cycle time of a dynamic random access memory (DRAM) system having a plurality of memory cells constituted of rows and columns. SOLUTION: A method comprises a step in which a destructive read mode is enabled, the destruction read mode is a mode for read out destructively a bit of information stored in a DRAM memory cell being addressed. A bit in which information is read destructively is stored temporarily in a temporary storage device. A delay write-back-mode is enabled, this delay write-back-mode is a mode for restoring bit of information in the DRAM memory cell being addressed afterward. Then, execution of the delay write-back-mode is scheduled in accordance with availability of space in the temporary storage device. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To enable operating a chip at a higher frequency by executing the overlap of operations by using a sense-amplifier circuit, two drivers connected to the circuit and a memory device having two lines of data buss lines connected to the circuit in order to receive data signals. SOLUTION: The operation of a circuit consisting of a sense amplifier 10, two NOR gates 11, 12 and global data busses MDQt, MDQc is controlled by 6 pieces of signals, that is, a writing gate signal WGTn, an MDQ reading and restoring signal DQRST, an MDQ equalizing signal MDQn, a sense amplifier equalizing signal GEQn, a sense amplifier switching signal SSASWn and a sense amplifier enabling signal SSAE, When the signal SSASWn is active, data on data busses MDQ are loaded to the sense amplifier 10 and when the signal SSAE is active, data on the data busses MDQ are amplified.
Abstract:
PROBLEM TO BE SOLVED: To obtain a method and a device for repairing a memory element by a selective domain redundancy substitution(SDRR) configuration after manufacturing and testing the memory element. SOLUTION: A memory array has a plurality of domains (210-0-210-15). A redundant array includes four redundant unit groups (220-0-220-3) (group A), 16 redundant unit groups (222-0-222-15) (group B) including each two redundant units, and 16 redundant unit groups (224-0-224-15) (group C) including each redundant unit. According to the trouble of each domain, the redundant unit group is selected, and a defective element is substituted for the redundant unit of the selected redundant unit group.
Abstract:
PROBLEM TO BE SOLVED: To reduce the number of signal lines to transmit data with a less amount of current without precharging by providing a sense amplifier and an inverter connected for providing complimentary output and converting the complimentary signal to the single-ended data signal and then transmitting to one read/write drive line. SOLUTION: A secondary sense amplifier unit 650 receives a data signal of memory array formed by MDQ architecture with a master bit line pair MDQ/MDQ bar and then sends to current mirror sense amplifiers (CMP) 600, 601. CMP 600, 601 generates the signal GD' via the corresponding signal GL and inverter 631. A driver consisting of a pair of NFET 620, PFET630 receives the signals GD, GD' and then sends the data to the input/output circuit by driving the single-ended bothway read/write drive lines RWD. The data on the drive line RWD is held by the latch 652 and this data swings only when it changes from the signal of the immediately preceding cycle. COPYRIGHT: (C)1999,JPO
Abstract:
PROBLEM TO BE SOLVED: To enable realizing fault tolerant design being applicable to a memory of arbitrary size by enable using a efficient and effective replacement domain out of at least two variable domains in which one part is overlapped, and using redundant constitution as variable domain redundant replacement(VDRR). SOLUTION: In a variable domain A (m=16) constituted with VDRR and superimposed and other two domains, when an obstacle is common for two domains, an obstacle in other domain can be restored by using a redundant circuit in one domain. Thereby, the possible and best restoring domain cart be selected in accordance with a type and magnitude of an obstacle. A VDRR method can restore an obstacle distributed at random, while holding obstacle and hard obstacle can be restored with less redundant overhead.
Abstract:
PROBLEM TO BE SOLVED: To provide fault tolerant design applicable to memory in any size by using redundant replacement configuration in variable size for selectively replacing a fault element with the redundant element in the same size. SOLUTION: The variable redundant array replacement configuration is provided with plural redundant units(RU) having variable number of redundant elements(RE) for each RU and at any RU, all the RE are simultaneously replaced by prescribed repair. For example, RU0-7 , RU8-11 , RU12-13 , RU14 and RU15 respectively have 1, 2, 4, 8 and 32 pieces of RE. At all the RU0-7 , single fault is repaired and at all the RU8-11 , the fault caused by short-circuiting generated between defective bit lines or elements is repaired. Then, the R12-13 , R14 and RU15 are secured for processing the much severe fault at a fault decoder or the like. Then, the RU is controlled by respectively correspondent redundant unit control circuit (RUCNT).
Abstract:
Embodiments may include an eFuse cell. The eFuse cell may include an eFuse having a first end and a second end. A blowFET has a first source/drain area, a second source/drain area, and a first gate. The first source/drain area is coupled to the second end of the eFuse, the second source/drain area is coupled to ground, and the first gate is coupled to a first node. The eFuse cell includes a senseFET having a third source/drain area, a fourth source/drain area, and a second gate. The second gate is coupled to the first node, and the third source/drain area is coupled to a second node. The second node is coupled to an operation signal and the second end of the eFuse. The eFuse cell includes a select eFuse logic element having an input to receive a select eFuse signal and an output coupled to the first node.