公开(公告)号：DE69518110D1

公开(公告)日：2000-08-31

申请号：DE69518110

申请日：1995-05-16

Applicant: IBM

Inventor： PATTANAIK SURYA

IPC: G11B5/48 ,  G11B21/10 ,  G11B5/60 ,  G11B21/21

Abstract: A method for the fabrication of a data recording disk file slider-suspension assembly, the slider being of the type having an air bearing surface, a back side opposite the air bearing surface and a trailing edge having a read or write transducer formed as a thin film thereon with electrical leads formed solely on the trailing edge and terminating adjacent the slider back side at termination pads, and a suspension having etched conductive lead structures and conductive contact pads connected to the lead structures. The method comprising the steps of forming a solder bump on each of the termination pads and each of the contact pads, wherein one or more solder bumps are selectively flattened, mechanically attaching the back side of the slider to the suspension such that the termination pads are properly aligned with the contact pads, and heating the solder bumps so as to reflow the termination pad and contact pad bumps such that they electrically connect, wherein a selectively flattened bump extends along an axis defined by a point on one pad and a point on another pad when heated to make contact with another bump.

公开(公告)号：PL329514A1

公开(公告)日：1999-03-29

申请号：PL32951497

申请日：1997-02-24

Applicant: IBM

Inventor： ERPELDING DAVID ,  PATTANAIK SURYA ,  SIMMONS RANDALL

IPC: G11B5/39 ,  G11B5/40 ,  G11B5/48 ,  H05K1/00 ,  H05K1/02

Abstract: MR heads having MR sensors are protected against damage caused by electrostatic discharge or the presence of electrostatically charged fields. A shunt is provided across the adjacent conductive leads or traces to the MR sensor at a point that is immediately adjacent their termination on the MR head. A solder bridge may be used for the shunt. The solder shunt is removed prior to putting the integrated suspension on which the MR head is mounted into operation in a magnetic disk drive system. The solder shunt is removed by reflowing the solder and drawing the reflowed solder away from the leads to break electrical connection of the shunt across the adjacent leads to the MR sensor. To facilitate removing the shunt by reflowing the solder, at least one solder lobe of a chosen geometry is placed adjacent a lead. This lobe includes a confining lobe which serves to confine the solder in the shunt region when the shunt is formed, and a designated portion which serves to draw the solder to a designated location away from the shunt region upon subsequent solder reflow, thereby causing a physical break in the shunt. Physical removal of the solder material would not be required. The shunt may also be in the form of an integral bridge of conductive material interconnecting the adjacent leads, which is removed by using a laser to melt the material.

公开(公告)号：AU6387896A

公开(公告)日：1997-10-10

申请号：AU6387896

申请日：1996-06-19

Applicant: IBM ,  FRATER NORMAN KERMIT ,  PATTANAIK SURYA ,  RUIZ OSCAR JAIME ,  SHUM WING C

Inventor： FRATER NORMAN KERMIT ,  PATTANAIK SURYA ,  RUIZ OSCAR JAIME ,  SHUM WING C

IPC: G11B5/60 ,  G11B5/48 ,  G11B21/21 ,  G11B21/10

Abstract: Disc file data read/write head assembly has a slider (56) having an air bearing surface facing the data surface of the disc and a back surface which is attached to a suspension (42) which biases the slider in close proximity to the disc surface, in which the spacing between the slider (56) and suspension (42) is maintained by at least one solder bump (66). Also claimed is the method of controlling the spacing between the suspension and slider as described above and in which the slider is attached to the suspension by adhesive surrounding the solder bumps, and such a slider suspension arrangement in a magnetic disc data storage system.

公开(公告)号：PL182746B1

公开(公告)日：2002-02-28

申请号：PL32951497

申请日：1997-02-24

Applicant: IBM

Inventor： ERPELDING DAVID ,  PATTANAIK SURYA ,  SIMMONS RANDALL

IPC: G11B5/39 ,  G11B5/40 ,  G11B5/48 ,  H05K1/00 ,  H05K1/02

Abstract: MR heads having MR sensors are protected against damage caused by electrostatic discharge or the presence of electrostatically charged fields. A shunt is provided across the adjacent conductive leads or traces to the MR sensor at a point that is immediately adjacent their termination on the MR head. A solder bridge may be used for the shunt. The solder shunt is removed prior to putting the integrated suspension on which the MR head is mounted into operation in a magnetic disk drive system. The solder shunt is removed by reflowing the solder and drawing the reflowed solder away from the leads to break electrical connection of the shunt across the adjacent leads to the MR sensor. To facilitate removing the shunt by reflowing the solder, at least one solder lobe of a chosen geometry is placed adjacent a lead. This lobe includes a confining lobe which serves to confine the solder in the shunt region when the shunt is formed, and a designated portion which serves to draw the solder to a designated location away from the shunt region upon subsequent solder reflow, thereby causing a physical break in the shunt. Physical removal of the solder material would not be required. The shunt may also be in the form of an integral bridge of conductive material interconnecting the adjacent leads, which is removed by using a laser to melt the material.

公开(公告)号：SG66492A1

公开(公告)日：1999-07-20

申请号：SG1998002954

申请日：1998-08-11

Applicant: IBM

Inventor： ARYA SATYA PRAKASH ,  ERPELDING A DAVID ,  PALMER DARRELL DEAN ,  PATTANAIK SURYA

IPC: G11B5/60 ,  G11B5/48 ,  G11B21/02 ,  H05K1/14 ,  G11B21/16 ,  G11B5/53

Abstract: A suspension member has integral electrical conductor leads which extend along its length to a rear tail section. The leads extend beyond the tail section for electrical connection with a reception pad member. The distal ends of the leads have recessed areas in the terminal edge to encourage the flow of liquid solder into the joint. The tail section has a pair of tab members which are received in apertures in the reception pad member in order align the leads correctly.

公开(公告)号：SG48522A1

公开(公告)日：1998-04-17

申请号：SG1997000892

申请日：1997-03-22

Applicant: IBM

Inventor： ERPELDING A DAVID ,  PATTANAIK SURYA ,  SIMMONS RANDALL GEORGE

IPC: G11B5/39 ,  G11B5/40 ,  G11B5/48 ,  H05K1/00 ,  H05K1/02 ,  G11B5/33

Abstract: MR heads having MR sensors are protected against damage caused by electrostatic discharge or the presence of electrostatically charged fields. A shunt is provided across the adjacent conductive leads or traces to the MR sensor at a point that is immediately adjacent their termination on the MR head. A solder bridge may be used for the shunt. The solder shunt is removed prior to putting the integrated suspension on which the MR head is mounted into operation in a magnetic disk drive system. The solder shunt is removed by reflowing the solder and drawing the reflowed solder away from the leads to break electrical connection of the shunt across the adjacent leads to the MR sensor. To facilitate removing the shunt by reflowing the solder, at least one solder lobe of a chosen geometry is placed adjacent a lead. This lobe includes a confining lobe which serves to confine the solder in the shunt region when the shunt is formed, and a designated portion which serves to draw the solder to a designated location away from the shunt region upon subsequent solder reflow, thereby causing a physical break in the shunt. Physical removal of the solder material would not be required. The shunt may also be in the form of an integral bridge of conductive material interconnecting the adjacent leads, which is removed by using a laser to melt the material.

公开(公告)号：SG47167A1

公开(公告)日：1998-03-20

申请号：SG1996010421

申请日：1996-08-02

Applicant: IBM

Inventor： PALMER DARRELL D ,  ERPELDING A DAVID ,  RUIZ OSCAR J ,  PATTANAIK SURYA

IPC: G11B5/48 ,  G11B5/54 ,  G11B5/60 ,  G11B21/00 ,  G11B21/08

公开(公告)号：GB2295918A

公开(公告)日：1996-06-12

申请号：GB9524956

申请日：1995-12-06

Applicant: IBM

Inventor： ERPELDING A DAVID ,  PALMER DARREL D ,  RUIZ OSCAR J ,  PATTANAIK SURYA

IPC: G11B5/60 ,  G11B5/48 ,  G11B21/21

Abstract: A suspension system for supporting a magnetic read/write slider comprises a load beam, a slider support member and a flexure comprised of a first flexure arm and a second flexure arm. The electrical conductors to the slider are positioned either along one or both flexure arms or adjacent to, but outside of, the second flexure arm, so as not to contribute to the stiffness of the second flexure arm. The electrical conductors are comprised of a laminated material which includes a conductor layer, such as a high strength copper alloy, a dielectric layer and a support layer. A first plurality of slots extend completely through the first flexible finger region, and a second plurality of slots extend completely through the second flexible finger region for providing regions into which the electrical conductors can move when the flexure undergoes deflections (see fig 12).

公开(公告)号：HU221357B1

公开(公告)日：2002-09-28

申请号：HU9902493

申请日：1997-02-24

Applicant: IBM

Inventor： ERPELDING DAVID ,  PATTANAIK SURYA ,  SIMMONS RANDALL GEORGE

IPC: G11B5/39 ,  G11B5/40 ,  G11B5/48 ,  H05K1/00 ,  H05K1/02

Abstract: MR heads having MR sensors are protected against damage caused by electrostatic discharge or the presence of electrostatically charged fields. A shunt is provided across the adjacent conductive leads or traces to the MR sensor at a point that is immediately adjacent their termination on the MR head. A solder bridge may be used for the shunt. The solder shunt is removed prior to putting the integrated suspension on which the MR head is mounted into operation in a magnetic disk drive system. The solder shunt is removed by reflowing the solder and drawing the reflowed solder away from the leads to break electrical connection of the shunt across the adjacent leads to the MR sensor. To facilitate removing the shunt by reflowing the solder, at least one solder lobe of a chosen geometry is placed adjacent a lead. This lobe includes a confining lobe which serves to confine the solder in the shunt region when the shunt is formed, and a designated portion which serves to draw the solder to a designated location away from the shunt region upon subsequent solder reflow, thereby causing a physical break in the shunt. Physical removal of the solder material would not be required. The shunt may also be in the form of an integral bridge of conductive material interconnecting the adjacent leads, which is removed by using a laser to melt the material.

公开(公告)号：SG85116A1

公开(公告)日：2001-12-19

申请号：SG1999002677

申请日：1999-05-21

Applicant: IBM

Inventor： ALBRECHT THOMAS ROBERT ,  PAN TZONG-SHII ,  ALBRECHT DAVID W ,  ARYA SATYA PRAKASH ,  PATTANAIK SURYA

IPC: G11B5/49 ,  G11B5/48

Abstract: A suspension system comprises a multiple letter flexure, a load beam and an arm. The load beam extends from the tip of the suspension all the way back to the rear of the arm. Datum holes are located in the load beam such that during assembly all reference points are made from the single load beam piece.