公开(公告)号：DE68917417T2

公开(公告)日：1995-03-16

申请号：DE68917417

申请日：1989-10-12

Applicant: IBM

Inventor： REE MOONHOR ,  SWANSON SALLY ANN ,  VOLKSEN WILLI ,  YOON DO YEUNG

IPC: C08J5/18 ,  C08L79/08 ,  C09J179/08 ,  H01B3/30

Abstract: Thin films of polyimide having electrical insulation, low thermal expansion, high glass transition temperature, and good ahesion are made by dispersing fine domains of relatively flexible polyimide which is fluorinated in a matrix of relatively rigid polyimide.

公开(公告)号：DE68917417D1

公开(公告)日：1994-09-15

申请号：DE68917417

申请日：1989-10-12

Applicant: IBM

Inventor： REE MOONHOR ,  SWANSON SALLY ANN ,  VOLKSEN WILLI ,  YOON DO YEUNG

IPC: C08J5/18 ,  C08L79/08 ,  C09J179/08 ,  H01B3/30

Abstract: Thin films of polyimide having electrical insulation, low thermal expansion, high glass transition temperature, and good ahesion are made by dispersing fine domains of relatively flexible polyimide which is fluorinated in a matrix of relatively rigid polyimide.

公开(公告)号：DE69004914T2

公开(公告)日：1994-05-19

申请号：DE69004914

申请日：1990-08-30

Applicant: IBM

Inventor： HENDRICK JAMES LUPTON ,  HOFER DONALD CLIFFORD ,  LABADIE JEFFREY WILLIAM ,  SWANSON SALLY ANN ,  VOLKSEN WILLI

IPC: C08G73/06 ,  C08G73/10 ,  H01B3/30

Abstract: Block copolymers of polyimide and poly (phenylquinoxaline) are synthesized. They are useful as packaging materials in the electronics industry.