公开(公告)号：DE69004914T2

公开(公告)日：1994-05-19

申请号：DE69004914

申请日：1990-08-30

Applicant: IBM

Inventor： HENDRICK JAMES LUPTON ,  HOFER DONALD CLIFFORD ,  LABADIE JEFFREY WILLIAM ,  SWANSON SALLY ANN ,  VOLKSEN WILLI

IPC: C08G73/06 ,  C08G73/10 ,  H01B3/30

Abstract: Block copolymers of polyimide and poly (phenylquinoxaline) are synthesized. They are useful as packaging materials in the electronics industry.

公开(公告)号：DE69004914D1

公开(公告)日：1994-01-13

申请号：DE69004914

申请日：1990-08-30

Applicant: IBM

Inventor： HENDRICK JAMES LUPTON ,  HOFER DONALD CLIFFORD ,  LABADIE JEFFREY WILLIAM ,  SWANSON SALLY ANN ,  VOLKSEN WILLI

IPC: C08G73/06 ,  C08G73/10 ,  H01B3/30

Abstract: Block copolymers of polyimide and poly (phenylquinoxaline) are synthesized. They are useful as packaging materials in the electronics industry.

公开(公告)号：DE3779237D1

公开(公告)日：1992-06-25

申请号：DE3779237

申请日：1987-06-16

Applicant: IBM

Inventor： HIRAOKA HIROYUKI ,  LABADIE JEFFREY WILLIAM ,  LEE JAMES HSI-TANG ,  MACDONALD SCOTT ARTHUR ,  WILLSON CARLTON GRANT

IPC: H01L21/302 ,  G03F7/40 ,  H01L21/027 ,  H01L21/3065 ,  G03F7/26

Abstract: The reactive ion etching and thermal flow resistance of a resist image is enhanced by contacting the resist image with an alkyl metal compound of magnesium or aluminium.