公开(公告)号：JPH10135202A

公开(公告)日：1998-05-22

申请号：JP28164197

申请日：1997-10-15

Applicant: IBM

Inventor： BROWN HUGH RALPH ,  KENETH RAYMOND CARTER ,  CHA HYUK-JIN ,  DIPIETRO RICHARD ANTHONY ,  JAMES LUPTON HEDRICK ,  HUMMEL JOHN PATRICK ,  ROBERT DENNIS MILLER ,  YOON DO YEUNG

IPC: C08G77/455 ,  C08G73/10 ,  C09D183/10 ,  H01L21/316 ,  H01L21/768 ,  H01L23/498 ,  H01L23/522

Abstract: PROBLEM TO BE SOLVED: To reduce required drive current and power consumption for the device, by laying interconnecting metal circuit lines on a substrate and disposing a specified dielectric material adjacent to the circuit lines. SOLUTION: The device comprises a substrate 2, meal circuit lines 4' and a dielectric material 6. The substrate 2 has vertical studs 8 formed therein. The dielectric material 6 in an org. polysilica, pref. a reaction product with polyaminate, having a terminal group (RO)m (R'')n SiR'-; m=1, 2 or 3, m+n=3, R and R' are hydrocarbyl group, R'' is hydride or hydrocarbyl group. The terminal group is a mono-, di- or tri-C1-C10 alkoxysilyl C1-10 alkyl or aryl group. This lowers the dielectric const. of the inserted dielectric material to allow the circuit line spacing to be reduced, without increasing the crosstalk or capacitive coupling, and also reduces the drive current and power consumption.

公开(公告)号：DE68917417T2

公开(公告)日：1995-03-16

申请号：DE68917417

申请日：1989-10-12

Applicant: IBM

Inventor： REE MOONHOR ,  SWANSON SALLY ANN ,  VOLKSEN WILLI ,  YOON DO YEUNG

IPC: C08J5/18 ,  C08L79/08 ,  C09J179/08 ,  H01B3/30

Abstract: Thin films of polyimide having electrical insulation, low thermal expansion, high glass transition temperature, and good ahesion are made by dispersing fine domains of relatively flexible polyimide which is fluorinated in a matrix of relatively rigid polyimide.

公开(公告)号：DE68917417D1

公开(公告)日：1994-09-15

申请号：DE68917417

申请日：1989-10-12

Applicant: IBM

Inventor： REE MOONHOR ,  SWANSON SALLY ANN ,  VOLKSEN WILLI ,  YOON DO YEUNG

IPC: C08J5/18 ,  C08L79/08 ,  C09J179/08 ,  H01B3/30

Abstract: Thin films of polyimide having electrical insulation, low thermal expansion, high glass transition temperature, and good ahesion are made by dispersing fine domains of relatively flexible polyimide which is fluorinated in a matrix of relatively rigid polyimide.

公开(公告)号：MY118011A

公开(公告)日：2004-08-30

申请号：MYPI9704493

申请日：1997-09-26

Applicant: IBM

Inventor： BROWN HUGH RALPH ,  CARTER KENNETH RAYMOND ,  CHA HYUK-JIN ,  DIPIETRO RICHARD ANTHONY ,  HEDRICK JAMES LUPTON ,  HUMMEL JOHN PATRICK ,  MILLER ROBERT DENNIS ,  YOON DO YEUNG

IPC: B32B3/10 ,  C08G77/455 ,  B32B15/08 ,  C08G73/10 ,  C09D183/10 ,  H01L21/316 ,  H01L21/48 ,  H01L21/768 ,  H01L23/498 ,  H01L23/522

Abstract: THE INVENTION RELATES TO AN INTEGRATED CIRCUIT DEVICE COMPRISING (I) A SUBSTRATE (2, 18); (II) METALLIC CIRCUIT LINES (4, 14, 16) POSITIONED ON THE SUBSTRATE AND (III) A DIELECTRIC MATERIAL (6, 10, 24) POSITIONED ON THE CIRCUIT LINES. THE DIELECTRIC MATERIAL COMPRISES THE REACTION PRODUCT OF AN ORGANIC POLYSILICA AND POLYAMIC ESTER PREFERABLY TERMINATED WITH AN ALKOXYSILYL ALKYL GROUP. (FIG. 1)

公开(公告)号：SG63750A1

公开(公告)日：1999-03-30

申请号：SG1997003478

申请日：1997-09-20

Applicant: IBM

Inventor： BROWN HUGH RALPH ,  CARTER KENNETH RAYMOND ,  CHA HYUK-JIN ,  DIPIETRO RICHARD ANTHONY ,  HEDRICK JAMES LUPTON ,  HUMMEL JOHN PATRICK ,  MILLER ROBERT DENNIS ,  YOON DO YEUNG

IPC: C08G77/455 ,  C08G73/10 ,  C09D183/10 ,  H01L21/316 ,  H01L21/768 ,  H01L23/498 ,  H01L23/522 ,  H01L21/312 ,  H01L21/48

Abstract: The invention relates to an integrated circuit device comprising (i) a substrate; (ii) metallic circuit lines positioned on the substrate and (iii) a dielectric material positioned on the circuit lines. The dielectric material comprises the reaction product of an organic polysilica and polyamic ester preferably terminated with an alkoxysilyl alkyl group.

公开(公告)号：DE3461935D1

公开(公告)日：1987-02-12

申请号：DE3461935

申请日：1984-02-08

Applicant: IBM

Inventor： ECONOMY JAMES ,  VOLKSEN WILLI ,  YOON DO YEUNG

IPC: C09D177/00 ,  B05D3/02 ,  B05D5/00 ,  B05D7/24 ,  C08G73/10 ,  C09D179/08 ,  C09D3/70

Abstract: A substrate is provided with a polyimide coating having good planarisation and good mechanical and thermal stability, by applying to the substrate an amino-terminated oligomer and an ester, with the oligomer being formed from an aromatic diamine and from an aromatic dianhydride, and by reacting the oligomer and the ester in situ. The ester is formed from an aromatic tetracarboxylic acid and an alcohol, and the ester is such that it reacts with an amine group of the oligomer to form a high molecular weight polyamide at a temperature between 40 DEG C and 140 DEG C, and continues to react to form a cyclic imide.