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    LOW TEMPERATURE SEALING GLASS
    11.
    发明专利
    LOW TEMPERATURE SEALING GLASS 未知

    公开(公告)号：CA1019354A

    公开(公告)日：1977-10-18

    申请号：CA203548

    申请日：1974-06-27

    Applicant: IBM

    Inventor： SHERK THOMAS A ,  TUMMALA RAO R

    IPC: C03C3/074 ,  C03C8/10 ,  C03C27/06

    Abstract: A family of sealing glasses which may be used for sealing glass plates together at relatively low temperatures. The glasses all have softening temperatures in the range 415 DEG -428 DEG C and have thermal coefficients of expansion (from room temperature to 300 DEG C) in the range of 80-83 x 10 7 per DEG C. The glasses consist substantially of the following constituents in the following proportions:

    12.
    发明专利
    未知

    公开(公告)号：FR2309484A1

    公开(公告)日：1976-11-26

    申请号：FR7600767

    申请日：1976-01-08

    Applicant: IBM

    Inventor： FOSTER BETTY J ,  TUMMALA RAO R

    IPC: H01J9/24 ,  C03C3/074 ,  C03C8/16 ,  C03C8/24 ,  C03C27/00 ,  C03C27/10 ,  H01J17/18

    Abstract: A low temperature glass frit seal composition and process employs a paste including particulate lead glass, an organic vehicle, and small amounts of finely divided TiO2. The TiO2 prevents attack by residual organic vehicle on the lead glass during sealing and adjusts the coefficient of thermal expansion to be compatible with the substrate glass.

    MULTI-LAYERED GLASS-CERAMIC SUBSTRATE FOR MOUNTING OF SEMICONDUCTOR DEVICE
    16.
    发明专利
    MULTI-LAYERED GLASS-CERAMIC SUBSTRATE FOR MOUNTING OF SEMICONDUCTOR DEVICE 未知

    公开(公告)号：CA1123116A

    公开(公告)日：1982-05-04

    申请号：CA343375

    申请日：1980-01-09

    Applicant: IBM

    Inventor： NARKEN BERNT ,  TUMMALA RAO R

    IPC: H01L23/12 ,  H01L21/48 ,  H01L23/08 ,  H01L23/15 ,  H01L23/538 ,  H05K1/03 ,  H05K1/11 ,  H05K3/10 ,  H05K3/24 ,  H05K3/38 ,  H05K3/42 ,  H05K3/46 ,  H05K1/14

    Abstract: Multilayered Glass-Ceramic Substrate For Mounting Of Semiconductor Device A method for fabricating an interconnection package for a plurality of semiconductor chips which include the fabrication of a multilayered glass-ceramic superstructure with a multilayered distribution of-conductors on a preformed multilayered glass-ceramic base, by the repeatable steps of depositing a conductor pattern on the base and forming thereon a crystallizable glass dielectric layer which is then crystallized to a glass-ceramic prior to further additions of conductor patterns and crystallizable glass layers to form a monolithic compatible substrate all through. Semiconductor chips can be electrically connected to exposed conductor patterns at the top surface of the resultant glass-ceramic package. FI9-78-039

    GLASS-CERAMIC STRUCTURES AND SINTERED MULTILAYER SUBSTRATES THEREOF WITH CIRCUIT PATTERNS OF GOLD, SILVER OR COPPER
    17.
    发明专利
    GLASS-CERAMIC STRUCTURES AND SINTERED MULTILAYER SUBSTRATES THEREOF WITH CIRCUIT PATTERNS OF GOLD, SILVER OR COPPER 未知

    公开(公告)号：CA1122789A

    公开(公告)日：1982-05-04

    申请号：CA377129

    申请日：1981-05-07

    Applicant: IBM

    Inventor： KUMAR ANANDA H ,  MCMILLAN PETER W ,  TUMMALA RAO R

    IPC: E04F21/00

    Abstract: GLASS-CERAMIC STRUCTURES AND SINTERED MULTILAYER SUBSTRATES THEREOF WITH CIRCUIT PATTERNS OF GOLD, SILVER OR COPPER Sintered glass-ceramic substrates containing multi-level, interconnected thick-film circuit patterns of highly conductive metals such as gold, silver or copper are provided which can be fired in air (for gold and silver) or in neutral atmospheres (for copper) at temperatures below the melting points of these metals. This has been made possible by the discovery that finely divided powders of certain glasses described herein sinter to essentially zero porosity at temperatures below 1000.degree.C while simultaneously maturing to glass-ceramics of low dielectric constant, high flexural strength and low thermal expansivity.

    DIELECTRIC GLASS COMPOSITION
    19.
    发明专利
    DIELECTRIC GLASS COMPOSITION 未知

    公开(公告)号：CA1031954A

    公开(公告)日：1978-05-30

    申请号：CA202314

    申请日：1974-06-12

    Applicant: IBM

    Inventor： SHERK THOMAS A ,  TUMMALA RAO R

    IPC: H01J11/02 ,  C03C3/072 ,  C03C3/091 ,  C03C4/16 ,  C03C8/10 ,  H01B3/08

    Abstract: A family of dielectric glasses having properties such that, when heat is applied to seal the dielectric glasses, there is no crazing in a MgO overcoat. These dielectric glasses have such viscosity properties as not to craze a MgO overcoat in the range 455 to 505 DEG C corresponding to log viscosity of 10.3 poises and yet fire into good dielectric films at about 600 DEG C. The glass has substantially the following constituents: }% by weight }PbO 62.4 - 69.6 }SiO2 5.8 - 13.6 }B2O3 13.6 - 20 }Al2O3 0.2 - 1.0 }MgO 0 - 5 }CaO 0 - 6 }

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