公开(公告)号：DE102009042921B4

公开(公告)日：2021-04-29

申请号：DE102009042921

申请日：2009-09-24

Applicant: INFINEON TECHNOLOGIES AG

Inventor： PAULUS STEFAN ,  FRIES MANFRED ,  PETZ MARTIN ,  MÜLLER THOMAS

IPC: H01L23/055 ,  H01L21/60 ,  H01L23/28 ,  H01L23/34 ,  H01L23/48

Abstract: Halbleiterbauelement (300), umfassend:eine Formstruktur (305), die einen Hohlraum (315) definiert,mehrere, in die Formstruktur (305) eingeformte separate Zuleitungen (303a, 303b, 303c), undeinen in dem Hohlraum (315) an der Formstruktur (305) über mindestens zweien der mehreren separaten Zuleitungen (303a, 303b, 303c) angebrachten Chip (307),wobei sich die mindestens zwei der mehreren separaten Zuleitungen (303a, 303b, 303c) in einem Überlappungsgebiet (3099) in einer Projektion orthogonal zu einer Chiphauptfläche zumindest teilweise mit dem Chip (307) überlappen,wobei die mindestens zwei der mehreren separaten Zuleitungen (303a, 303b, 303c) derart nach oben gebogen sind, dass sie innerhalb des Hohlraums (315) an freiliegenden Abschnitten an der Formstruktur (305) freiliegen, wobei der Chip (307) mittels verbindender Elemente (319) mit den freiliegenden Abschnitten der mindestens zwei der mehreren separaten Zuleitungen (303a, 303b, 303c) elektrisch verbunden ist,wobei die mindestens zwei der mehreren separaten Zuleitungen (303a, 303b, 303c) an gegenüberliegenden Seiten aus der Formstruktur (305) herausragen,wobei die Formstruktur (305) eine ausgeformte erste Isolierschicht (311) definiert, die den Chip (307) von den mindestens zweien der mehreren separaten Zuleitungen (303a, 303b, 303c) trennt, undwobei der Chip (307) mit Hilfe eines Klebers (313) an der ausgeformten ersten Isolierschicht (311) angebracht ist und der Kleber (313) eine klebende zweite Isolierschicht bildet, die zwischen dem Chip (307) und der ausgeformten ersten Isolierschicht (311) angeordnet ist.

公开(公告)号：DE59914977D1

公开(公告)日：2009-04-23

申请号：DE59914977

申请日：1999-10-11

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HEITZER JOSEF ,  FRIES MANFRED

IPC: G06K19/077

公开(公告)号：DE102004013733A1

公开(公告)日：2005-12-29

申请号：DE102004013733

申请日：2004-03-18

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FRIES MANFRED

IPC: H01L25/16

公开(公告)号：AT281674T

公开(公告)日：2004-11-15

申请号：AT97915335

申请日：1997-03-04

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FRIES MANFRED ,  JANCZEK THIES

IPC: B42D15/10 ,  G06K19/077

Abstract: A chip card for the contactless transmission of electric signals to a terminal includes a card body in which a coupling element having conductor tracks and contact connections, and a semiconductor chip having an electronic circuit associated with the coupling element, are constructed in an integrated manner. The semiconductor chip is provided on its surface with contact elements for electrical connection of the electronic circuit and the contact connections of the coupling element. A carrier made of an electrically insulating material supports at least part of the conductor tracks and the contact connections of the coupling element. The carrier is provided with an aperture in the vicinity of the contact connections of the coupling element, for receiving the semiconductor chip.

公开(公告)号：AT280976T

公开(公告)日：2004-11-15

申请号：AT00106473

申请日：2000-03-24

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FRIES MANFRED ,  FISCHBACH REINHARD

IPC: G06K9/00

Abstract: The housing (30) for biometric sensor chips (1) with a freely accessible fingerprint check surface (2) further includes a carrier substrate (3) in the form of a belt with perforated edges (6) carrying contact elements (4) located partly outside the housing frame (7). The contact area (8) of the sensor chip is joined to the housing frame to form a three-dimensional frame. Also claimed is a method for producing such a housing. It involves structurization of a metal layer on the carrier substrate and positioning of the sensor chip on the resulting structured metal layer.

公开(公告)号：DE59908607D1

公开(公告)日：2004-03-25

申请号：DE59908607

申请日：1999-12-07

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FRIES MANFRED ,  HOUDEAU DETLEF

IPC: G07G1/00 ,  G06K19/067 ,  G06K19/07 ,  G06K19/073 ,  G06K19/077 ,  G06K19/10 ,  G08B13/24 ,  G09F3/00 ,  H01Q1/00

Abstract: A product label includes a semiconductor chip and an antenna. The semiconductor chip stores information about a product. The antenna transmits the information about the product to a reading device. The antenna has a predetermined breaking point at which the antenna can be destroyed during the reading operation by energy introduced by the reading device so that the product label can be read only for a specific number of read cycles. A method of producing product labels and a method for a contactless, forgery-proof identification of products are also provided.

公开(公告)号：AT259979T

公开(公告)日：2004-03-15

申请号：AT99966832

申请日：1999-12-07

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FRIES MANFRED ,  HOUDEAU DETLEF

IPC: G07G1/00 ,  G06K19/067 ,  G06K19/07 ,  G06K19/073 ,  G06K19/077 ,  G06K19/10 ,  G08B13/24 ,  G09F3/00 ,  H01Q1/00

Abstract: A product label includes a semiconductor chip and an antenna. The semiconductor chip stores information about a product. The antenna transmits the information about the product to a reading device. The antenna has a predetermined breaking point at which the antenna can be destroyed during the reading operation by energy introduced by the reading device so that the product label can be read only for a specific number of read cycles. A method of producing product labels and a method for a contactless, forgery-proof identification of products are also provided.

公开(公告)号：MXPA02009501A

公开(公告)日：2003-05-14

申请号：MXPA02009501

申请日：2001-03-28

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FRIES MANFRED

IPC: H01L21/56 ,  H01L23/28

Abstract: La invencion se refiere a un ensamble de alojamiento para un componente electronico (1), y un procedimiento para el empaque de un componente electronico donde el ensamble de alojamiento presenta cuando menos un componente electronico que ha de empacarse (2), un portador externo (3), y un marco de alojamiento (4), una resina de epoxido de efecto capilar se introduce por medio de una abertura de llenado (7), en el ensamble de alojamiento compuesto y se cierran por medio de su accion capilar los espacios intermedios entre el chip semiconductor y el marco de alojamiento.

公开(公告)号：BR0109645A

公开(公告)日：2003-03-18

申请号：BR0109645

申请日：2001-03-28

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FISCHBACH REINHARD ,  FRIES MANFRED ,  ZAESKE MANFRED

IPC: H01L23/28 ,  H01L21/56

Abstract: A housing assembly forms a package for an electronic device. The housing assembly has the electronic device, an external carrier and a housing frame. A capillary-acting epoxy resin is filled into the assembled housing assembly via a filling-in opening and, on account of its capillary action, closes the interspaces between the semiconductor chip and the housing frame.

公开(公告)号：AU4827401A

公开(公告)日：2001-10-08

申请号：AU4827401

申请日：2001-03-22

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FISCHBACH REINHARD ,  FRIES MANFRED

IPC: G06K9/00

Abstract: The housing (30) for biometric sensor chips (1) with a freely accessible fingerprint check surface (2) further includes a carrier substrate (3) in the form of a belt with perforated edges (6) carrying contact elements (4) located partly outside the housing frame (7). The contact area (8) of the sensor chip is joined to the housing frame to form a three-dimensional frame. Also claimed is a method for producing such a housing. It involves structurization of a metal layer on the carrier substrate and positioning of the sensor chip on the resulting structured metal layer.