公开(公告)号：DE19954888C2

公开(公告)日：2002-01-10

申请号：DE19954888

申请日：1999-11-15

Applicant: INFINEON TECHNOLOGIES AG

Inventor： KAHLISCH KNUT ,  STRUTZ VOLKER

IPC: H01L23/13 ,  H01L23/16 ,  H01L23/31 ,  H01L23/498 ,  H01L23/055 ,  H01L23/12 ,  H01L23/50 ,  H01L23/28

Abstract: The invention relates to a packaging for a semiconductor chip. A frame that directly surrounds the slot is provide on the carrier board on the side of the nubbins. Said frame is provided with the same height as the nubbins and the slot and the frame surrounding said slot are at least partially filled with a casting compound which is preferably adapted to the thermal expansion coefficients of the semiconductor chip.

公开(公告)号：DE19954888A1

公开(公告)日：2001-05-23

申请号：DE19954888

申请日：1999-11-15

Applicant: INFINEON TECHNOLOGIES AG

Inventor： KAHLISCH KNUT ,  STRUTZ VOLKER

IPC: H01L23/13 ,  H01L23/16 ,  H01L23/31 ,  H01L23/498 ,  H01L23/055 ,  H01L23/12 ,  H01L23/50 ,  H01L23/28

Abstract: The invention relates to a packaging for a semiconductor chip (10). A frame (9) that directly surrounds the slot (5) is provided on the carrier board (1) on the side of the nubbins (8). Said frame is provided with the same height as the nubbins (8) and the slot (5) and the frame (9) surrounding said slot (5) are at least partially filled with a casting compound which is preferably adapted to the thermal expansion coefficients of the semiconductor chip (10).

公开(公告)号：DE50113282D1

公开(公告)日：2008-01-03

申请号：DE50113282

申请日：2001-06-18

Applicant: INFINEON TECHNOLOGIES AG

Inventor： KAHLISCH KNUT ,  MIETH HENNING

IPC: H01L23/28 ,  H01L23/31 ,  H01L21/56 ,  H01L21/60 ,  H01L23/13 ,  H01L23/29 ,  H01L23/495 ,  H01L23/498

Abstract: Support matrices for semiconductors are often encapsulated in a region of the bonding leads, the so-called bonding channel. The encapsulation is effected using a dispensable material that can flow onto the support matrix and causes contamination there. In order to prevent this flow, the support matrix for integrated semiconductors has a frame, conductor track structures and at least one bonding channel. In the bonding channel bonding leads or wires for connecting the conductor track structures to the integrated semiconductor are disposed. Disposed along the edge of the bonding channel a barrier for preventing the flow of flowable material from the bonding channel onto the frame and/or the conductor track structures. A method for producing such support matrices is likewise disclosed.

公开(公告)号：DE10158770B4

公开(公告)日：2006-08-03

申请号：DE10158770

申请日：2001-11-29

Applicant: INFINEON TECHNOLOGIES AG

Inventor： DOBRITZ STEPHAN ,  KAHLISCH KNUT ,  KROEHNERT STEFFEN

IPC: H01L23/50 ,  H01L23/495

Abstract: A leadframe of a conductive material includes a central region to accommodate a chip and a plurality of connecting fingers extending at least from one side in the direction of the central region, a contact region being provided adjacent to the central region on at least some of the connecting fingers. The course of the connecting fingers is such that a sectional face in an arbitrary imaginary cross-section at right angles to the main face of the leadframe has leadframe material. In such a case, it is attempted to keep cross-sections in a component without leadframe material as small as possible.

公开(公告)号：DE102005003390A1

公开(公告)日：2006-07-27

申请号：DE102005003390

申请日：2005-01-24

Applicant: INFINEON TECHNOLOGIES AG

Inventor： KROEHNERT STEFFEN ,  KAHLISCH KNUT ,  WAHRMUND WIELAND

IPC: H01L23/16 ,  H01L23/13 ,  H01L23/31 ,  H01L23/32

Abstract: The substrate has a chip side accommodating a semiconductor chip, and a solder ball side applying solder balls on ball pads. A bond channel (15) is designed as opening between the chip and ball sides for arranging wire straps (11) on the ball side. The channel is lockable with a housing part consisting of a sealing compound. Form closure units for the compound are arranged in the area, in which the part is formed, of the substrate.

公开(公告)号：DE10254648A1

公开(公告)日：2004-06-09

申请号：DE10254648

申请日：2002-11-22

Applicant: INFINEON TECHNOLOGIES AG

Inventor： KAHLISCH KNUT ,  MIETH HENNING ,  BLASZCZAK STEPHAN ,  REIS MARTIN

IPC: H01L21/56 ,  H01L23/16 ,  H01L23/31 ,  H01L23/04

Abstract: The carrier structure has a carrier substrate (100) provided with a bonding opening (116) and an applied connection layer (110), provided with a bonding channel (114) overlapping the bonding opening. A venting structure (118A,118B) allows escape of air from the bonding channel upon penetration of an encapsulation material, after fixing the semiconductor chip to the carrier structure, while preventing escape of the encapsulation meterial from the bonding channel. An Independent claim for a method for manufacture of a carrier structure for a semiconductor chip is also included.

公开(公告)号：DE10034006A1

公开(公告)日：2002-01-24

申请号：DE10034006

申请日：2000-07-07

Applicant: INFINEON TECHNOLOGIES AG

Inventor： KAHLISCH KNUT ,  MIETH HENNING

IPC: H01L23/28 ,  H01L21/56 ,  H01L21/60 ,  H01L23/13 ,  H01L23/29 ,  H01L23/31 ,  H01L23/498 ,  H01L23/50 ,  H01L23/04

Abstract: Support matrices for semiconductors are often encapsulated in a region of the bonding leads, the so-called bonding channel. The encapsulation is effected using a dispensable material that can flow onto the support matrix and causes contamination there. In order to prevent this flow, the support matrix for integrated semiconductors has a frame, conductor track structures and at least one bonding channel. In the bonding channel bonding leads or wires for connecting the conductor track structures to the integrated semiconductor are disposed. Disposed along the edge of the bonding channel a barrier for preventing the flow of flowable material from the bonding channel onto the frame and/or the conductor track structures. A method for producing such support matrices is likewise disclosed.

公开(公告)号：DE10030697A1

公开(公告)日：2002-01-10

申请号：DE10030697

申请日：2000-06-23

Applicant: INFINEON TECHNOLOGIES AG

Inventor： KAHLISCH KNUT ,  MIETH HENNING

IPC: H01L21/58 ,  H01L21/60 ,  H05K3/32

Abstract: To compensate for mechanical stresses in the substrate (1) a layer of adhesive (2) is applied to it on which is placed a compensating layer (3) in the form of a tape. Then liquid adhesive (4) is applied on top of the tape and the chip (10) placed in position. An alternative method is to use a frame (5) in place of the tape to ensure that the base of the chip is parallel with the substrate surface.

公开(公告)号：MY134343A

公开(公告)日：2007-12-31

申请号：MYPI20024274

申请日：2002-11-14

Applicant: INFINEON TECHNOLOGIES AG

Inventor： DOBRITZ STEPHAN ,  KAHLISCH KNUT ,  KROEHNERT STEFFEN

IPC: H01L23/50 ,  B23K31/02 ,  H01L23/34 ,  H01L23/48 ,  H01L23/495

Abstract: THE INVENTION PROPOSES A LEADFRAME OF A CONDUCTIVE MATERIAL, HAVING A CENTRAL REGION (14) TO ACCOMMODATE A CHIP, AND A PLURALITY OF CONNECTING FINGERS (12) WHICH EXTEND AT LEAST FROM ONE SIDE IN THE DIRECTION OF THE CENTRAL REGION (14), A CONTACT REGION (34) BEING PROVIDED ADJACENT TO THE CENTRAL REGION (14) ON AT LEAST SOME OF THE CONNECTING FINGERS (12). THE COURSE OF THE CONNECTING FINGERS IS IN THIS CASE SUCH THAT THE SECTIONAL FACE IN AN ARBITRARY IMAGINARY CROSS SECTION AT RIGHT ANGLES TO THE MAIN FACE OF THE LEADFRAME (10) HAS LEADFRAME MATERIAL. IN THIS CASE, IT IS ATTEMPTED TO KEEP CROSS SECTIONS IN A COMPONENT WITHOUT LEADFRAME MATERIAL AS SMALL AS POSSIBLE.

公开(公告)号：DE102005002862A1

公开(公告)日：2006-07-27

申请号：DE102005002862

申请日：2005-01-20

Applicant: INFINEON TECHNOLOGIES AG

Inventor： KROEHNERT STEFFEN ,  KAHLISCH KNUT ,  UHLMANN RUEDIGER ,  BENDER CARSTEN

IPC: H01L21/56 ,  H01L21/60 ,  H01L23/498

Abstract: The method involves mounting a semiconductor chip on a chip side of a substrate, and applying solder balls on a solder ball side of the substrate. A lower grouting form (16) is pressed for detection of lower housing part on the ball side. The substrate surface is designed as sealing area on the ball side such that the surface is provided with sealing units, with which the grouting form receives a sealing connection. An independent claim is also included for a substrate for manufacturing of a fine ball grid array component.