公开(公告)号：DE102004029587B4

公开(公告)日：2006-05-24

申请号：DE102004029587

申请日：2004-06-18

Applicant: INFINEON TECHNOLOGIES AG

Inventor： REIS MARTIN ,  LEGEN ANTON ,  KROEHNERT STEFFEN

IPC: H01L23/04

Abstract: A ball grid array package includes a substrate. A number of solder balls overlie the solder ball surface of the substrate. The solder balls are arranged within a ballout area. A chip is attached to the chip surface of the substrate by an adhesive layer. Contact pads of the chip are electrically connected to ones of the solder balls. The chip has an area that is smaller than the ballout area and the adhesive layer has an area that is at least as large as the ballout area such that each solder ball in the ballout area is located beneath the adhesive layer.

公开(公告)号：DE10327515A1

公开(公告)日：2005-01-20

申请号：DE10327515

申请日：2003-06-17

Applicant: INFINEON TECHNOLOGIES AG

Inventor： REIS MARTIN ,  KROEHNERT STEFFEN

IPC: H01L23/13 ,  H01L23/32

Abstract: The invention relates to a substrate-based IC package that includes a substrate on which a chip is mounted with a die attach material. The substrate is provided with a solder resist and has, on the side opposite the chip, conductor tracks provided with soldering globules. The conductor tracks are electrically coupled to the chip via wire jumpers, which extend through a bond channel which is filled with a mold compound. The chip and the substrate are encapsulated with a mold cap on the chip side. The substrate is provided with spacers for supporting a printing template for applying the die attach material. A strip of a solder resist that surrounds at least the bond channel gaplessly with essentially the same width is provided as the spacer.

公开(公告)号：DE10116069C2

公开(公告)日：2003-02-20

申请号：DE10116069

申请日：2001-04-02

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HAUSER CHRISTIAN ,  REIS MARTIN

IPC: H01L23/10 ,  H01L23/31 ,  H01L23/498 ,  H01L23/50 ,  H01L21/56

Abstract: The electronic component has a semiconductor chip mounted to a wiring board. The chip is bonded to the wiring board with adhesive strips that leave free a through-cutout, an additional cutout, and separating joints. The additional cutout provides for a plastic reservoir from which the separating joint between the adhesive strips is filled with plastic material.

公开(公告)号：DE10154199A1

公开(公告)日：2003-02-06

申请号：DE10154199

申请日：2001-11-07

Applicant: INFINEON TECHNOLOGIES AG

Inventor： ZACHERL JUERGEN ,  REIS MARTIN

IPC: H01L23/00 ,  H01L23/16 ,  H01L23/31 ,  H01L23/495 ,  H01L23/32

Abstract: Electronic component comprises a semiconductor chip (2) and a wiring plate (3). The surface of the wiring plate is connected with the active surface (5) of the chip by an adhesive layer (6). The wiring plate has a layer of shrinkage material (8) which has a lower thermal expansion coefficient than the material of the wiring plate and is surrounded by an insulating layer (11) on the lower side of the wiring plate. Independent claims are also included for: (1) a system carrier for several electronic components; and (2) a process for the production of the system carrier.

公开(公告)号：DE10129387A1

公开(公告)日：2003-01-09

申请号：DE10129387

申请日：2001-06-20

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GOTTLIEB ALFRED ,  ZACHERL JUERGEN ,  REIS MARTIN

IPC: H01L23/13 ,  H01L23/16 ,  H01L23/31 ,  H01L25/065 ,  H01L23/50 ,  H01L23/12 ,  H01L21/58 ,  H01L21/60

Abstract: An electronic component comprises a semiconductor chip (4) comprising an active front side with semiconductor structures and a passive rear side without semiconductor structures. The chip is fixed by its active front side on one side of a wiring plate (28) which has conductor strip structures on a second side facing away from the chip. The wiring plate has struts (6, 8) on its fist side. An Independent claim is also included for a process for the production of the inventive electronic component.

公开(公告)号：DE10213296B4

公开(公告)日：2007-01-04

申请号：DE10213296

申请日：2002-03-25

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BLASZCZAK STEPHAN ,  REIS MARTIN

IPC: H01L23/14 ,  H01L21/52 ,  H01L21/56 ,  H01L21/58 ,  H01L23/08 ,  H01L23/29 ,  H01L23/31 ,  H01L23/498

公开(公告)号：DE10162676B4

公开(公告)日：2005-06-02

申请号：DE10162676

申请日：2001-12-19

Applicant: INFINEON TECHNOLOGIES AG

Inventor： ZACHERL JUERGEN ,  REIS MARTIN

IPC: H01L23/13 ,  H01L23/31 ,  H01L23/498 ,  H01L23/32 ,  H01L23/12 ,  H01L23/50

Abstract: The invention relates to an electronic device and a leadframe and to methods for producing the electronic device and the leadframe. The electronic device has a semiconductor chip with a top side fixed on a rewiring plate by a double-sided adhesive film. The underside of the rewiring plate has an edge region with through openings. The through openings are filled with a plastics compound that holds together the semiconductor chip and the rewiring plate by acting as a mechanical clip.

公开(公告)号：DE10162676A1

公开(公告)日：2003-07-10

申请号：DE10162676

申请日：2001-12-19

Applicant: INFINEON TECHNOLOGIES AG

Inventor： ZACHERL JUERGEN ,  REIS MARTIN

IPC: H01L23/13 ,  H01L23/31 ,  H01L23/498 ,  H01L23/12 ,  H01L23/50

Abstract: The invention relates to an electronic device and a leadframe and to methods for producing the electronic device and the leadframe. The electronic device has a semiconductor chip with a top side fixed on a rewiring plate by a double-sided adhesive film. The underside of the rewiring plate has an edge region with through openings. The through openings are filled with a plastics compound that holds together the semiconductor chip and the rewiring plate by acting as a mechanical clip.

公开(公告)号：DE10201782A1

公开(公告)日：2003-03-27

申请号：DE10201782

申请日：2002-01-17

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HAUSER CHRISTIAN ,  WINDERL JOHANN ,  HAALBOOM THOMAS ,  REIS MARTIN

IPC: H01L21/48 ,  H01L23/31 ,  H01L23/50 ,  H01L21/60

Abstract: The chip (4) is mounted on a wiring panel (6) with track layers (61, 62). It is connected via bonding wires (8) to contact areas (64). The tracks (63) are connected by through-contacts (vias). These are arranged at a surrounding edge (68) of a bond channel (67), and at least over sections, form the edge of the bond channel. An Independent claim is included for the method of making the corresponding component.

公开(公告)号：DE10014304B4

公开(公告)日：2007-08-02

申请号：DE10014304

申请日：2000-03-23

Applicant: INFINEON TECHNOLOGIES AG

Inventor： REIS MARTIN ,  WINDERL JOHANN ,  NEU ACHIM ,  HAUSER CHRISTIAN ,  NEUMAYER MARTIN

IPC: H01L23/31 ,  H01L23/50

Abstract: A semiconductor component includes a semiconductor chip having contact pads on its main face, and a wiring foil, in which are recesses for the contact pads, applied to the main face. The foil has conductor tracks on a side facing away from the main side. The conductor tracks connect the contact pads to solder contacts. The contact pads located in the recess are electrically connected via wire connections to adjacent conductor track ends. Each wire connection is surrounded with a sealing compound of a first and a second layer. A method for manufacturing a semiconductor component includes applying wiring foil to a main side of the chip, producing the wire connection between contact pads and adjacent conductor track ends, applying sealing compound to locations on the recess to completely cover the wire connection with the sealing compound, and only curing the surface of the sealing compound.