Abstract:
PROBLEM TO BE SOLVED: To provide a radiation sensitive resin compsn. having superior sensitivity and pattern shape, excellent in adhesion especially to a gold coated substrate and suitable for use as a material for forming a circuit board, especially for forming a gold bumper. SOLUTION: This radiation sensitive compsn. contains an alkali-soluble copolymer consisting of 10-40wt.% radical polymerizable compd. having a carboxyl group, 20-70wt.% radical polymerizable compd. having a cycloalkyl group and no carboxyl group and 5-60wt.% other radical polymerizable compds. including at least a compd. represented by the formula, a compd. having at least one ethylenic unsatd. double bond and a radiation radical polymn. initiator.
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition which has high sensitivity and favorable storage stability and which can easily form a patterned thin film having favorable development margin and excellent adhesiveness, to provide an interlayer insulating film and a microlens formed from the above composition, and to provide a method for forming these elements. SOLUTION: The radiation-sensitive resin composition contains: (A) a high molecular weight compound having an acetal structure and/or a ketal structure, and an epoxy structure, and having ≥2,000 weight average molecular weight in terms of polystyrene measured by gel permeation chromatography; and (B) a compound which generates an acid of ≤4.0 pKa by irradiation of radiation. The interlayer insulating film and the microlens are produced from the above radiation-sensitive resin composition. COPYRIGHT: (C)2004,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition useful as a chemically amplified resist excellent in basic physical properties as a resist as well as in exposure window. SOLUTION: The radiation sensitive resin composition comprises (A) an alkali-insoluble or hardly alkali-soluble acid-dissociating group-containing resin which becomes alkali-soluble by dissociation of the acid-dissociating group, (B) a compound which generates an acid upon irradiation with an actinic ray or a radiation of ≤220 nm wavelength and (C) a phenolic compound represented by formula (C-1). COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition useful as a chemically amplified resist excellent in basic physical properties as a resist as well as in terms of an exposure window. SOLUTION: The radiation sensitive resin composition comprises (A) two or more acid-dissociating group-containing resins which have at least one of formulae (1)-(4) as a repeating unit, become alkali-soluble by dissociation of the acid-dissociating group, contain the same acid-dissociating group and have mutually different acid-dissociating group contents and (B) a compound which generates an acid upon irradiation with an actinic ray or a radiation. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition having high transparency for radiation and excellent basic physical properties as a resist such as sensitivity, resolution, dry etching durability and pattern profile. SOLUTION: The radiation sensitive resin composition contains the following resin and a radiation sensitive acid generator. The resin contains a repeating unit derived from alkyladamantyl (meth)acrylate or a repeating unit derived from mevalonic lactone (meth)acrylate and the resin is insoluble with alkali or hardly soluble with alkali and changed into alkali-soluble by the action of an acid. COPYRIGHT: (C)2003,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition ensuring good resolution and a good pattern section shape and suitable for use as a positive type resist having a good margin for exposure. SOLUTION: The radiation sensitive resin composition contains (A) an alkali- soluble novolak resin, (B) a naphthoquinonediazido compound of a phenol compound of formula (1) (where X1 and X2 are each H or alkyl and (p) and (q) are each 1 or 2) and (C) a low molecular weight compound containing 2 or 3 benzene rings and having at least one hydroxyl group on each of the benzene rings. The margin (Eop/Ec) of the composition for exposure is >=1.20.
Abstract:
PROBLEM TO BE SOLVED: To obtain a radiation sensitive resin compsn. excellent in plating resistance and flexibility and fit to form a circuit board by incorporating an alkali-soluble copolymer consisting of specified radical polymerizable compds., a compd. having at least one ethylenic unsatd. double bond and a radiation radical polymn. initiator. SOLUTION: This radiation sensitive resin compsn. contains an alkali-soluble copolymer consisting of 10-50wt.% radical polymerizable compd. having a carboxy group, 20-60wt.% radical polymerizable compd. having a cycloalkyl group but not having a carboxy group and 5-60wt.% other radical polymerizable compds. including at least a compd. represented by the formula, a compd. having at least one ethylenic unsatd. double bond and a radiation radical polymn. initiator. In the formula, R is H or methyl, R is H or 1-4C alkyl and (n) is an integer of 2-25.
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive composition which has high radiation sensitivity and development margin to form a favorable pattern even when the process time exceeds the optimum developing time in a developing process, and with which a patterned thin film having excellent adhesiveness can be easily formed, and to provide an interlayer insulating film of electronic parts and microlens. SOLUTION: The radiation-sensitive resin composition contains: [A] a copolymer of (a1) an unsaturated carboxylic acid and/or an unsaturated carboxylic acid anhydride, (a2) an unsaturated compound having an alicyclic epoxy skeleton expressed by formula, and (a3) an unsaturated compound excluding the compounds of (a1) and (a2); and [B] a 1,2-naphthoquinone diazide sulfonic acid ester. The interlayer insulating film and the microlens are produced from the above composition. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition which has high sensitivity to radiation and such development margin that a favorable pattern profile can be obtained even when the developing time exceeds the optimum developing time in the developing process, and with which a patterned thin film having excellent adhesiveness can be easily formed, to provide a method for forming an interlayer insulating film and a microlens by using the above radiation-sensitive resin composition, and to provide an interlayer insulating film and a microlens formed by the above method. SOLUTION: The radiation-sensitive resin composition contains: [A] a copolymer of (a1) an unsaturated carboxylic acid and/or unsaturated carboxylic acid anhydride, (a2) an epoxy group-containing unsaturated compound and (a3) an olefin unsaturated compound excluding the compounds of (a1) and (a2); and [B] a condensed product of a specified phenol compound and a 1,2-naphthoquinone diazide sulfonic acid halide. The interlayer insulating film and the microlens are formed from the above radiation-sensitive resin composition. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a purification process by which a metal contained in alicyclic hydrocarbon polymers as an impurity is removed and to provide a radiation-sensitive resin composition of a high performance photoresist which is composed of the purified polymer. SOLUTION: 1. The method of removing a metal contained in the alicyclic hydrocarbon polymer comprises the following processes: a process of coagulating the alicyclic hydrocarbon polymer by mixing an acid-added organic solvent solution of the polymer with its poor solvent, and a process of dissolving the coagulated polymer into a water-insoluble organic solvent, followed by bringing the solution into contact with an acidic hot water solution, extracting the metal contained therein. 2. The radiation-sensitive composition contains the alicyclic hydrocarbon polymer purified by the above-mentioned processes to remove the contained metal, and a radiation-sensitive acid generator. COPYRIGHT: (C)2004,JPO