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    Electronic module having canopy-type carriers
    11.
    发明专利
    Electronic module having canopy-type carriers 未知

    公开(公告)号：AU1329502A

    公开(公告)日：2002-04-29

    申请号：AU1329502

    申请日：2001-10-16

    Applicant: LEGACY ELECTRONICS INC

    Inventor： KLEDIZK KENNETH J ,  ENGLE JASON C

    IPC: H01L25/18 ,  H01L25/10 ,  H01L25/11 ,  H05K1/02 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36

    Abstract: An improved multi-chip module includes a main circuit board having an array of electrical interconnection pads to which are mounted a plurality of IC package units. Each IC package unit includes a pair of IC packages, both of which are mounted on opposite sides of a package carrier. The package units may be mounted on one or both sides of the main circuit board. A first primary embodiment of the invention employs a laminar package carrier having a pair of major planar surfaces. Each planar surface incorporates electrical contact pads. One IC package is surface mounted on each major planar surface, by interconnecting the leads of the package with the contact pads on the planar surface, to form the IC package unit. A second primary embodiment of the invention utilizes a carrier substrate, which has a pair of recesses for back-to-back surface mounting of the IC package pair. The two IC packages may be in contact with opposite sides of a heat sink layer embedded within the carrier substrate. Each resulting IC package unit is surface mounted to the main circuit board. A third primary embodiment of the invention incorporates features of both the first and second primary embodiments. One of the packages is mounted on a planar surface of the carrier right side up, while the other package is mounted on the carrier in a recess upside down. Several variants of this embodiment are possible. Either the IC package that is mounted on the planar surface of the carrier, or the IC package that is mounted within the recess, may be mounted adjacent to the main circuit board. In the former case, the adjacent package of the package unit fits within a recess on the main circuit board. In the latter case, the adjacent package of the package unit mounts on a planar surface of the main circuit board. For any of the three primary main embodiments, the carrier may be equipped with its own set of interconnection leads which interface with the interconnection pads on the main circuit board or connection may be made directly between the leads of one package and the interconnection pads of the circuit board.

    ELECTRONIC MODULE HAVING CANOPY-TYPE CARRIERS
    12.
    发明专利
    ELECTRONIC MODULE HAVING CANOPY-TYPE CARRIERS 未知

    公开(公告)号：HK1057645A1

    公开(公告)日：2004-04-08

    申请号：HK04100275

    申请日：2004-01-14

    Applicant: LEGACY ELECTRONICS INC

    Inventor： KLEDIZK KENNETH J ,  ENGLE JASON C

    IPC: H01L25/18 ,  H01L20090101 ,  H01L25/10 ,  H01L25/11 ,  H05K1/02 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36

    Abstract: An improved multi-chip module includes a main circuit board having an array of electrical interconnection pads to which are mounted a plurality of IC package units. Each IC package unit includes a pair of IC packages, both of which are mounted on opposite sides of a package carrier. The package units may be mounted on one or both sides of the main circuit board. A first primary embodiment of the invention employs a laminar package carrier having a pair of major planar surfaces. Each planar surface incorporates electrical contact pads. One IC package is surface mounted on each major planar surface, by interconnecting the leads of the package with the contact pads on the planar surface, to form the IC package unit. A second primary embodiment of the invention utilizes a carrier substrate, which has a pair of recesses for back-to-back surface mounting of the IC package pair. The two IC packages may be in contact with opposite sides of a heat sink layer embedded within the carrier substrate. Each resulting IC package unit is surface mounted to the main circuit board. A third primary embodiment of the invention incorporates features of both the first and second primary embodiments. One of the packages is mounted on a planar surface of the carrier right side up, while the other package is mounted on the carrier in a recess upside down. Several variants of this embodiment are possible. Either the IC package that is mounted on the planar surface of the carrier, or the IC package that is mounted within the recess, may be mounted adjacent to the main circuit board. In the former case, the adjacent package of the package unit fits within a recess on the main circuit board. In the latter case, the adjacent package of the package unit mounts on a planar surface of the main circuit board. For any of the three primary main embodiments, the carrier may be equipped with its own set of interconnection leads which interface with the interconnection pads on the main circuit board or connection may be made directly between the leads of one package and the interconnection pads of the circuit board.

    A MODULAR INTEGRATED CIRCUIT CHIP CARRIER
    13.
    发明专利
    A MODULAR INTEGRATED CIRCUIT CHIP CARRIER 未知

    公开(公告)号：AU2003216362A1

    公开(公告)日：2003-09-09

    申请号：AU2003216362

    申请日：2003-02-21

    Applicant: LEGACY ELECTRONICS INC

    Inventor： KLEDZIK KENNETH ,  ENGLE JASON C

    IPC: H01L25/065 ,  H05K1/00 ,  H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  H05K3/34 ,  H01L25/10

    Abstract: An apparatus and method is disclosed that allows for the arranging in a three dimensional array semiconductor chips on a circuit board. A unique chip carrier is disclosed on which any IC chip can be positioned on above the other on a circuit board. Additionally, the carrier allows for the testing of IC chips on the carrier and underneath it without having to remote the carrier and chips from the system even if they are of the BGA or CSP type. The carrier includes exposed test points to allow an on site test.

    Carrier-based electronic module
    14.
    发明专利
    Carrier-based electronic module 未知

    公开(公告)号：AU1329402A

    公开(公告)日：2002-04-29

    申请号：AU1329402

    申请日：2001-10-16

    Applicant: LEGACY ELECTRONICS

    Inventor： KLEDZIK KENNETH J ,  ENGLE JASON C

    IPC: H01L25/18 ,  H01L25/10 ,  H01L25/11 ,  H05K1/14 ,  H05K1/18 ,  H05K3/34 ,  H05K3/36

    Abstract: An improved multi-chip module includes a circuit board having an array of electrical interconnection pads to which are mounted a plurality of IC package units. Each IC package unit includes multiple IC packages, which are mounted on opposite sides of a package carrier. The package units may be mounted on one or both sides of the circuit board. A variety of package carriers are used to create a number of different modules. One type of package carrier has a pair of major planar surfaces. Each planar surface incorporates electrical contact pads. At least one IC package is surface mounted on each major planar surface, by interconnecting the connection elements, or leads, of the package with the contact pads on the planar surface, to form the IC package unit. Another type of package carrier substrate has a multiple recesses for back-to-back surface mounting of the IC packages. The package also includes in various versions heat sinks.

    CARRIER-BASED ELECTRONIC MODULE
    16.
    发明申请
    CARRIER-BASED ELECTRONIC MODULE 审中-公开
    基于载波的电子模块

    公开(公告)号：WO0234021A3

    公开(公告)日：2002-09-06

    申请号：PCT/US0132329

    申请日：2001-10-16

    Applicant: LEGACY ELECTRONICS ,  KLEDZIK KENNETH J ,  ENGLE JASON C

    Inventor： KLEDZIK KENNETH J ,  ENGLE JASON C

    IPC: H01L25/18 ,  H01L25/10 ,  H01L25/11 ,  H05K1/14 ,  H05K1/18 ,  H05K3/34 ,  H05K3/36

    CPC classification number: H05K1/182 ,  H01L2924/0002 ,  H05K1/141 ,  H05K3/3421 ,  H05K3/3442 ,  H05K3/368 ,  H05K2201/09072 ,  H05K2201/10689 ,  H05K2201/10734 ,  H05K2203/1572 ,  H01L2924/00

    Abstract: An improved multi-chip module includes a circuit board (301) having an array of electrical interconnection pads to which are mounted a plurality of IC package units (201). Each IC package unit (201) includes multiple IC packages (105) which are mounted on opposite sides of a package carrier (101). The package units (201) may be mounted on one or both sides of the circuit board (301). A variety of package carriers are used to create a number of different modules. One type of package carrier (101) has a pair of major planar surfaces (102). Each planar surface (102) incorporates electrical contact pads (103). At least one IC package (105) is surface mounted on each major planar surface by interconnecting the conntection elements or leads (104) of the package (105) with contact pads (103) on the planar surface (102), to form the IC package unit (201). Another type of package carrier substrate has multiple recesses for back to back surface mounting of the IC packages. The packages also include in various versions heat sinks.

    Abstract translation: 改进的多芯片模块包括具有电互连焊盘阵列的电路板（301），多个IC封装单元（201）安装到所述电互连焊盘阵列。 每个IC封装单元（201）包括安装在封装载体（101）的相对侧上的多个IC封装（105）。 封装单元（201）可以安装在电路板（301）的一侧或两侧上。 各种封装载体被用来创建许多不同的模块。 一种类型的包装载体（101）具有一对主平坦表面（102）。 每个平面表面（102）包含电接触垫（103）。 通过将封装（105）的连接元件或引线（104）与平坦表面（102）上的接触垫（103）互连，将至少一个IC封装（105）表面安装在每个主平面表面上，以形成IC 封装单元（201）。 另一种类型的封装载体基板具有多个用于IC封装的背面安装的凹部。 这些封装还包括各种版本的散热器。

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