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    HIGH-POWER ELECTRONIC DEVICES CONTAINING METAL NANOPARTICLE-BASED THERMAL INTERFACE MATERIALS AND RELATED METHODS
    14.
    发明公开
    HIGH-POWER ELECTRONIC DEVICES CONTAINING METAL NANOPARTICLE-BASED THERMAL INTERFACE MATERIALS AND RELATED METHODS 有权
    随着高性能电子设备上的金属含有纳米颗粒的基热界面材料和相关手续

    公开(公告)号：EP3036764A4

    公开(公告)日：2017-04-26

    申请号：EP14838148

    申请日：2014-08-22

    Applicant: LOCKHEED CORP

    Inventor： PAOLELLA ARTHUR ,  ERMER SUSAN PATRICIA ,  ZINN ALFRED A ,  DEGLER DAVID S ,  WINTER ADAM THERON

    IPC: H01L23/373

    CPC classification number: H01L23/3736 ,  H01L23/373 ,  H01L23/3732 ,  H01L23/3737 ,  H01L23/42 ,  H01L33/641 ,  H01L2924/0002 ,  H01L2933/0075 ,  H01L2924/00

    Abstract: High-power electronic components generate significant amounts of heat that must be removed in the course of normal device operations. Certain types of electronic components, such as some monolithic microwave integrated circuits and LEDs, can contain materials that are difficult to effectively bond to a heat gink in order to establish a thermal interface between the two. Device assemblies can include a heat-generating electronic component in thermal communication with a metallic heat sink via a metallic thermal interface layer. The metallic thermal interface layer is disposed between the heat-generating electronic component and the metallic heat sink. The metallic thermal interface layer is formed from a composition including a plurality of metal nanoparticles that are at least partially fused together with one another. Methods for forming a thermal interface layer include heating metal nanoparticles above their fusion temperature and subsequently cooling the liquefied metal nanoparticles to promote bonding of the electronic component.

    Abstract translation: 高功率电子元件产生热量显著量也必须在正常设备操作的过程中被删除。 某些类型的电子元件，颜色：如一些单片微波集成电路和LED，可以包含的材料做了难以有效地粘结到热怪人以建立两者之间的热界面。 装置组件可包括热连通经由金属热界面层的金属散热器的发热电子部件。 该金属热界面层发热电子部件和金属制的散热之间设置。 该金属热界面层是由包含金属纳米颗粒的多元性被至少没有部分地相互稠合在一起的组合物形成。 用于形成热界面层的方法包括加热金属纳米颗粒高于它们的熔融温度和随后冷却该液化的金属纳米粒子，以促进电子部件的接合。

    METAL NANOPARTICLES FORMED AROUND A NUCLEUS
    15.
    发明公开
    METAL NANOPARTICLES FORMED AROUND A NUCLEUS 审中-公开
    金属纳米粒子由核

    公开(公告)号：EP2900410A4

    公开(公告)日：2016-07-20

    申请号：EP13841564

    申请日：2013-09-26

    Applicant: LOCKHEED CORP

    Inventor： ZINN ALFRED A

    IPC: B22F9/20 ,  B01J13/02 ,  B22F1/00 ,  B22F1/02 ,  B22F9/18 ,  B22F9/24 ,  B32B5/16 ,  B82Y40/00

    CPC classification number: B22F1/0007 ,  B01J13/02 ,  B22F1/0018 ,  B22F1/0062 ,  B22F1/025 ,  B22F9/18 ,  B22F9/24 ,  B82Y40/00

    Abstract: Metal nanoparticles and compositions derived therefrom can be used in a number of different applications. Methods for making metal nanoparticles can include providing a first metal salt in a solvent; converting the first metal salt into an insoluble compound that constitutes a plurality of nanoparticle seeds; and after forming the plurality of nanoparticle seeds, reacting a reducing agent with at least a portion of a second metal salt in the presence of at least one surfactant and the plurality of nanoparticle seeds to form a plurality of metal nanoparticles. Each metal nanoparticle can include a metal shell formed around a nucleus derived from a nanoparticle seed, and the metal shell can include a metal from the second metal salt. The methods can be readily scaled to produce bulk quantities of metal nanoparticles.

    NANOPARTICLE PASTE FORMULATIONS AND METHODS FOR PRODUCTION AND USE THEREOF
    16.
    发明公开
    NANOPARTICLE PASTE FORMULATIONS AND METHODS FOR PRODUCTION AND USE THEREOF 有权
    VERFAHREN ZUR HERSTELLUNG在VERWENDUNG DAVON的NANOPARTIKELPASTENFORMULIERUNGEN

    公开(公告)号：EP2812139A4

    公开(公告)日：2015-07-01

    申请号：EP13746985

    申请日：2013-02-11

    Applicant: LOCKHEED CORP

    Inventor： ZINN ALFRED A ,  FRIED ANDREW ,  STACHOWIAK TIMOTHY ,  CHANG JEROME ,  STOLTENBERG RANDALL M

    IPC: B22F1/00

    CPC classification number: H01B1/02 ,  H01B1/22 ,  Y10S977/775 ,  Y10S977/777 ,  Y10S977/783

    Abstract: Nanoparticle paste formulations can be configured to maintain a fluid state, promote dispensation, and mitigate crack formation during nanoparticle fusion. Such nanoparticle paste formulations can contain an organic matrix and a plurality of metal nanoparticles dispersed in the organic matrix, where the plurality of metal nanoparticles constitute about 30% to about 90% of the nanoparticle paste formulation by weight. The nanoparticle paste formulations can maintain a fluid state and be dispensable through a micron-size aperture. The organic matrix can contain one or more organic solvents, such as the combination of one or more hydrocarbons, one or more alcohols, one or more amines, and one or more organic acids. Optionally, the nanoparticle paste formulations can contain about 0.01 to about 15 percent by weight micron-scale metal particles or other additives.

    Abstract translation: 纳米颗粒糊配方可配置为保持流体状态，促进分配，并减轻纳米颗粒融合期间的裂纹形成。 这种纳米颗粒糊剂制剂可以含有分散在有机基质中的有机基质和多个金属纳米颗粒，其中多个金属纳米颗粒占重量的纳米粒子糊剂制剂的约30％至约90％。 纳米颗粒糊制剂可以保持流体状态并且通过微米尺寸孔径是可分配的。 有机基质可以含有一种或多种有机溶剂，例如一种或多种烃，一种或多种醇，一种或多种胺和一种或多种有机酸的组合。 任选地，纳米颗粒糊剂制剂可以含有约0.01至约15重量％的微米级金属颗粒或其它添加剂。

    ARTICLES CONTAINING COPPER NANOPARTICLES AND METHODS FOR PRODUCTION AND USE THEREOF
    18.
    发明专利
    ARTICLES CONTAINING COPPER NANOPARTICLES AND METHODS FOR PRODUCTION AND USE THEREOF 未知

    公开(公告)号：SG194113A1

    公开(公告)日：2013-11-29

    申请号：SG2013074729

    申请日：2012-03-04

    Applicant: LOCKHEED CORP

    Inventor： BEDWORTH PETER V ,  ZINN ALFRED A

    Abstract: Articles containing a matrix material and plurality of copper nanoparticles in the matrix material that have been at least partially fused together are described. The copper nanoparticles are less than about 20 nm in size. Copper nanoparticles of this size become fused together at temperatures and pressures that are much lower than that of bulk copper. In general, the fusion temperatures decrease with increasing applied pressure and lowering of the size of the copper nanoparticles. The size of the copper nanoparticles can be varied by adjusting reaction conditions including, for example, surfactant systems, addition rates, and temperatures. Copper nanoparticles that have been at least partially fused together can form a thermally conductive percolation pathway in the matrix material.

    NANOPARTICLE COMPOSITION AND METHODS OF MAKING THE SAME
    20.
    发明专利
    NANOPARTICLE COMPOSITION AND METHODS OF MAKING THE SAME 未知

    公开(公告)号：SG181125A1

    公开(公告)日：2012-07-30

    申请号：SG2012039590

    申请日：2010-06-17

    Applicant: LOCKHEED CORP

    Inventor： ZINN ALFRED A ,  LU PAUL P

    IPC: C01B32/50

    Abstract: A method of fabricating copper nanoparticles includes heating a copper salt solution that includes a copper salt, an N,N'-dialkylethylenediamine, and a C6-C18 alkylamine in an organic solvent to a temperature between about 30°C to about 50°C; heating a reducing agent solution that includes a reducing agent, an N,N'-dialkylethylenediamine, and a C6-C18 alkylamine in an organic solvent to a temperature between about 30°C to about 50°C; and adding the heated copper salt solution to the heated reducing agent solution, thereby producing copper nanoparticles. A composition includes copper nanoparticles, a C6-C18 alkylamine and an N,N'-dialkylethylenediamine ligand. Such copper nanoparticles in this composition have a fusion temperature between about 100°C to about 200°C. A surfactant system for the stabilizing copper nanoparticles includes an N,N'-dialkylethylenediamine and a C6-C18 alkylamine.

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