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    11.
    发明专利
    未知

    公开(公告)号：FR2808919B1

    公开(公告)日：2002-07-19

    申请号：FR0006142

    申请日：2000-05-15

    Applicant: MEMSCAP

    Inventor： CHARRIER CATHERINE ,  BOUCHON ERIC ,  CAMPO ALAIN ,  IMBERT GUY ,  VALENTIN FRANCOIS ,  BASTERES LAURENT

    IPC: B81B3/00 ,  H01G5/16 ,  B81C1/00 ,  H01H1/00 ,  H01H11/00 ,  H01H13/52 ,  H01G7/06

    Abstract: Process for fabricating electronic components, of the variable capacitor or microswitch type, comprising a fixed plate (1) and a deformable membrane (20) which are located opposite each other, which comprises the following steps, consisting in: depositing a first metal layer on an oxide layer (2), said first metal layer being intended to form the fixed plate; depositing a metal ribbon (10, 11) on at least part of the periphery and on each side of the fixed plate (1), said ribbon being intended to serve as a spacer between the fixed plate (1) and the deformable membrane (20); depositing a sacrificial resin layer (15) over at least the area of said fixed plate (1); generating, by lithography, a plurality of wells in the surface of said sacrificial resin layer; depositing, by electrolysis, inside the wells formed in the sacrificial resin (15), at least one metal region intended to form the deformable membrane (20), this metal region extending between sections of the metal ribbon (10, 11) which are located on each side of said fixed plate (1); removing the sacrificial resin layer (15).

    MICROCOMPOSANT ELECTRONIQUE DU TYPE CAPACITE VARIABLE OU MICROSWITCH, OU PROCEDE DE FABRICATION D'UN TEL COMPOSANT
    13.
    发明专利
    MICROCOMPOSANT ELECTRONIQUE DU TYPE CAPACITE VARIABLE OU MICROSWITCH, OU PROCEDE DE FABRICATION D'UN TEL COMPOSANT 未知

    公开(公告)号：CA2348107A1

    公开(公告)日：2001-11-15

    申请号：CA2348107

    申请日：2001-05-15

    Applicant: PLANHEAD SILMAG PHS ,  MEMSCAP

    Inventor： BASTERES LAURENT ,  BOUCHON ERIC ,  CAMPO ALAIN ,  VALENTIN FRANCOIS ,  IMBERT GUY ,  CHARRIER CATHERINE

    IPC: B81C1/00 ,  B81B3/00 ,  H01G5/16 ,  H01H1/00 ,  H01H11/00 ,  H01H13/52 ,  H01L49/00 ,  H01G7/00 ,  H01L47/00

    Abstract: Procédé de fabrication de microcomposants électroniques, du type capaci té variable ou microswitch, comprenant une armature fixe (1) et une membrane (2 0) déformable situées en regard l'une de l'autre, caractérisé en ce qu'il comporte les étapes suivantes, consistant : ~ à déposer une première couche métallique sur une couche d'oxyde (2), ladite première couche métallique étant destinée à former l'armature fixe ; ~ à déposer un ruban métallique (10, 11) sur au moins une partie de la périphérie et de part et d'autre de l'armature fixe (1), ledit ruban étant destiné à servir d'espaceur entre l'armature fixe (1) et la membrane déformable (20) ; ~ à déposer une couche de résine sacrificielle (15) sur au moins la superfic ie de ladite armature fixe (1) ; ~ à générer par lithographie une pluralité de caissons, sur la surface de ladite couche de résine sacrificielle ; ~ à déposer par électrolyse, à l'intérieur des caissons formés sur la résine sacrificielle (15), au moins une zone métallique destinée à former la membrane déformable (20), cette zone métallique s'étendant entre des sections du ruban métallique (10, 11) situées de part et d'autre de ladite armature fixe (1) ; ~ à éliminer la couche de résine sacrificielle (15).

    16.
    发明专利
    未知

    公开(公告)号：FR2790328A1

    公开(公告)日：2000-09-01

    申请号：FR9902658

    申请日：1999-02-26

    Applicant: MEMSCAP

    Inventor： BARTERES LAURENT ,  MHANI AHMED ,  VALENTIN FRANCOIS ,  KARAM JEAN MICHEL

    IPC: H01F27/28 ,  H01F17/00 ,  H01L21/822 ,  H01L23/64 ,  H01L27/04 ,  H01F21/00

    Abstract: An inductive component (1) comprises a quartz substrate (2) and a planar inductor coil of copper strip (3) of specified thickness. A novel inductive component (1) comprises a quartz substrate layer (2) and a planar inductor formed of a spirally wound copper strip (3) of greater than 10 mu m thickness. Independent claims are also included for the following: (i) an integrated transformer comprising a quartz substrate (2) and two planar inductor coils which are wound within one another and which are formed of copper strip (3) of greater than 10 mu m thickness; and (ii) an IC associated with the above inductive component or integrated transformer mounted by means of conductive spacer elements which provide electrical connections between IC connection pads and connection terminals of the inductive component or integrated transformer, the inductive component or integrated transformer being oriented with respect to the IC such that its face including the inductors faces the IC. Preferred Features: The strip is about 30 mu m thick. A polyimide layer is provided between the inductor (3) and the substrate (2) and within the strip segment (8) connecting the coil center (9) to the strip end (10) forming a connection terminal. The strip is coated with a gold layer on its surfaces other than those in contact with the substrate or the polyimide layer and the spaces between the facing surfaces of adjacent windings is free from any material. The strip forms a circular spiral or two parallel series-connected spirals, the spiral nearest the substrate being embedded in a polyimide layer which is covered with a silica barrier layer. Spacer elements, of height close to the strip thickness, are mounted on the connection terminal-forming ends of the strip and have a cylindrical shape with a diameter of about three times their height.

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