METHODS FOR TRANSFERRING SUPERCRITICAL FLUIDS IN MICROELECTRONIC AND OTHER INDUSTRIAL PROCESSES

    公开(公告)号:AU2003299658A1

    公开(公告)日:2004-08-30

    申请号:AU2003299658

    申请日:2003-12-08

    Abstract: A method of displacing a supercritical fluid from a pressure vessel (e.g., in a microelectronic manufacturing process), with the steps of: providing an enclosed pressure vessel containing a first supercritical fluid (said supercritical fluid preferably comprising carbon dioxide); adding a second fluid (typically also a supercritical fluid) to said vessel, with said second fluid being added at a pressure greater than the pressure of the first supercritical fluid, and with said second fluid having a density less than that of the first supercritical fluid; forming an interface between the first supercritical fluid and the second fluid; and displacing at least a portion of the first supercritical fluid from the vessel with the pressure of the second, preferably fluid while maintaining the interface therebetween.

    METHOD OF COATING MICROELECTRONIC SUBSTRATES

    公开(公告)号:AU2003294557A1

    公开(公告)日:2004-08-30

    申请号:AU2003294557

    申请日:2003-12-02

    Abstract: A method of coating a substrate comprises the steps of: (a) providing a substrate in an enclosed vessel, the substrate having a surface portion; (b) at least partially filling the enclosed vessel with a first supercritical fluid so that said first supercritical fluid contacts the surface portion, with the first supercritical fluid carrying or containing a coating component; then (c) adding a separate compressed gas atmosphere to the reaction vessel so that a boundary is formed between the first supercritical fluid and the separate compressed gas atmosphere, said separate compressed gas atmosphere having a density less than said first supercritical fluid; and then (d) displacing said first supercritical fluid from said vessel by continuing adding said separate compressed gas atmosphere to said vessel so that said boundary moves across said surface portion and a thin film of coating component is deposited on said microelectronic substrate.

    DETERGENT INJECTION SYSTEMS FOR CARBON DIOXIDE CLEANING APPARATUS

    公开(公告)号:CA2373309A1

    公开(公告)日:2000-11-23

    申请号:CA2373309

    申请日:2000-05-12

    Abstract: A system for the controlled addition of detergent formulations and the like to a carbon dioxide cleaning apparatus comprises: a high pressure wash vessel (11); an auxiliary vessel (12); a drain line (13) connecting the auxiliary vessel to the wash vessel; optionally but preferably, a separate vent line (14) connecting the auxiliary vessel to the wash vessel; a detergent reservo ir (15); and a detergent supply line (16) connecting the detergent reservoir to the auxiliary vessel. An advantage of this apparatus is that, because the detergent formulation can be pumped into the auxiliary vessel in a predetermined aliquot or amount, which predetermined aliquot or amount can then be transferred into the wash vessel where it combines with the liquid carbon dioxide cleaning solution, the detergent formulation can be added to the cleaning solution in a more controlled or accurate manner.

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