公开(公告)号：CA1213333A

公开(公告)日：1986-10-28

申请号：CA463950

申请日：1984-09-25

Applicant: MOLEX INC

Inventor： BAMFORD WILLIAM C ,  ICHIJO YASUHIRO

IPC: H01R35/04 ,  H01R23/72

Abstract: An electrical connector assembly for establishing electrical contact between a pair of circuit elements has a pair of mating terminals each adapted to form electrical contact with a respective one of the circuit elements. The terminals cooperate to permit the elements to be pivoted one with respect to the other along an axis of rotation, each of the terminals having a generally plate-like contact portion defining a contact surface oriented substantially normally to the axis of the rotation. The contact surfaces are biased together in rotatable electrical interengagement. A multipiece dielectric housing receives said terminals with each supported in a respective housing piece. The housing pieces are joined together for pivotal movement one with respect to the other. The joining means includes a pair of trunnions formed integrally with one of the housing pieces and a yoke formed integrally with the other housing pieces for receiving the trunnions.

公开(公告)号：WO2005119848B1

公开(公告)日：2006-01-26

申请号：PCT/US2005018941

申请日：2005-05-27

Applicant: MOLEX INC

Inventor： NODA ATSUHITO ,  ICHIJO YASUHIRO ,  HOSHIKAWA SHIGEYUKI

IPC: H01R4/02 ,  H01R12/00 ,  H01R13/24 ,  H05K3/30 ,  H05K3/34

CPC classification number: H01R12/714 ,  H01R4/028 ,  H01R12/52 ,  H01R12/57 ,  H01R13/24 ,  H01R13/2414 ,  H05K3/305 ,  H05K3/3436 ,  H05K2201/0133 ,  H05K2201/0311 ,  H05K2201/10242 ,  H05K2201/10257 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2201/10977 ,  H05K2201/2081 ,  Y02P70/613

Abstract: Multiple small conductive and flexible hollow rings (10), each of which is made from a pliable material, provide a flexible connection medium for use between a substrate (8) and a microelectronic device package (4). Each ring is soldered to both the substrate and the device. A portion (20, 22) of the sidewall of each ring is not soldered thus insuring that at least part of the ring stays flexible. The rings accommodate elevation differences on a substrate and electronic device package. They also provide a vibration resistant and flexible joint.

Abstract translation: 由柔韧材料制成的多个小导电和柔性中空环（10）提供用于衬底（8）和微电子器件封装（4）之间的柔性连接介质。 每个环都焊接到基板和设备。 每个环的侧壁的一部分（20,22）不被焊接，从而确保至少一部分环保持柔性。 环可适应基板和电子设备封装上的高程差。 它们还提供抗振动和柔性接头。

公开(公告)号：EP0870348A4

公开(公告)日：1999-12-29

申请号：EP96944480

申请日：1996-12-23

Applicant: MOLEX INC

Inventor： YAGI MASANORI ,  NODA ATSUHITO ,  ICHIJO YASUHIRO ,  HIRATA HIDEYUKI

IPC: H01R13/652 ,  H01R24/00 ,  H01R13/658

CPC classification number: H01R13/658 ,  H01R12/57

Abstract: An electrical connector with enhanced grounding characteristics which reduce the possibility of signal transmission error includes a connector housing (2) formed from an electrically insulative material, a plurality of conductive terminals (3) mounted on the connector housing, the terminals having tail portions (7) which extend out of and away from the connector housing for attachment to a printed circuit board. A conductive grounding plate (4), in the form of a metal shield, is mounted to the exterior of the connector housing. The grounding plate includes at least one grounding terminal (9) integrally formed therewith and extending outwardly therefrom at the level of the connector conductive terminals in a space between two adjoining conductive terminals.

Abstract translation: 一种具有增强的接地特性的电连接器，其降低了信号传输错误的可能性，包括由电绝缘材料形成的连接器壳体（2），安装在连接器壳体上的多个导电端子（3），所述端子具有尾部 ），其延伸出和离开连接器壳体以连接到印刷电路板。 一个金属屏蔽形式的导电接地板（4）安装在连接器外壳的外部。 接地板包括至少一个与其一体形成的接地端子（9），并且在两个相邻导电端子之间的空间中的连接器导电端子的高度处从接地端子向外延伸。